Infineon Technologies Ag

Siemens Aktiengesellschaft

Avago Technologies General IP (singapore) Pte. Ltd.

Avago Technologies International Sales Pte. Limited

Qimonda Ag

Avago Technologies Wireless IP (singapore) Pte. Ltd.

Klaus-Guenter Oppermann

Martin Franosch

Martin Handtmann

Michael Stoisiek

Andreas Meckes

Bernhard Gebauer

Franz Hofmann

Robert Aigner

John Dwight Larson, Iii

Wolfgang Roesner

Robert Thalhammer

Marc Strasser

Andrew Thomas Barfknecht

Alfred Martin

Barbara Hasler

Brice Ivira

Martin Fritz

York C Gerstenmaier

A bulk acoustic wave (BAW) resonator includes: an acoustic reflector disposed in a substrate; a lower electrode disposed over the acoustic reflector; a piezoelectric layer disposed over the lower electrode; and an upper electrode disposed over the piezoelectric layer. A contacting overlap of the lower electrode, the piezoelectric layer and the upper electrode over the acoustic reflector comprising an active area of the BAW resonator. An opening exists in the upper electrode in a region of the BAW resonator susceptible to unacceptable overheating.

Bulk acoustic wave resonator

A device includes a substrate; a cavity package having a first surface attached to the substrate, the cavity package enclosing an electronic circuit; an elastic layer formed on a second surface of the cavity package, opposite the first surface; and a molding compound formed on the substrate, encasing the cavity package and the elastic layer. The elastic layer decouples stress between the cavity package and the molding compound encasing the cavity package, for maintaining structural integrity of the cavity package and for preventing separation of the cavity package from the substrate.

Packaged device including cavity package with elastic layer within molding compound

A method for housing an electronic component in a device package includes providing a first substrate, wherein the electronic component is arranged in a component area on a first main surface of the first substrate, and wherein first contact pads are arranged outside of the component area, forming an open top frame structure around the component area on the first main surface of the first substrate, providing a second substrate having second contact pads, arranged symmetrically to the first contact pads and electrically and mechanically connecting the first main surface of the first substrate with the first main surface of the second substrate, so that the frame structure and the second substrate from a cavity or recess around the electronic component on the first substrate.

Method for housing an electronic component in a device package and an electronic component housed in the device package

A device with contact elements. One embodiment provides an electrical device including a structure defining a main face. The structure includes an array of cavities and an array of overhang regions, each overhang region defining an opening to one of the cavities. The electrical device further includes an array of contact elements, each contact element only partially filling one of the cavities and protruding from the structure over the main face.

Electrical device with protruding contact elements and overhang regions over a cavity

An apparatus comprises a device layer structure, a device integrated into the device layer structure, an insulating carrier substrate and an insulating layer being continuously positioned between the device layer structure and the insulating carrier substrate, the insulating layer having a thickness which is less than 1/10 of a thickness of the insulating carrier substrate. An apparatus further comprises a device integrated into a device layer structure disposed on an insulating layer, a housing layer disposed on the device layer structure and housing the device, a contact providing an electrical connection between the device and a surface of the housing layer opposed to the device layer structure and a molding material surrounding the housing layer and the insulating layer, the molding material directly abutting on a surface of the insulating layer being opposed to the device layer structure.

Semiconductor device layer structure and method of fabrication

A method for manufacturing a coupled resonator device includes forming a first BAW-device on a first substrate, forming a second BAW-device on a second substrate, and bonding the first and the second BAW-device such that the bonded first and second BAW-device are sandwiched between the first and second substrate.

Method for manufacturing a coupled resonator device

A device comprises a first means for separating a conductive layer from a semiconductor substrate and a second means for reducing a voltage dependent capacitive coupling between the conductive layer and the semiconductor substrate.

Device and method for reducing a voltage dependent capacitive coupling

A method for developing a photoresist includes applying a first developer to the photoresist to remove non-cross-linked areas of the photoresist, and applying a second developer to the photoresist to remove remaining non-cross-linked areas of the photoresist, wherein the first developer and the second developer differ in their compositions.

Method for developing a photoresist

Apparatus comprising a device and method for producing it

An integrated circuit that comprises a substrate and a structured layer on the substrate. The structured layer comprises an opening to the substrate, a first field and a second field on the substrate, wherein the first field and the second field, at least in part, overlap with the opening. The integrated circuit further comprises a first material in the area of the first field and a second material in the area of the second field. The first material impedes a wetting by a solder material, and the second provides a wetting by the solder material.

Solder contacts and methods of forming same

A method for producing a polymer structure on a patterning region of a substrate surface includes the steps of depositing an adhesion layer having a first polymer material onto the substrate surface, patterning the adhesion layer such that the first polymer material of the adhesion layer is removed in a first region and the first polymer material of the adhesion layer remains in a second region including the patterning region, depositing a polymer layer of a second polymer material onto the substrate surface and the adhesion layer and patterning the polymer layer such that the polymer structure forms in the second region.

Method for producing a polymer structure on a substrate surface

In a method for producing a cover for a region of a substrate, first a frame structure is produced in the region of the substrate, and then a cap structure is attached to the frame structure so that the region under the cap structure is covered. Thus, sensitive devices may be protected easily and at low cost from external influences and particularly from a casting material for casting the entire packaged device, which results when a diced chip is cast.

Method for producing a cover, method for producing a packaged device

An integrated circuit arrangement includes an IGBT, provided with a secondary contact connected with the drift area, and a diode connected between the secondary contact and the anode of the IGBT. The cathode of the diode is connected with the anode of the IGBT and the anode of the diode is connected with the secondary contact of the IGBT. In this way the pn-junction of the IGBT, formed through the drift area and the channel area, can be used as an internal free-running diode of the IGBT.

Growing community of inventors

Holzkirchen, Germany

Klaus-Guenter Oppermann