Danfoss Silicon Power Gmbh

Klaus Kristen Olesen

Ronald Eisele

Lars Paulsen

Frank Osterwald

Holger Beer

Ole Mühlfeld

Henning Ströbel-Maier

Steen Lauridsen

Georg Wecker

Franke Wulf-Toke

Reiner Hinken

Jens Klinghagen

Christopher Klaehr

An electric device, comprising: a power module having a circuit carrier on which a circuit component is disposed; a cooling structure; and an intermediate structure disposed between the circuit carrier and the cooling structure, wherein the cooling structure is made of a first metal material, and the intermediate structure is made of a second metal material having a higher thermal conductivity than that of the first metal material.

Power module with integrated cooling device

The invention relates to an electronic power system () comprising at least one electronic power module (). The electronic power module () comprises a base plate () and at least one heat generating component arranged on a first side of the base plate (). The electronic power module () comprises a cooling structure () transporting heat away from the electronic power module () via a coolant that is guided by the cooling structure (). The cooling structure () is arranged on a second side () of the base plate () opposite to the first side. Task of the invention is to provide an electronic power system () with an improved cooling. According to the present invention this task is solved in that the cooling structure () is integrally formed with the base plate ().

Electronic power system and method for manufacturing the same

The present invention discloses a cooling trough comprising an unflat surface, surrounding an opening of the cooling trough, configured with a height essentially decreasing inwardly. At least one supporting line, running around the opening of the cooling trough, is formed on the unflat surface. The at least one supporting line contacts a baseplate of a power module after the baseplate is attached to the unflat surface of the cooling trough. In addition, the present invention also discloses a cooler comprising the cooling trough and a power module assembly comprising the cooler.

Cooling trough, cooler and power module assembly

The invention provides a fluid cooling system comprising a heat exchanger with an outer wall forming a chamber with an inlet and an outlet for circulating a heat exchange medium in the chamber. The chamber has an opening towards the component which is to be cooled, and to protect the component, the opening is closed by a flexible wall which is attached to the outer wall. To protect the cover and the component against overload, the flexible wall is attached to an inner wall inside the chamber. The cooling system could be applied to electronic systems, e.g. for cooling a DCB substrate or similar electronic components.

Fluid cooling system

The invention relates to a cooling device for a plurality of power modules (), comprising a heat-conducting body () through which a coolant flows. The cooling device comprises external cooling ribs () on a first housing shell of the body through which a coolant flows for receiving the plurality of power modules adjacent to each other. Each individual cooling rib is aligned to come into fixed heat-conducting contact on at least one upper or lower side of one of the plurality of power modules, and the housing shell, on the inner side in the region of the respective cooling rib(s), comprises means for the fluidic communication with the volume of the coolant in the inside the body through which the coolant flows.

Cooling device for a plurality of power modules

A distributor () for distributing a flow of cooling fluid over one or more surface(s) () to be cooled has a housing () that may be manufactured in a single piece together with inlet () and outlet () manifolds and a plurality of flow cells (). The flow cells () may be connected in parallel between the manifolds (), and may be adapted to cool multiple surfaces () simultaneously. The present invention is also directed to a fluid-coolable unit comprising a distributor () for removing heat from an electronic circuit, such as integrated circuit or CPU.

Flow distributing unit and cooling unit

A flow distribution module () for distributing a flow of cooling fluid across a surface. Is adapted to be connected to another at least substantially identical module (). Makes it possible to provide a cooling unit which may be customized to meet specific cooling needs without requiring special adaptation of the 'building blocks'. Thereby provides a flexible, yet simple, system. Furthermore a stack of flow distribution modules (). Provides a very compact cooling unit when cooling is needed for several surfaces, no need for a cooling unit having a large surface area because the modules may be stacked in stead of positioned side-by-side.

Flow distribution module and a stack of flow distribution modules

The invention relates to a power semiconductor module comprising a plurality of power semiconductors that are fixed to a first side of a printed circuit board (), and a cooling device that acts by means of a coolant, on a second side of the printed circuit board (), opposite the first side, the cooling device comprising a plurality of cells through which the coolant is guided. The aim of the invention is to minimise the risk of failure of one such power semiconductor module. To this end, a non-cooled region (d, e, f) is arranged between at least two cells.

Power semiconductor module and method for cooling a power semiconductor module

A cooling unit for cooling in particular power semiconductors contains a distributor for guiding liquid across a surface to be cooled. The distributor comprises an inlet manifold () and outlet manifold (), whereby the inlet and outlet manifolds are connected through a flow cell, which has a main flow channel (). The main channel is formed as a meandering sequence of channel segments (). It has been found, that the transfer of heat by the liquid in the main flow channel can be improved by introducing a bypass flow channel () which allows the flow of liquid from the cell inlet to the cell outlet, wherein the bypass flow channel interconnects the channel segments of the main flow channel.

Flow distributing unit and cooling unit having bypass flow

A liquid-cooled power semiconductor unit has components to be cooled arranged on the upper side of a plate. The bottom side of the plate is cooled by liquid, which is guided along the plate by means of a distributing element, and the liquid inlet and the liquid outlet of the distributing element are preferably arranged perpendicular to the plate. The distributing element is divided into cells, where each cell has a liquid inlet and a liquid outlet perpendicular to the cooled plate, and the distributing element has multiple cells along the plate.

Cooling unit and flow distributing element for use in such unit

A cooling device comprising a heat-conducting cooling plate on the side of the electronic power components to be cooled and a platelike cooling fluid distributing device. The distributing device has cooling fluid outlets on the side facing the cooling plate, said outlets being arranged at a distance from and pointing towards the cooling plate. The distributing device also comprises at least one drain outlet for the cooling fluid. The cooling device comprises a first plate in which outlets and a plurality of drain outlets are evenly distributed and a second plate and a third plate which are superimposed, wherein two plates define a feed channel that is connected to all outlets and a drain channel that is connected to all drain outlets.

Growing community of inventors

Soenderborg, Denmark

Klaus Kristen Olesen