Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

Thin Materials Ag

Acmos Chemie Gmbh & Co.

Nissan Chemical Corporation

Klaus-D Vissing

Volkmar Stenzel

Andreas Jakob

Horst Wochnowski

Holger Klyszcz-Nasko

Alfred Baalmann

A process and an apparatus are described for the treatment of wafers, in particular for the thinning of wafers. A wafer with a carrier layer and an interlayer arranged between the carrier layer and the wafer is also described, in which the interlayer is a plasmapolymeric layer that adheres to the wafer and adheres more strongly to the carrier layer than to the wafer.

Method and device for machining a wafer, in addition to a wafer comprising a separation layer and a support layer

A method of producing a permanent demoulding layer by plasma polymerisation on the surface of a mould, in which a gradient layer structure is created in the demoulding layer by varying the polymerisation conditions over time.

Method for producing a permanent demoulding layer by plasma polymerization on the surface of a moulded-part tool, a moulded-part tool produced by said method and the use thereof

Growing community of inventors

Morsum, Germany

Klaus-D Vissing