Other

Goetze Payen Gmbh

Federal-Mogul Sealing Systems Gmbh

Klaus Schmitt

Klaus L&ouml;nne

Klaus-Peter Majewski

Wolfgang Weber

Harald Krappitz

J&uuml;rgen Koch

Ralf Flemming

Manfred Koschlig

Matthias Heike

Markus Heilig

Burkhard Schneider

Jürgen Stetter

Klaus Weckbecker

A process for producing, on a metallic substrate, a geometric metal structure having a precise contour, including the steps of: solder coating a solder paste onto the substrate by screen printing to create the geometric metal structure, the solder paste comprising an organic binder system, and 80 to 95 weight % of a mixture of a nickel-based solder and a pulverulent alloy of nickel with at least one member selected from the group consisting of chromium, molybdenum, tungsten, manganese and iron, provided as a higher-melting metallic filler, wherein a weight ratio of solder to filler is 2-6:1, an average grain size of the solder is between 10 and 50 &mgr;m, and a grain size ratio of solder to filler, relative to the average grain size is from 0.5-2.5:1; drying the structure; decomposing the organic binder system present in the solder paste, without leaving a reside, by a heat treatment; and raising the temperature until the resulting solder material liquifies.

Soldering paste for producing geometrical metal structures with precise contours

A flat metal sealing gasket is made as follows: on an unhardened spring steel plate having an aperture and a bead surrounding the aperture, a sinterable powder is deposited along the bead in a desired shape and thickness. Thereafter a sufficiently high temperature is applied to the deposited sinterable powder to effect sintering or melting of the powder to provide a pressure-resistant overlay on the plate and to simultaneously effect a hardening of the plate.

Method of providing a wear-resistant overlay on a metal sealing gasket

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Grünebach, Germany

Klaus Schmitt