Murata Manufacturing Co., Ltd.

Murata Manufactruing Co., Ltd.

Kiyoyasu Sakurada

Shinji Otani

Kota Zenzai

Seiji Katsuta

Naoki Shimizu

Hisayoshi Omori

Takashi Kanayama

Syunsuke Takeuchi

Akihiro Motoki

Makoto Ogawa

Masahito Saruban

Kuniaki Yosui

Hiroyuki Kubo

Hiromitsu Ito

Toshiyuki Iwanaga

Ichiro Nakamura

Koji Matsushita

Masanori Kasai

Katsuaki Higashi

Kiyoko Ueda

Hiroshi Nongaki

A ceramic electronic component includes a ceramic body, an inner electrode, an outer electrode, and a connecting portion. The inner electrode is disposed inside the ceramic body. The end portion of the inner electrode extends to a surface of the ceramic body. The outer electrode is disposed on the surface of the ceramic body so as to cover the end portion of the inner electrode. The outer electrode includes a resin and a metal. The connecting portion is disposed so as to extend from an inside of the outer electrode to an inside of the ceramic body. In a portion of the surface of the ceramic body on which the outer electrode is disposed, the length of the connecting portion that extends in a direction in which the inner electrode is extends about 2.4 &#x3bc;m or more.

Method for producing a ceramic electronic component

A ceramic body is prepared that includes an inner electrode disposed inside the ceramic body and in which an end portion of the inner electrode is led to a surface of the ceramic body. An electrode layer is formed on the surface of the ceramic body so as to cover the end portion of the inner electrode, the electrode layer containing a resin, a first metal filler that contains a first metal component, and a second metal filler that contains a second metal component having a higher melting point than the first metal component. A heating step of heating the electrode layer is performed to form an electrode including a metal layer that is located on the surface of the ceramic body and that contains the first and second metal components and a metal contained in the inner electrode.

Ceramic electronic component and method for producing the same

Ceramic electronic component and manufacturing method thereof

A ceramic body includes an inner electrode disposed inside the ceramic body and in which an end portion of the inner electrode extends to a surface of the ceramic body. An electrode layer is formed on the surface of the ceramic body so as to cover the end portion of the inner electrode, the electrode layer including a resin, a first metal filler that contains a first metal component, and a second metal filler that contains a second metal component having a higher melting point than the first metal component. A step of heating the electrode layer is performed to form an electrode including a metal layer that is located on the surface of the ceramic body and that includes the first and second metal components and a metal contained in the inner electrode.

A method for manufacturing a laminated electronic component in which, when first plating layers that respectively connect a plurality of internal electrodes to each other and second plating layers that improves the mountability of a laminated electronic component are formed as external terminal electrodes, the entire component main body is treated with a water repellent agent after the formation of the first plating layers, and the water repellent agent on the first plating layers is then removed before the formation of the second plating layers. The gaps between the end edges of the first plating films on the outer surface of the component main body and the outer surface of the component main body are filled with the water repellent agent.

Laminated electronic component and manufacturing method therefor

A ceramic electronic component includes a ceramic body and an outer electrode. The outer electrode is disposed on the ceramic body. The outer electrode includes a first conductive layer and a second conductive layer. The first conductive layer includes a resin, a first metal component, and a second metal component having a higher melting point than the first metal component. The second conductive layer is disposed on the first conductive layer. The second conductive layer is includes a plating film. An alloy particle containing the first metal component and the second metal component protrudes to the second conductive layer side from a surface of the first conductive layer.

Method of manufacturing ceramic electronic component including heating an electrode layer to form a conductive layer including an alloy particle

A chip-type electronic component with high reliability, which is able to suppress and prevent fatal damage to a ceramic body due to cracking even if a substrate with the chip-type electronic component mounted thereon undergoes a deflection. The chip-type electronic component includes a ceramic body having internal electrodes; resin electrode layers formed in a region including at least end surfaces of the ceramic body, and connected to the internal electrodes directly or indirectly and connected with the ceramic body; and plating metal layers covering the resin electrode layers, wherein the adhesion strength between the ceramic body and the resin electrode layer is higher than the adhesion strength between the resin electrode layer and the plating metal layer.

