Basf Lacke+farben Ag

Basf Aktiengesellschaft

Elantas Gmbh

Altana Electrical Insulation Gmbh

Klaus Wilhelm Lienert

Rainer Blum

Hans J Heller

Hans-Joachim Haehnle

Gerold Schmidt

Michael Schink

Hans Schupp

Helmut Lehmann

Roland Peter

Peter Hoessel

Paola Gherardi

Marco Busi

Silvia Hentschel

Nataly Colombi

Sascha Tödter König

Alberto Pederzani

Joachim Runge

Compositions comprising at least one epoxy resin and/or reactive diluents, at least one hardener for the at least one epoxy resin, at least one curing indicator, wherein the color of the composition changes depending on the curing degree, a process for determining sufficient cure of a composition comprising providing a composition comprising at least one epoxy resin and a hardener for the epoxy resin, adding a curing indicator, applying curing conditions to the colored composition until the composition changes its color and use of polymeric colorants as curing degree indicator, wherein the curing indicator is a polymeric colorant consisting of chromophores which are chemically bound to polymers having reactive groups.

Epoxy resin curing indicator composition

The present invention relates to a polyamideimide resin solution preparable by reacting (a) aromatic polycarboxylic acids and/or their anhydrides with (b) aromatic imide- and amide-forming components in cresol at temperatures above 170&#xb0; C., to the use of this polyamideimide solution for the preparation of wire enamels, to the wire enamels in question, and to the enamelled wires coated therewith.

Polyamide-imide resin solution and the use thereof for producing wire enamels

Solderable wire-coating compositions and process for the continuous

Wire coatings and processes for their preparation

In solutions of polyimide-forming starting materials, containing diamines and tetracarboxylic diesters, at least 2 mol % of the ester groups in the tetracarboxylic diesters are derived from alcohols of the general formula

Solutions of polyimide-forming starting materials

Use of a mixture of from 5 to 95% by weight of an azidosilane of the formula

Adhesion promoter

Solutions of polyimide-forming starting materials are provided containing diamines and tetracarboxylic diesters; the tetracarboxylic diesters comprise a mixture of from 0.05 to 0.95 mol % of oxydiphthalic diesters and from 0.05 to 0.95 mol % of benzophenonetetracarboxylic diesters, biphenyltetracarboxylic diesters or mixtures thereof.

Solutions of polycondensates which have N-containing heterocyclic ring systems as structural units, or solutions of intermediates of these polycondensates, in inorganic solvents, contain from 0.1 to 20% by weight, based on the polycondensates or the intermediates thereof, of one or more azidosilanes of the general formula

Solutions of polycondensates which have N-containing heterocyclic ring

Self-bonding enamel solution for heat-resistant coatings

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Hamburg, Germany

Klaus Wilhelm Lienert