Sico Jena Gmbh Quarzschmelze

Klaus Sivec

Peter Jochmann

Edith Zimmermann

Walter Nadrag

Hans-Juergen Flieger

Bernhart Sindzinski

Werner Schmid

Karl-Heinz Schiecke

Dirk Schulze

A process for producing composite bodies from a plurality of molded pieces made from quartz materials of different or identical structure, preferably fused quartz and/or fused silica. Also, composite bodies produced according to this process. A prismatic molded piece with a rectangular bottom surface and top surface and four plate-shaped molded pieces whose dimensions are tailored to the outer surfaces of the prismatic molded piece are produced in a first step, the plate-shaped molded pieces are then fixed to the outer surfaces of the prismatic molded piece, the prismatic molded piece and the plate-shaped molded pieces are heated together under protective gas to a predetermined temperature T above the softening temperature of the quartz material and then cooled, resulting in a prismatic composite body which is joined thermally in a material engagement and which can be severed to form a series of plate-shaped composite bodies.

Process for producing composite bodies from quartz material

A process for the production of a device is disclosed which is suitable for holding semiconductor disks (wafers) during diverse, preferably thermal, machining processes and for transporting semiconductor disks between different machining stations and which is formed of a plurality of individually pre-manufactured device parts that are assembled and connected with one another. The invention is further directed to a holding device for semiconductor disks which is manufactured by the production process according to the invention. In a process of the type described above, the device parts are first pre-manufactured separately and independent from one another from single-crystal or polycrystalline silicon and, in so doing, are provided with fitting surfaces which correspond to one another. The adjacent device parts with opposite fitting surfaces are then joined one inside or against the other and the fitting surfaces are connected with one another by diffusion welding and/or by soldering, wherein germanium powder is used as solder.

Process for the production of a holding device for semiconductor disks and holding device produced by this process

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Villach, Austria

Klaus Sivec