Tdk Corporation

Ko Onodera

Satoshi Kurimoto

Yoji Tozawa

Shirou Ootsuki

Hisayuki Abe

Akira Yoshikawa

Yoshikazu Ito

Seiichi Nakagawa

Takashi Sakurai

Hiroshi Shindo

Masato Sato

Yuui Yokota

Osamu Hirose

Genichi Watanabe

Shinya Yoshihara

Kazushige Tohta

Masahiko Konno

Akihiro Horita

Taketo Sasaki

An oxide material having a langasite-type structure having a desired surface condition and a desired outer shape is obtained stably. By adding at least one selected from the group consisting of Ir, Pt, Au, and Rh to a raw material which is a composition used for producing a desired oxide material as an additive element, it is possible to control the wettability between a die portion at a bottom end of a crucible and a melt of the raw material, thereby implementing stable production of the oxide material while controlling the wetting and spread of the melt of the raw material leaked out through a hole of the crucible.

Langasite-type oxide material, method for producing same, and raw material used in the production method

A chip element in the form of a substantially rectangular parallelepiped having end surfaces and side surfaces is formed (step of forming chip element). An electrically conductive green sheet is formed (step of forming electrically conductive green sheet). An electrically conductive paste is applied to the end surfaces of the chip element (step of application electrically conductive paste). A chip element is formed in which the electrically conductive green sheet is attached to the end surface via the electrically conductive paste applied to the end surface of the chip element (step of attaching electrically conductive sheet). In the step of attaching, the end surface of the electrically conductive green sheet on the side of the side surfaces is positioned on the outside of the side surfaces, and the electrically conductive paste applied to the end surface is pressed out into a space between the electrically conductive green sheet and ridge portions.

Method for manufacturing electronic component

There are provided a ceramic electronic component and a method for producing the ceramic electronic component, where a ground electrode layer can be directly coated with lead-free solder without lowering reliabilities. Terminal electrodeis provided with a ground electrode layerof Cu having been formed by firing, a solder layerformed of a lead-free solder based on five elements of Sn&#x2014;Ag&#x2014;Cu&#x2014;Ni&#x2014;Ge, and a diffusion layerhaving been formed by the diffusion of Ni between the ground electrode layerand the solder layer. Because the diffusion layerof Ni is formed between the ground electrode layerand the solder layer, the diffusion layer, which functions as a barrier layer, suppresses the solder leach of Cu from the ground electrode layer. The diffusion layerof Ni can also suppress the growth of fragile intermetallic compounds of Sn&#x2014;Cu. Therefore, a decrease in the bonding strength between the ground electrode layerand the solder layercan be prevented.

Ceramic electronic component and method for producing same

A method of forming an external electrode of an electronic component involving: a paste preparation step, a removal step, an element preparation step, a contact step, and a formation step. A jig with a groove into which an element forming the electronic component can be inserted is prepared. A conductive paste is filled in the groove, and then removed, so as to leave the conductive paste along a first wall surface of the groove and remove the rest. Then, element immediately above the groove is located, and inserted into the groove and moved toward the first wall surface. Finally, the element is moved along the first wall surface and toward the aperture in a state in which the ridgeline of the element is kept in contact with the first wall surface, and moved away from the first wall surface so as to separate the ridgeline from the first wall surface.

External electrode forming method

An element forming an electronic component has a first face and a second face facing each other, and a third face adjacent to each of the first face and the second face. A method of forming an external electrode of the electronic component involves a pre-formation step, first to third formation steps, and an electrode formation step. The pre-formation step is to apply a conductive paste onto the third face and to evaporate at least a part of a liquid contained in the applied conductive paste, to form a precoat portion expected to become a part of a third electrode portion. The first formation step is to apply the conductive paste from a direction opposite to the first face, onto the first face to form a first electrode portion. The second formation step is to apply the conductive paste from a direction opposite to the second face, onto the second face to form a second electrode portion. The third formation step is to apply the conductive paste onto the third face so as to cover the precoat portion, to form the third electrode portion. The electrode formation step is to dry the element to form the external electrode consisting of the first electrode portion, the second electrode portion, and the third electrode portion. The first electrode portion, the second electrode portion, and the third electrode portion are formed so as to connect with each other.

The invention provides an electrode forming method with steps of arraying chip-style electronic components on an arraying flat bed thereby positioning and aligning the components, lowering a film coated with an adhesive in relative manner together with an adhering top plate parallel to the arraying flat bed thereby adhering ends of the positioned and aligned chip-style electronic components to the adhesive, then lowering the first film to which the chip-style electronic components are adhered in relative manner together with a coating top plate parallel to a coating flat bed provided with a conductive paste layer of a constant thickness thereby pressing the other ends of the chip-style electronic components to the coating flat bed and coating the ends of the electronic components with the conductive paste.

Terminal electrode forming apparatus and system for holding electronic components

The object of the invention is to provide a method of forming an external electrode of an electronic component whereby the external electrode can be formed in a stable fashion. In order to achieve this object, a method of forming an external electrode according to the present invention includes: a step of forming an electrode portionon a side faceof a chipconstituting an electronic component by applying a conductive pastefrom a direction facing this side face; a step of forming an electrode portionon a side faceof the chipfacing the side faceby applying the conductive pastefrom a direction facing this side face; a step of forming an electrode portionso as to connect the electrode portionand electrode portionon the bottom face of the chiprespectively adjacent to the side faceand the side face; and a step of forming an external electrodecomprising the electrode portion, electrode portionand electrode portionby drying this chip

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Tokyo, Japan

Ko Onodera