Abb Schweiz Ag

Abb Technology Oy

Kjell Ingman

Mika Silvennoinen

Mikael Holmberg

Jorma Manninen

Joni Pakarinen

Michael Rodas

A power electronics module and a method of producing a power electronics module. The power electronics module includes multiple of power electronic semiconductor chips incorporated in a housing and attached to a substrate, and a heat transfer structure attached to the substrate and having a bottom surface which forms an outer surface of the module and which is adapted to receive a surface of a cooling device, wherein the heat transfer structure includes a compressible base plate.

Power electronics module and a method of producing a power electronics module

A power electronics module and a method of manufacturing a power electronics module and a base plate. The power electronics module comprising at least one power electronics component, wherein the power electronics module comprises a base plate for transferring heat generated by the at least one power electronics component to a cooling device, the base plate comprising a layered structure having a first copper layer, a second copper layer and a carbon based layer between the first and second copper layers.

Power electronics module

Growing community of inventors

Sipoo, Finland

Kjell Ingman