Infineon Technologies Ag

Klaus Standner

Heinz Mattes

Oliver Frank

Ralf Arnold

Karl Dominizi

Stefan Zielke

A probe card for a wafer tester includes a mother card having a reinforcing element and at least one daughter card which is rigidly connected to the reinforcing element detachably. The mother card includes electrical contacts for producing an electrical connection with the wafer tester. The at least one daughter card includes electrical contact elements for making contact with an electrical circuit on a wafer. In addition, the mother card and the at least one daughter card are electrically detachably connected to one another via an electrical interface.

Probe card and method for producing a probe card

A test apparatus includes a signal source that generates a radio-frequency test signal and is connected to the input connection of an arrangement. The arrangement simultaneously supplies an electrical radio-frequency signal to a plurality of receivers and via a plurality of distribution lines. Each distribution line includes an end with an output connection that applies the power-matched test signal to a respective external component.

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Villach, Austria

Klaus Standner