Vistec Semiconductor Systems Gmbh

Leica Microsystems Wetzlar Gmbh

Leica Microsystems Semiconductor Gmbh

Vistec Semiconductor System Gmbh

Klaus Rinn

Michael Heiden

Andreas Schaaf

Ulrich Kaczynski

Wolfgang Fricke

Joachim Wienecke

Frank Laske

Lambert Danner

Hans-Artur Boesser

Carola Blaesing-Bangert

Slawomir Czerkas

Andre Schepp

Mathias Beck

A method for determining the positions of structures () on a mask () is disclosed. The method is implemented in a metrology tool () comprising a measurement table () which is movable in X-coordinate direction and Y-coordinate direction. A first intensity profile (I) is recorded along a first measurement direction (MR), which is parallel to the X-coordinate direction. A second intensity profile (I) is recorded along a second measurement direction (MR), which is parallel to the Y-coordinate direction. A two-dimensional position of a centre of gravity (S) with respect to the coordinate system of the metrology tool () is determined from the first intensity profile (I) and the second intensity profile (I).

Method for determining positions of structures on a mask

A coordinate measuring machine is disclosed having an orientor automatically orienting a substrate associated therewith. A control and computing unit is further associated with the coordinate measuring machine, so that self-calibration may be performed on the basis of at least two different and automatically set orientations of the substrate.

Coordinate measuring machine and method for calibrating the coordinate measuring machine

A method for reproducibly determining object characteristics is disclosed. Herein an object is imaged onto a detector by means of an imaging optics and detected thereon. A correction function k is applied to a brightness measuring result N originally detected by a detector in such a way, that a corrected brightness measuring result N' is proportional to a brightness I impinging on the detector.

Method for reproducibly determining geometrical and/or optical object characteristics

A coordinate measuring machine () including a plane () in which there is arranged a movable measurement table () moving the mask () correspondingly in the plane (), at least one objective () and a detector (), an incident light source () arranged to provide incident light and/or a transmitted light source () arranged to provide transmitted light, wherein the mask () has at least a first area () and a second area (), wherein the first area () and the second area () comprise different materials differing in their transmission or reflection properties.

Device and method for determining an optical property of a mask

A method is disclosed which is suitable for the calibration of a measuring table () of a coordinate measuring machine (). For this purpose, a mask () is deposited in a three-point support of the measuring table (), wherein the mask () used for the calibration of the measuring table () is a mask (), which is used for the semiconductor production. The measurement of positions of a plurality of different structures () which are arranged in a distributed manner on the mask () is carried out. The structures () are available in an initial orientation on the mask (). The mask () is rotated and the position of the structures () is determined in the rotated orientation. Afterwards, the mask () is shifted and the position of the structures () is also determined. A total correction function for eliminating coordinate-dependant measuring errors is determined, wherein the total correction function has a first correction function and a second correction function.

Method for calibration of a measuring table of a coordinate measuring machine

A method is disclosed for eliminating sources of error in the system correction of a coordinate measuring machine. Herein, a number j of reference structureson a rigid reference objectare measured in a starting orientation k=0, and the starting coordinates and the reference coordinates of the reference structureson the reference objectare determined in a number k&#x2267;3 of mutually different orientations.

Method for eliminating sources of error in the system correction of a coordinate measuring machine

A method for correcting an error of the imaging system of a coordinate measuring machine is disclosed. The position of at least two different edges of at least one structure on a substrate is measured. The substrate may be automatically rotated into another orientation. Then the position of the at least two different edges of the at least one structure is measured on the rotated substrate. Based on the measurement data, a systematic error of the imaging system is eliminated.

Method for correcting an error of the imaging system of a coordinate measuring machine

A method for improving the reproducibility of a coordinate measuring machine and its accuracy is disclosed. Using at least one measuring field of a camera, a plurality of images of at least one structure on the substrate are recorded. The substrate is placed on a measuring stage traversable in the X coordinate direction and the Y coordinate direction, the position of which is determined during imaging using a displacement measuring system. The measuring field is displaced by the amount of the deviation determined.

Method for improving the reproducibility of a coordinate measuring apparatus and its accuracy

A method for the high-precision measurement of coordinates on a substrate is disclosed. The substrate is placed on a stage moveable in X/Y coordinate directions. First, a plurality of images of a structure on a substrate are imaged by means of a 2-dimensional detector during the relative movement of a measuring objective in Z coordinate direction and the simultaneous movement of the stage in X and Y coordinate directions.

