Sekisui Chemical Co., Ltd.

Kiyoto Matsushita

Ren-de Sun

Taku Sasaki

Hiroya Ishida

Shinya Uenoyama

Nobuyuki Okinaga

Masaki Okuda

Ren-De Sun

The present invention aims to provide electroconductive microparticles which are less likely to cause disconnection due to breakage of connection interfaces between electrodes and the electroconductive microparticles even under application of an impact by dropping or the like and are less likely to be fatigued even after repetitive heating and cooling, and an anisotropic electroconductive material and an electroconductive connection structure each produced using the electroconductive microparticles. The present invention relates to electroconductive microparticles each including at least an electroconductive metal layer, a barrier layer, a copper layer, and a solder layer containing tin that are laminated in said order on a surface of a core particle made of a resin or metal, the copper layer and the solder layer being in contact with each other directly, the copper layer directly in contact with the solder layer containing copper at a ratio of 0.5 to 5% by weight relative to tin contained in the solder layer.

Electroconductive microparticles, anisotropic electroconductive material, and electroconductive connection structure

A conductive fine particle, which is used for conductive connection between fine electrodes and tends not to give rise to a crack in the solder layer or disconnection caused by breakage in the connection interface between an electrode and the conductive fine particle even with a drop impact and the like, and tends not to have fatigue even after repetitive heating and cooling; an anisotropic conductive material obtained by using the conductive fine particle; and a conductive connection structure.

Electroconductive fine particles, anisotropic electroconductive material, and electroconductive connection structure

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Shiga, Japan

Kiyoto Matsushita