Mitsubishi Materials Corporation

Kiyotaka Nakaya

Kazunari Maki

Naoki Kato

Kenji Kubota

Yoshie Tarutani

Mami Watanabe

Takashi Tamagawa

Yuki Inoue

Shinichi Funaki

Isao Arai

Kyoka Susuki

Kotaro Masuyama

Fuyumi Mawatari

Tomohiko Yamaguchi

Kohei Otogawa

Yasushi Konno

Tooru Nishimura

Provided is a bonding sheet using a copper particle that is less prone to deteriorate the sintering property due to oxidation of the copper particle, and can form a dense bonding layer having fewer voids, and can also bond an electronic component and the like with a high bonding strength. A bonding sheet () contains a copper particle () and a solvent () having a boiling point of 150° C. or higher, in which the copper particle () has a surface covered with an organic protective film, the content ratio of the copper particle () to the solvent () is in the range of 99:1 to 90:10 by mass, and the BET diameter of the copper particle () is in the range of 50 nm to 300 nm both inclusive.

Bonding sheet

In a method for producing high-purity electrolytic copper, a first additive (A) containing an aromatic ring of a hydrophobic group and a polyoxyalkylene group of a hydrophilic group, a second additive (B) formed of polyvinyl alcohols, and a third additive (C) formed of tetrazoles are added to a copper electrolyte, copper electrolysis is performed by controlling each concentration of the first additive (A), the second additive (B), and the third additive (C), a current density and a bath temperature, and accordingly, electrolytic copper in which a concentration of Ag is less than 0.2 mass ppm, a concentration of S is less than 0.07 mass ppm, a concentration of all impurities is less than 0.2 mass ppm, and an area ratio of crystal grains having an average crystal grain misorientation (referred to as a GOS value) exceeding 2.5&#xb0; is 10% or less is obtained.

Method for producing high-purity electrolytic copper

An anti-corrosion terminal material including a base material made of copper or copper alloy and a coating film laminated on the base material: the coating film includes: a first coating film, provided with a zinc layer made of zinc alloy and a tin layer made of tin or tin alloy which are laminated in this order, and formed at a planned core contact part; and a second coating film including the tin layer but not comprising the zinc layer, which is provided at a planned contact part being a contact part when the terminal is formed: and the zinc layer has a thickness not less than 0.1 &#x3bc;m and not more than 5.0 &#x3bc;m and zinc concentration not less than 30% by mass and not more than 95% by mass, and has any one or more of nickel, iron, manganese, molybdenum, cobalt, cadmium, lead and tin as a balance.

Anti-corrosion terminal material, anti-corrosion terminal and electric wire end structure

A tin-plated copper terminal material in which on a substrate made of copper or copper alloy, a nickel-or-nickel-alloy layer, a copper-tin alloy layer, and a tin layer are laminated in this order; in this material, the tin layer has an average thickness 0.2 &#x3bc;m to 1.2 &#x3bc;m inclusive; the copper-tin alloy layer is a compound alloy layer in which CuSnis a main ingredient and part of copper in the CuSnis substituted with nickel, and an average crystal grain size is 0.2 &#x3bc;m to 1.5 &#x3bc;m inclusive; part of the copper-tin alloy layer appears on a surface of the tin layer and tin solidification parts exist like islands; and the tin solidification parts have an average diameter 10 &#x3bc;m to 1000 &#x3bc;m inclusive in a direction along the surface of the tin layer and an area ratio to the surface of the tin layer 1% to 90% inclusive.

Tin-plated copper terminal material and method of manufacturing the same

In a terminal material with a silver coating film including a silver layer on a surface, a terminal and a terminal material having high reliability are easily manufactured with low cost without a heat treatment. A base material formed of copper or a copper alloy; and nickel layer, an intermediate layer, and a silver layer laminated on the base material in this order are included, the nickel layer has a thickness of 0.05 &#x3bc;m to 5.00 &#x3bc;m and is formed of nickel or a nickel alloy, the intermediate layer has a thickness of 0.02 &#x3bc;m to 1.00 &#x3bc;m and is an alloy layer containing silver (Ag) and a substance X, and the substance X includes one or more kinds of tin, bismuth, gallium, indium, and germanium.

Terminal material with silver coating film and terminal with silver coating film

The present invention provides a high-purity electrolytic copperhaving a Cu purity excluding gas components (O, F, S, C, and Cl) is 99.9999 mass % or more, a content of S is 0.1 mass ppm or less, and an area ratio of crystals having a (101)&#xb1;10&#xb0; orientation is less than 40%, when crystal orientation is measured by electron backscatter diffraction in a cross section along a thickness direction.

