Other

Koha Co., Ltd.

Toyoda Gosei Co., Ltd.

Kiyotaka Teshima

Hideaki Kato

Shunsuke Ohtsuka

Takemasa Yasukawa

Yukio Yoshikawa

Atsuo Hirano

Kanae Matsumura

Yoshinobu Suehiro

Yuji Takahashi

Koichi Kaga

An LED lamp has a package and a plurality of light emitting elements that are electrically connected to a plurality of electrode plates provided in the package and that are sealed with transparent material. A red light emitting element of the plurality of light emitting elements is wire bonded along the longitudinal direction of the package, a green light emitting element and a blue light emitting element are flip-chip bonded with its electrode faced down, and the electrodes are extended to a surface opposite to the light emission surface of the LED lamp while being embedded in the package.

LED lamp

Light emitting diode lamp

Separate leads and a common lead are provided on the upper and lower surfaces of a substrate. A plurality of LED elements are disposed in an array on the common lead on the upper surface of the substrate. The common lead provided on the upper surface of the substrate is connected to the common lead provided on the lower surface of the substrate through through-hole plating. Heat generated from the plurality of LED elements is transferred through the common lead provided on the upper surface of the substrate and the through-hole plating to the common lead provided on the lower surface of the substrate and is release therefrom into the air. By virtue of this construction, an light emitting device can be realized in which heat radiating properties are homogenized, heat radiation efficiency is improved, and a compact structure is obtained and, thus, the color balance is improved and unfavorable phenomena such as lowering in the output of light emitting elements and shortening of the service life are avoided.

Light emitting device

In a light-emitting diode, a substantially square flip chip is placed on a substantially square sub-mount at a position and posture which are obtained through superposition of a center point and center axis of the flip chip on a center point and center axis of the sub-mount and subsequent rotation of the flip chip about the center points by approximately 45&deg;. Therefore, triangular exposed regions are formed on the sub-mount, in which two lead electrodes for the flip chip can be formed. As a result, the flip chip can be placed on a lead frame such that the center axis of the flip chip coincides with the center axis of a parabola of the lead frame. Further, the sub-mount is formed of a semiconductor substrate, and a diode for over-voltage protection is formed within the semiconductor substrate. Therefore, breakage of the light-emitting diode due to excessive voltage can be prevented.

Light-emitting diode

Growing community of inventors

Tokyo, Japan

Kiyotaka Teshima