Infineon Technologies Ag

Siemens Aktiengesellschaft

Klaus-G&uuml;nter Oppermann

Robert Aigner

Hergen Kapels

Stefan Kolb

Hans-J&ouml;rg Timme

Dieter Maier-Schneider

Wolfgang Werner

Thomas Scheiter

Christofer Hierold

Andreas Meckes

Jen&ouml; Tihanyi

A semiconductor component includes a semiconductor body of a first conductivity type which accommodates a space charge region. Semiconductor regions of a second conductivity type are disposed in at least one plane extending essentially perpendicularly to a connecting line extending between two electrodes. A cell array is disposed under one of the electrodes in the semiconductor body. At least some of the semiconductor regions of the second conductivity type are connected to the cell array via filiform semiconductor zones of the second conductivity type in order to expedite switching processes. A method for fabricating such a semiconductor component is also provided.

Semiconductor component for high reverse voltages in conjunction with a low on resistance and method for fabricating a semiconductor component

A recess is produced in a material layer by creating at least a first and a second structure in various steps. The layers define each other laterally and extend to the bottom of the recess. The first structure and the second structure are so narrow that they can be made by creating conformally produced layers that have an independent thickness and are smaller than the depth of the recess. The conformally produced layers are formed in an appropriate deposition process. A covering structure can be produced on top of the first and second structure. An opening can be made in the covering structure, through which the first structure and the second structure can be removed in an etching step.

Method for producing a filled recess in a material layer, and an integrated circuit configuration produced by the method

A micromechanical component placed on a substrate face includes at least one cell. A counter-electrode of a cell capacitor is placed under a cavity. The counter-electrode can be made from a first part of a lower conductive layer. An optionally circular membrane used as an electrode of the capacitor is placed above the cavity. The membrane is homogeneous, has a substantially uniform thickness, and can be part of an upper conductive layer preferably supported by a second part of the lower conductive layer. A caustic channel used to remove the sacrificial coating in order to form the cavity is laterally connected thereto. The channel has a vertical dimension equal to the vertical dimension of the cavity. A closure is adjacent to the channel and disposed outside the membrane. The component can be used as a pressure sensor, and can have several cells each adjacent to six other cells. A process for fabricating a micromechanical component is also provided.

Micromechanical component and process for its fabrication

Etching openings are provided in a membrane above an etched-out cavity, only at a distance of at most one tenth of the diameter of the member away from the edge of the cavity. For production, a poly layer is applied to a sacrificial layer composed of SiO and is provided with rows of etching holes, through which channels are etched out in the sacrificial layer. The poly layer is oxidized and is made smooth by means of a planarization layer. Etching holes are produced in the edge region of the membrane layer. The sacrificial layer is removed over the entire area of the cavity which is to be produced, with the etching medium propagating sufficiently quickly through the channels.

Production method for micromechanical components

A method is disclosed for producing a micromechanical component. The micromechanical component has sensor holes, wherein at least one component protective layer and/or a spacer coating is applied on the component before separating the wafer into chips. The component protective layer sealingly covers at least the walls of the holes extending parallel to the surface of the wafer and perpendicular to the surface of the wafer and the spacer coating sealingly covers at least the walls of the holes extending parallel to the surface of the wafer.

Micromechanical component protected from environmental influences

A micromechanical structure, such as a sensor, includes a substrate, a diaphragm, a cavity, a sacrificial layer and a terminating structure. The terminating structure is cut away in the region of the diaphragm in such a way that a media opening is located above the diaphragm. The diameter of the cavity is smaller over the entire circumference of the cavity than the diameter of the opening. A method for manufacturing the micromechanical structure is also provided.

Micromechanical structure, sensor and method for manufacturing the same

An integrated sensor is fabricated by etching recesses or depressions into the top side of a semiconductor body and by fabricating sensor components in the recesses or depressions. The sensor components are lowered in the recesses or depressions by approximately half of their height. Electronic components are fabricated in the remaining regions of the top side of the semiconductor body. The remaining regions may be covered with a protective layer if the recesses or depressions are fabricated after the electronic components.

Growing community of inventors

Holzkirchen, Germany

Klaus-Günter Oppermann

Growing community of inventors

Holzkirchen, Germany

Klaus-G&uuml;nter Oppermann

Klaus-Günter Oppermann