Nxp B.v.

Npx B.v.

M4si B.v.

Klaas Heres

Robertus Adrianus Maria Wolters

Paul Dijkstra

Peter Dirks

Johannes Reinder Marc Luchies

Maarten Nollen

The method of manufacturing a solar cell comprises the steps of: (a) providing the semiconductor substrate in a deposition chamber of a vapour deposition apparatus, which semiconductor substrate comprises a passivation layer at a first side thereof which passivation layer is patterned to define contact areas at which the copper-containing conductor is present; (b) supplying a gaseous silicon species into the deposition chamber, resulting in the formation of a surface layer of a copper silicide on a surface of the copper-containing conductor and in the formation of amorphous silicon on top of the passivation layer, and (c) providing a protective layer of an insulating silicon compound on the surface layer, wherein the protective cover comprising both the surface layer and the protective layer.

Protective cover for a copper containing conductor

A method of manufacturing an inductor embedded into a semiconductor chip package () is described, which method comprises providing a carrier () having, between a first side and an opposite second side, a first conductive layer (), an intermediate layer (), a second conductive layer (), forming an inductor and contact pads for the chip by patterning the first conductive layer () from the first side of the carrier (), assembling the chip and providing an encapsulation () and forming terminals of the package, by patterning the second conductive layer () from the second side of the carrier.

Embedded inductor and method of producing thereof

A carrier () for bonding a semiconductor chip () onto is provided, wherein the carrier () comprises a die pad () and a plurality of contact pads (), wherein each of the plurality of contact pads () comprises an electrically conductive multilayer stack, wherein the electrically conductive multilayer stack comprises a surface layer (), a first buffer layer, and a first conductive layer (). Furthermore, the first buffer layer comprises a material adapted to prevent diffusion of material of the surface layer () into the first conductive layer (), and at least two of the contact pads () has an ultrafine pitch relative to each other.

Carrier for bonding a semiconductor chip onto and a method of contracting a semiconductor chip to a carrier

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Klaas Heres