Balzers Aktiengesellschaft

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Unaxis-balzers Aktiengesellschaft

Balzers Aktiengsellschaft

Klaus Wellerdieck

Walter Haag

Helmut Rudigier

Hans Signer

Eduard Kugler

Urs Wegmann

Eduard Kügler

Eduard K{umlaut Over (u)}gler

Karl Hoefler

A method of manufacturing an object in a vacuum treatment apparatus having a vacuum recipient for containing an atmosphere, includes the steps of supporting a substrate on a work piece carrier arrangement in the recipient and treating the substrate to manufacture the object in the vacuum recipient. The treating process includes generating electrical charge carriers in the atmosphere and in the recipient which are of the type that form electrically insulating material and providing at least two electroconductive surfaces in the recipient. Power, such as a DC signal, is supplied to at least one of the electroconductive surfaces so that at least one of the electroconductive surfaces receives the electrically insulating material for covering at least part of that electroconductive surface. This causes electrical isolation of that electroconductive surface which leads to arcing and damage to the object. A control signal is applied to the electroconductive surfaces during repeating and alternating first time spans and second time spans, for prevent arcing at the part of the electroconductive surfaces which is, or is becoming electrically isolated from the atmosphere by being covered by the electrical charge carriers.

Method of manufacturing an object in a vacuum recipient

A problem which occurs in the sputtering of a substance by means of a high-frequency discharge between two electrodes, is that both electrode surfaces are sputtered away when the electrode surface that is actually not to be sputtered is not at least ten times as large as the surface of the electrode carrying the substance. To prevent an undesirable cosputtering, in on embodiment, a vacuum recipient at a selected gas pressure has first and a second electrodes which are selected so that their surface areas form a ratio R,such that 0.3&lE;R,&lE;3. A discharge space in the vacuum recipient is confined to the electrode surfaces. An RF plasma discharge is generated in the discharge space by applying an electric RF field between the electrode surface, so that a first dark space region with a first drop of time-averaged electric potential and a second dark space region with a second drop of time-averaged electric potential, are respectively provided adjacent each electrode. The surface of an object to be coated is disposed in the second dark space region adjacent said larger electrode surface so that the surface of the object is at a floating electric potential to perform diode sputtering. A magnetic field is generated within the discharge space, a large part of its lines of force being tunnel-like shaped on the first electrode surface and extending across aid first dark space region to enhance sputtering of the surface of the object.

Process and apparatus for sputter etching or sputter coating

A vacuum treatment apparatus (FIG. 13) includes a vacuum recipient or chamber (3) for containing an atmosphere. A mechanism (50,52) for generating electrical charge carriers in the atmosphere is provided in the recipient, the electrical charge carriers being of the type that form electrically isolating material. The recipient also contains a work piece carrier arrangement (1) and at least two electroconductive surfaces (2a, 2b) which are mutually electrically isolated from each other. A DC power supply (8) is operationally connected to the electroconductive surfaces by respective electrical conductors with an inductor (L.sub.66) in one of the conductors. A parallel switching arrangement is connected between the electrical conductors to control a current path between the conductors.

Vacuum treatment apparatus

A vacuum treatment apparatus eliminate arcing in a vacuum recipient for containing an atmosphere and having a mechanism for generating electrical charge carriers in the atmosphere. A workpiece carrier arrangement and at least two electro-conductive surfaces are in the recipient and a generator unit having an output is connected to the electro-conductive surfaces. The generator includes a DC generator with an output, and a controlled adjusting unit with an input connected to the output of the DC generator. The controlled adjusting unit generates a first output signal in dependency on an output signal of the DC generator during first timespans, and a second output signal during second timespans. The unit may also have a time-controlled discharge or charge current loop connected from one of the electro-conductive surfaces to the other, with a higher ohmic resistance during the first timespans and a lower ohmic resistance during the second timespans.

Method of controlling a treatment process and vacuum treatment apparatus

An etching or coating plant has a vacuum recipient and a pair of electrodes located at a distance from each other and adapted to produce a capacitive plasma discharge in the recipient. The wall structure encasing the recipient is divided into two parts which are insulated from each other and which both serve for the electric signal transmission to their surfaces located at the inside and acting as electrode surfaces whereby by means of the division of the wall structure of the recipient it will be controlled which of the electrodes is eroded and which one is coated, respectively. Disclosed is further a method of igniting plasma discharges and the intermittent operation thereof.

Etching or coating method and a plant therefor

To supply high-frequency energy to a workpiece support (5) which rotates in a vacuum chamber (3), a cylindrical electrode (19) is coaxially provided on a bearing shaft (7) and the energy is coupled in capacitively, via the rotary capacitor formed by the electrode (19) and the shaft (7).

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Buchs, Switzerland

Klaus Wellerdieck