Degussa Aktiengesellschaft

General Electric Company

Umicore Ag & Co Kg

Klaus Zimmermann

Wolfgang Weber

Hans-Hermann Beyer

Ralf Karch

Matthias Grehl

Roland Gerner

Manfred Koschlig

Rolf Haselhorst

Robert Hartmann

Oswald Kinz

The invention relates to the provision of noble metal-containing mixtures for a process for processing them by heating the mixture, preferably for processing them by means of an ashing process. This provision is characterized by the following measures: (a) moistening of the noble metal-containing mixture to be processed, (b) introduction of the moistened noble metal-containing mixture into at least one container which serves as diffusion barrier for water, and (c) introduction of the loaded container into a heat-resistant chamber together with at least one upper refractory mat. The noble metal-containing mixture is preferably moistened in the presence of a porous material and the chamber is closed by means of a heat-resistant covering. The invention further provides a processing process comprising the provision of noble metal-containing mixtures and also the heat-resistant chamber loaded with noble metal-containing mixtures itself. The process of the invention enables simple, clean recovery of noble metals in high yield from noble metal-containing mixtures.

Process for providing noble metal-containing mixtures for recovering noble metals

The invention relates to cross-linkable mixtures and a method for the production and utilization thereof.

Cross-linkable mixtures and a method for the production and utilization thereof

Hard and scratch-proof objects of platinum and palladium or their alloys comprise a boron-containing surface layer which is 20 to 500 .mu.m thick and contains 0.3 to 1.5% by weight boron embedded in the metal lattice.

Surface-hardened objects of alloys of platinum and palladium and method

A solder suspension is disclosed of solder powder, organic binder, organic solvent, and, if necessary, flux, with which it is possible to apply solder layers without cracks and pores to substrates by means of immersion or spraying. The solder powder must have a particle size of 5 to 50 .mu.m, where 55 to 70% of the particles are smaller than the particle size at the maximum on the particle size distribution curve. In addition, the ratio between the average particle size of the solder powder and the density of the solder powder must be between 0.1 and 20.

Solder suspension for the application of thin layers of solder to

Wear-resistant hard material layers are prepared on a metal support by applying onto said support a mixture of hard material particles, solder particles and organic binding agents and thereafter soldering the layer by heating. The mixture thus obtained can be applied by means of immersing, screen printing, brushing, spraying or spreading. The stable suspension required for the above steps is prepared by homogeneously grinding the particles together to a particle size from 1 to 20 .mu.m and adding an organic solvent to the binding agent.

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Alzenau, Germany

Klaus Zimmermann