Osram Opto Semiconductors Gmbh

Osram Oled Gmbh

Henkel Ag & Company, Kgaa

Heraeus Deutschland Gmbh & Co Kg

Alpha Metals, Inc.

Klaus Müller

Siegfried Herrmann

Herbert Brunner

Stefan Grötsch

Richard Baisl

Klaus Wilke

Mathias Wendt

Gudrun Lindberg

Ewald Karl Michael Günther

Holger Klassen

Günter Spath

Klaus Wittke

Gunnar Petzold

Klaus Heinrich Georg Bartl

Werner Kruppa

Mathias Nowottnick

Matthias Hofmann

Laurent Tomasini

Hans-Jürgen Albrecht

Hector Andrew Hamilton Steen

In an embodiment a method for producing a semiconductor component comprising at least one semiconductor chip mounted on a surface, wherein the semiconductor chip is fixed on the surface by applying a solder compound to an assembling surface of the semiconductor chip, applying a metallic adhesive layer to a side of the solder compound facing away from the assembling surface, preheating the surface to a first temperature T, bringing the metallic adhesive layer into mechanical contact in a solid state with the preheated surface, the metallic adhesive layer at least partially melting while it is brought into mechanical contact with the preheated surface, and subsequently cooling the surface to room temperature, the semiconductor chip being at least partially metallurgically bonded to the surface, and wherein the semiconductor chip is subsequently soldered to the surface to form a resulting solder connection.

Method for temporarily fastening a semiconductor chip to a surface, method for producing a semiconductor component and semiconductor component

A method of attaching a semiconductor chip to a lead frame, including A) providing a semiconductor chip, B) applying a solder metal layer sequence on the semiconductor chip, C) providing a lead frame, D) applying a metallization layer sequence on the lead frame, E) applying the semiconductor chip on the lead frame via the solder metal layer sequence and the metallization layer sequence, and F) heating the arrangement produced under E) to attach the semiconductor chip to the lead frame, wherein the solder metal layer sequence includes a first metallic layer including an indium-tin alloy, a barrier layer arranged above the first metallic layer, and a second metallic layer including gold arranged between the barrier layer and the semiconductor chip.

Method of fastening a semiconductor chip on a lead frame, and electronic component

An optoelectronic component having an outer surface facing the environment of the optoelectronic component and which is formed by a hydrophobic layer applied at least partly on a surface of the optoelectronic component.

Optoelectronic component

The invention relates to an optoelectronic component, having &#x2014;a carrier () comprising a first main surface (Ia), &#x2014;at least one optoelectronic semiconductor chip () having no substrate, and &#x2014;a contact metallization (), wherein &#x2014;the carrier () is electrically insulating, &#x2014;the at least one optoelectronic semiconductor chip () is fastened to the first main surface (Ia) of the carrier () by means of a bonding material (), particularly a solder material, &#x2014;the contact metallization () covers at least one area of the first main surface (Ia) free of the optoelectronic semiconductor chip (), and &#x2014;the contact metallization () is electrically conductively connected to the optoelectronic semiconductor chip ().

A method for producing luminous means proposes providing a carrier serving as a heat sink, said carrier comprising a planar chip mounting region. The planar chip mounting region is structured for the purpose of producing a first partial region and at least one second partial region. In this case, the first partial region has a solder-repellent property after structuring. Afterward, a solder is applied to the planar chip mounting region, such that said solder wets the at least one second partial region. At least one optoelectronic body is fixed into the at least one second partial region with the solder at the carrier. Finally, contact-connections are formed for the purpose of feeding electrical energy to the optoelectronic luminous body.

Method for producing lamps

Growing community of inventors

Pettendorf, Germany

Klaus Müller