Infineon Technologies Ag

Knut Kahlisch

Henning Mieth

Volker Strutz

Stephan Dobritz

Steffen Kroehnert

Andreas Bischof

Wieland Wahrmund

Steffen Kröhnert

An FBGA semiconductor component has a chip side for receiving a semiconductor chip, a solder ball side for applying solder balls on ball pads, and a bonding channel embodied as an opening between the chip side and the solder ball side and serving for leading through wire bridges between the semiconductor chip and bonding islands on the solder ball side. The bonding channel has side areas extending between the chip side and the solder ball side and can be closed off with a housing part comprising potting composition. Positively locking elements for a potting composition are arranged in that region of the substrate in which the housing part is produced.

Substrate for an FBGA semiconductor component

The inventive method is based on the a idea of releasing a mechanical connection between the semiconductor chip and the supporting substrate during the manufacturing of the packing. The mechanical connection required for producing the electrical contacts between the semiconductor chip and the supporting substrate ensues only temporarily. As a result, a critical interface in the packing is removed thereby resulting in distinctly reducing the thermomechanical stresses.

Method of producing a package for semiconductor chips

Support matrices for semiconductors are often encapsulated in a region of the bonding leads, the so-called bonding channel. The encapsulation is effected using a dispensable material that can flow onto the support matrix and causes contamination there. In order to prevent this flow, the support matrix for integrated semiconductors has a frame, conductor track structures and at least one bonding channel. In the bonding channel bonding leads or wires for connecting the conductor track structures to the integrated semiconductor are disposed. Disposed along the edge of the bonding channel a barrier for preventing the flow of flowable material from the bonding channel onto the frame and/or the conductor track structures. A method for producing such support matrices is likewise disclosed.

Support matrix with bonding channel for integrated semiconductors, and method for producing it

A leadframe of a conductive material includes a central region to accommodate a chip and a plurality of connecting fingers extending at least from one side in the direction of the central region, a contact region being provided adjacent to the central region on at least some of the connecting fingers. The course of the connecting fingers is such that a sectional face in an arbitrary imaginary cross-section at right angles to the main face of the leadframe has leadframe material. In such a case, it is attempted to keep cross-sections in a component without leadframe material as small as possible.

Leadframe of a conductive material and component with a leadframe of a conductive material

The invention relates to a packaging for a semiconductor chip. A frame that directly surrounds the slot is provide on the carrier board on the side of the nubbins. Said frame is provided with the same height as the nubbins and the slot and the frame surrounding said slot are at least partially filled with a casting compound which is preferably adapted to the thermal expansion coefficients of the semiconductor chip.

Package for a semiconductor chip

Support matrices for semiconductors are often disposed with spacers on the semiconductor chip. The spacers are composed of silicone that flows into the region of the bonding leads and prevents reliable electrical connection of the bonding leads to the semiconductor chip. In order to prevent the flow, the support matrix for integrated semiconductors has a frame, conductor track structures and at least one bonding lead for connecting the conductor track structures to the integrated semiconductor. The bonding lead has, between a bonding region and the conductor track structures, at least one barrier for preventing the flow of flowable material onto the bonding region. A method for producing such support matrices is likewise described.

Growing community of inventors

Dresden, Germany

Knut Kahlisch