Elantas Gmbh

Byk-chemie Gmbh

Altana Electrical Insulation Gmbh

Klaus-W Lienert

Marc Eberhardt

Gerold Schmidt

Hans-Ulrich Moritz

Sascha Tödter-König

Peter Walter Stannek

Simon Rost

Christian Dams

Majdi Al-Masri

Wenxue Guo

Changshun Zhou

Lixin Ye

Ding Wang

Michael Alfred Koska

Gerard Hubertus Louis Reestman

Joerg Hinnerwisch

Stefan Hartkopp

Sascha Toedter-Koenig

Ronnie Halfar

The present invention relates to a solvent-free wire enamel composition containing extrudable, polyesterimide-containing binders, prepared from polyols, polycarboxylic acids, imide-forming components, and structural elements which are crosslinkable after extrusion.

Solvent-free wire enamel composition

Fiber-matrix material curable thermally by radical polymerization, comprising (A) a polymeric matrix curable thermally by radical polymerization, (B) at least one kind of reinforcing fibers and (C) at least one particulate initiator of the radical polymerization, having an average particle size of 5 nm to 500 &#x3bc;m, as measured by static light scattering, and selected from the group consisting of benzpinacol and substituted benzpinacols; processes for producing it, and its use for producing fiber-reinforced thermoset moldings.

Low-emission fibre-matrix material curable thermally by radical polymerization

Described is a polyurethane wire enamel composed of at least one blocked polyisocyanate adduct, blocked with alkylphenols, at least one hydroxy polyester comprising ester and/or imide and/or amide groups, at least one hydrocarbon-based organic solvent, and further auxiliaries and additives.

Eco-friendly solderable wire enamel

Growing community of inventors

Hamburg, Germany

Klaus-W Lienert