Chip-type electronic component

In an electronic component, a laminate includes a plurality of laminated ceramic layers and a mounting surface defined by outer edges of the plurality of laminated ceramic layers, the outer edges being continuously located adjacent to each other. Capacitor conductors are disposed on the ceramic layers and include exposed portions that are exposed at the mounting surface between the ceramic layers. An electroconductive layer defining an external electrode is arranged to directly cover the exposed portions and is formed by plating so as to be made of plated material. Another electroconductive layer covers the above-mentioned electroconductive layer and partially covers surfaces of the laminate, and it is made of a material including metal and one of glass and resin.

Electronic component

When an external terminal electrode of a ceramic electronic component such as a laminated ceramic capacitor is formed by plating, plating growth may be also caused even in an undesired location. The ceramic surface provided by a component main body is configured to include a high plating growth region of, for example, a barium titanate based ceramic, which exhibits relatively high plating growth, and a low plating growth region of, for example, a calcium zirconate based ceramic, which exhibits relatively low plating growth. The plating film constituting a first layer to define a base for an external terminal electrode is formed in such a way that the growth of a plated deposit deposited with conductive surfaces provided by exposed ends of internal electrodes as starting points is limited so as not to cross over a boundary between the high plating growth region and the low plating growth region toward the low plating growth region.

Ceramic electronic component and manufacturing method therefor

A process for producing resin-coated metal particles includes coating surfaces of metal particles with silica; allowing a polymerizable group to adsorb onto the surfaces of the silica-coated particles by the use of a silane coupling agent; and coating the surfaces of the silica-coated particles with a polymeric resin by mixing the particles to which the polymerizable groups have been adsorbed, a polymerizable monomer, a polymerization initiator, and a dispersant to polymerize the polymerizable monomer and the polymerizable groups.

Process for producing resin-coated metal particles, resin-coated metal particles, and toner for forming circuit

A flexible substrate is wound around a magnetic core to define an antenna coil. A receiver coil including a first receiver coil portion and a second receiver coil portion which have opposite winding directions, and a transmitter coil including a first transmitter coil portion and a second transmitter coil portion which have opposite winding directions are provided on the flexible substrate. A region in which the receiver coil is provided and a region in which the transmitter coil is provided at least partially overlap each other when viewed in plan view, and non-coil-wound portions are provided between the first coil portions and second coil portions in the coils.

Antenna coil antenna device

A dielectric antenna is provided which uses a compounded material and exhibits a small change in relative dielectric constant at room temperature against a load due to temperature changes. The dielectric antenna includes a dielectric block, a radiation electrode, a feeding electrode and a fixing electrode provided on the dielectric block. The dielectric block contains a crystalline thermoplastic resin, ceramic powder, and an acid-modified styrenic thermoplastic elastomer. The acid-modified styrenic thermoplastic elastomer content in the dielectric block is 3% to 20% by volume.

Dielectric antenna

A lens antenna including a lens body and/or a matching layer. In the lens antenna, lens body may be formed by a material containing thermoplastic elastomers. When a matching layer is formed on the surface of the lens body, at least one of the lens body and the matching layer is formed by a material containing thermoplastic elastomers. The use of thermoplastic elastomers in the lens body and/or the matching layer assist in reducing the formation of cracks therein.

Lens antenna

Provided is a composite dielectric molded product exhibiting excellent properties such as the antenna gain and side lobe, etc. when used for a lens antenna, and exhibiting less variation of properties in one individual product and between individual products. The composite dielectric molded product is formed by molding a composite dielectric material containing a dielectric inorganic filler and an organic polymer material so that the dielectric constant anisotropy is in the range of about 1.00 to 1.05.

Growing community of inventors

Nagaokakyo, Japan

Kiyoyasu Sakurada