Siemens Aktiengesellschaft

Siemens Aktiengesselschaft

Klaus Budde

Oskar Nuyken

Ferdinand Quella

Friedrich Koch

Walter Melchior

Thomas Suefke

A cover layer for micro-electronic components and VLSI circuits is provided for protecting the components and circuits against alpha radiation. The cover layer is produced by ultraviolet cross linking of a negative resist, wherein, as a constituent for absorbing the alpha rays, the negative resist contains a substituted triphosphazene of the formula (I) whose organic radicals are bonded to phosphorus via oxygen and wherein, on a statistical average, 1 through 3 radicals have cross-linkable, light-sensitive groups. The cover layer provided good protection from alpha rays, has low shrinkage during curing and, given high thermal resistance, can be combined when mixing with other negative resists. ##STR1##

Anti-radiation covering for electronic components

In order to achieve a low dielectric constant and in order to improve the constant temperature resistance of radiation-sensitive synthetic resin lacquers, a photo-polymer system which is composed of a furyl acrylic acid esterified epoxy resin with phenoxy or epoxy end groups is employed as coating (2, 13, 4) on a substrate in the manufacture of printed circuits, particularly in multi-layer format. The cross-linking ensues with light in the wavelength range from about 150 through 400 nm preferably in the presence of a sensitizer without any following hot-hardening. As a consequence of its good solubility, the product can be easily processed and requires no intermediate layers when in a multi-layer format. A further area of employment lies in the field of integrated semiconductor circuits in VLSI technology when producing negative photo-resists.

Printed circuit manufacture employing a radiation cross-linkable

Linear fluorooligomers having at least two reactive end groups per polymer molecule are incorporated into radiation sensitive polymer systems which have improved continuous temperature resistance and low dielectric constant. The polymer systems can be applied as lacquers. Preferably perfluorated poly-ethers and perfluorated alkanes are used as starting compounds. The polymeric product is usable as a coating for the production of printed multi-layer wirings and economises on through-bores and additional copper intermediate layers. A further field of application exists in the field of integrated semiconductor circuits in VLSI-technology for the production of negative photo-resists.

Irradiation cross-linkable thermostable polymer system, for

For shortening the exposure time of radiation-sensitive epoxy resin lacquers based on condensates of bisphenols and epichlorohydrin and for increasing their thermal stability, the number of reactive groups in each polymer repeating unit is increased by incorporating there into at least two hydroxyl groups and preferably five hydroxymethylene groups. When a composition of such a polyhydroxylated condensate is reacted with cinnamic acid chloride or the like, the resulting light sensitive condensate is utilizable as a coating in the manufacture of printed multilayer wirings. Intermediate tempering, drilling and additional protective films are eliminated. Such a condensate can also be employed in the field of integrated semiconductor circuits in VLSI technology where lacquer structures are produced.

Thermally stable, irradiation cross-linkable polymer systems based on

Linear fluorooligomers having at least two reactive end groups per polymer molecule are incorporated into radiation sensitive polymer systems which have improved continuous temperature resistance and low dielectric constant. The polymer systems can be applied as lacquers. Preferably perfluorated poly-ethers and perfluorated alkanes are used as starting compounds. The polymeric product is usable as a coating for the production of printed multi-layer wirings and economises on through-bores and additional copper intermeidate layers. A further field of application exists in the field of integrated semiconductor ciruits in VLSI-technology for the production of negative photo-resists.

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Unterhaching, Germany

Klaus Budde