Industrial Technology Research Institute

Intellectual Property Innovation Corporation

Quanta Display Inc.

Ko-Chin Yang

Yen-Ting Wu

Chen-Tsai Yang

Cheng-Yi Wang

Shi-Chang Chen

Chen-Chu Tsai

Yuh-Zheng Lee

Jui-Chang Chuang

Chia-Hua Lu

A chip package structure includes a chip package layer and at least one conductive structure layer. The chip package layer includes at least one chip and an encapsulant. The chip has an upper surface, and the encapsulant is used to encapsulate the chip and expose the upper surface. The conductive structure layer includes a plurality of first conductive pillars and a plurality of second conductive pillars. The first conductive pillars are disposed on the upper surface, the second conductive pillars are disposed on the upper surface and located between an edge of the upper surface and the first conductive pillars. A density of the second conductive pillars along an extending direction of the edge is greater than or equal to 1.2 times of a density of the first conductive pillars along the extending direction of the edge.

Chip package structure

A separating device includes a separating unit and a crack front line adjusting unit. The separating unit is adapted to separate the flexible film and the substrate. During the process of separating the flexible film from the substrate, a crack front line is formed between a portion of the flexible film not separated from the substrate and a portion of the flexible film separated from the substrate. The crack front line adjusting unit is adapted to sense a relative displacement state of the flexible film and the substrate for determining a distribution of the crack front line, and is adapted to apply a down pressing force to the flexible film or the substrate and increase or decrease the down pressing force according to the relative displacement state, so as to adjust the distribution of the crack front line.

Separating device and separating method

A flexible electronic device includes a first flexible substrate, a first electronic component, a second flexible substrate, a second electronic component and an adhesive layer disposed between the first flexible substrate and the second flexible substrate. The first electronic component is disposed on a first surface of the first flexible substrate. The second electronic component is disposed on a first surface of the second flexible substrate. The first surface of the first flexible substrate has a first FPC bonding area having an orthogonal projection projected on a plane where the second flexible substrate is located does not overlap the second flexible substrate. The first surface of the second flexible substrate has a second FPC bonding area having an orthogonal projection projected on a plane where the first flexible substrate is located does not overlap the first flexible substrate.

Flexible electronic device and method for manufacturing the same

A method of fabricating a thin film transistor array substrate is described. A gate and a scan line electrically connected to the gate are formed on a substrate. A gate insulating layer is formed over the substrate. A patterned channel layer and a patterned ohmic contact layer are formed on the gate insulating layer above the gate. A transparent conductive layer and a metal layer are formed and patterned to define a source/drain region, a data line and a pixel region. A passivation layer exposing the metal layer on the pixel region is formed over the substrate. The metal layer exposed by the passivation layer is removed to expose the transparent conductive layer on the pixel region, using the passivation layer as a photomask, so as to form a pixel electrode. Since the process only needs four photomasks, the process cost can be reduced.

Method of fabricating a thin film transistor array panelsubstrate

Growing community of inventors

Taipei, Taiwan

Ko-Chin Yang