Method for enhancing the measuring accuracy when determining the coordinates of structures on a substrate

A measuring instrument for optical inspection of an object includes a light source for illuminating an object; a detector; an illuminating beam path extending from the light source to the object; a detection beam path extending from the object to the detector; an illuminating optics disposed in the illuminating beam path and/or an imaging optics disposed in the detection beam path for imaging the object onto the detector; a position evaluation device for determining a distance between two points of the object; and an optical device for imposing a profile of a continuously monotonic function on an intensity of light from the light source. The optical device is disposed in at least one of a pupil plane of the imaging optics, a pupil plane of the illuminating optics, and a plane in the illuminating or imaging beam path conjugate with the pupil plane of the imaging optics or the pupil plane of the illuminating optics.

Measuring instrument and method for operating a measuring instrument for optical inspection of an object

The present invention concerns a method and a microscope for detection of a specimen, having a light source that illuminates the specimen and an imaging system that images the specimen onto a detector. For purposes of an increase in the effective resolution capability of the imaging system that goes beyond the limit of the resolution capability defined by the properties of the imaging system, the method and the microscope according to the present invention for detection of a specimen are characterized in that the specimen is detected repeatedly with a different resolution of the imaging system in each case; and that in order to determine an optimized resolution capability, the detected image data are conveyed to a statistical and/or numerical analysis operation.

Method and microscope for detection of a specimen

A method and a measuring instrument for determining the position of an edge to be measured on a pattern on a substrate are described. A complete, nonlinear model intensity profile, which identifies the edge to be measured, of a model edge is ascertained and stored, and a desired edge position xis defined therein with subpixel accuracy. A camera image of the substrate having the edge to be measured is acquired, and a one-dimensional measured intensity profile of the edge to be measured is determined therefrom. The model intensity profile is identified in the measured intensity profile with an indication of its location xrelative to a reference point. The desired position p of the edge to be measured is determined with subpixel accuracy as p=x+x.

Method and measuring instrument for determining the position of an edge of a pattern element on a substrate

The present invention relates to a method and a measurement apparatus for detection of a specimen ( ), a specimen ( ) being illuminated with a light source ( ) and imaged with the aid of an imaging optical system ( ) onto a detector ( ) preferably embodied as a CCD camera, and the specimen ( ) being detected repeatedly with the detector ( ). With the method and the measurement apparatus according to the present invention, fluctuations in the statistical analysis of detected signals or data can be minimized, the detected signals or data being subject to detection-related error sources. The method and the measurement apparatus according to the present invention are characterized in that the detection time of the detector ( ) for the individual detections and/or the intensity of the light serving for specimen illumination are varied.

Method and measuring arrangement for detecting an object

The present invention concerns an interferometric measurement apparatus for wavelength calibration, having a laser light source ( ), a detector ( ), and an interferometer ( ), the laser light source ( ) emitting light of at least one wavelength, the interferometer ( ) separating the light of the laser light source ( ) into two sub-beams ( )&mdash;a reference beam ( ) and a measurement beam ( )&mdash;and combining the sub-beams ( ) again after at least one reflection at one reflection means ( ) each, and the path length difference between the reference beam ( ) and measurement beam ( ) defining a constant wavelength calibration distance. In order to increase the measurement accuracy and reduce measurement errors, the measurement beam distance can be extended, but without causing problems in terms of manufacture, assembly, and/or alignment. The interferometric measurement apparatus according to the present invention is characterized in that at least one additional reflection means ( ), which reflects the measurement beam ( ) at least largely in the opposite direction, is provided in the beam path of the measurement beam ( ).

Interferometric measurement apparatus for wavelength calibration

A measuring instrument ( ) and a method for measuring features ( ) on a substrate ( ) are described. The measuring instrument ( ) has a support element ( ) that is provided opposite the substrate ( ). Mounted on the support element ( ) is a nonoptical measurement device ( ) with which a measurement of the features ( ) of the substrate ( ) is performed under ambient air pressure. The nonoptical measurement device ( ) can be configured, for example, as an AFM ( ) or an electron beam lens ( ). Furthermore, in addition to the nonoptical measurement device ( ), an optical lens ( ) can be provided that is used for rapid location and determination of the coarse position of features ( ) on the substrate ( ).

Growing community of inventors

Heuchelheim, Germany

Klaus Rinn