Danfoss Silicon Power Gmbh

Klaus Olesen

Ole Mühlfeld

Henning Ströbel-Maier

Martin Becker

Holger Ulrich

Matthias Beck

A power module () including a rigid insulated substrate () mounted on a baseplate () is disclosed. An additional circuit carrier () is mounted on the baseplate () adjacent to the rigid insulated substrate (). The additional circuit carrier () has a rigidity which is less than that of the rigid insulated substrate ().

Power module

A cooling system () comprising a cooling arrangement () having a serpentine passageway () for a circulating fluid coolant is disclosed. The serpentine passageway () is provided between a plurality of walls () displaced from each other. A series of baffles () each having a proximal portion () and a distal portion () are disposed within the passageway (). The baffles () extend from one of the walls into the passageway (). The distal portion () has a width (W) that is larger than the width (W) of the proximal portion ().

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Nordborg, Denmark

Klaus Olesen