High-purity electrolytic copper

A tin or tin alloy plating solution includes: (A) a soluble salt containing at least a stannous salt; (B) an acid selected from an organic acid and an inorganic acid or a salt thereof; (C) a surfactant; and (D) a leveling agent. In addition, the surfactant contains polyoxyethylene polyoxypropylene alkylamine, an alkyl group of the polyoxyethylene polyoxypropylene alkylamine is CH2(where a is 12 to 18). Further, in a case where a number of a functional group of polyoxypropylene of the polyoxyethylene polyoxypropylene alkylamine is set as p and a number of a functional group of polyoxyethylene of the polyoxyethylene polyoxypropylene alkylamine is set as q, the sum of p and q (p+q) is 8 to 21, and a ratio of p to q (p/q) is 0.1 to 1.6.

Tin or tin alloy plating solution

Provided is a tin-plated copper terminal material, a terminal formed from the terminal material, and an electric-wire terminal structure using the terminal: the terminal material has a substrate of copper or a copper alloy; an intermediate zinc layer of a zinc alloy that is formed on the substrate and has a thickness of 0.10 &#x3bc;m to 5.00 &#x3bc;m; and a tin layer of tin or a tin alloy that is formed on the intermediate zinc layer and in which the length proportion occupied by low-angle grain boundaries is 2% to 30% with respect to the total length of all crystal grain boundaries; wherein galvanic corrosion is effectively suppressed.

Tin-plated copper terminal material, terminal, and electric-wire terminal structure

A terminal material for a connector terminal, using a copper or copper alloy substrate is crimped to an end of wire formed from an aluminum wire material; and a terminal using this terminal material: a zinc layerthat is formed of zinc or a zinc alloy and a tin layerthat is formed of tin or a tin alloy are sequentially laminated in this order on a substratethat is formed of copper or a copper alloy: with respect to the zinc layer and the tin layer, the adhesion amount of tin contained in the whole layers is from 0.5 mg/cmto 7.0 mg/cm(inclusive) and the adhesion amount of zinc contained in the whole layers is from 0.07 mg/cmto 2.0 mg/cm(inclusive), and the content percentage of zinc in the vicinity of the surface is from 0.2% by mass to 10.0% by mass (inclusive).

Terminal material for connectors, terminal, and electric wire termination structure

This plating liquid contains (A) a soluble salt that contains at least a stannous salt, (B) an acid selected from organic acids and inorganic acids or a salt thereof, and (C) two kinds of surfactants of an amine-based surfactant (C1) and a nonionic surfactant(s) (C2 and/or C3). The amine-based surfactant (C1) is a polyoxyethylene alkyl amine represented by general formula (1); and the nonionic surfactant(s) (C2 and/or C3) is a condensation product of a polyoxyethylene and a polyoxypropviene represented by general formula (2) or general formula (3). In formula (1), x is 12-18 and y is 4-12. In formula (2), m is 15-30 and (n1+n2) is 40-50. In formula (3), (m1+m2) is 15-30 and n is 40-50.

Plating liquid

A tin or tin alloy plating solution includes: (A) a soluble salt containing at least a stannous salt; (B) an acid selected from an organic acid and an inorganic acid or a salt thereof; (C) a phenyl-based surfactant formed of polyoxyethylene bisphenol ether represented by the General Formula (1); and (D) a leveling agent, here, in the Formula (1), X is CH(a is 1 or 3) and m is 2 to 12.

On a base member made of copper or a copper alloy, a zinc-nickel alloy layer including zinc and nickel, and a tin layer made of tin alloy are laminated in this order: the zinc-nickel alloy layer has a thickness of 0.1-5 &#x3bc;m inclusive and has a nickel content of 5-50 mass % inclusive, the tin layer has a zinc concentration of 0.6-15 mass % inclusive, and, under an oxide layer which is the outermost layer, a metal zinc layer, having a zinc concentration of 5-40 at % inclusive and a thickness of 1-10 nm inclusive in SiOconversion, is formed on the tin layer.

Tin-plated copper terminal material, terminal, and wire terminal part structure

A terminal material for connectors, which is obtained by sequentially laminating on a substrate that is formed of copper or a copper alloy, a nickel or nickel alloy layer, a copper-tin alloy layer and a tin layer in this order, and: the tin layer has an average thickness of from 0.2 &#x3bc;m to 1.2 &#x3bc;m (inclusive); the copper-tin alloy layer is a compound alloy layer that is mainly composed of CuSn, with some of the copper in the CuSnbeing substituted by nickel, and has an average crystal grain diameter of from 0.2 &#x3bc;m to 1.5 &#x3bc;m (inclusive); a part of the copper-tin alloy layer is exposed from the surface of the tin layer, with the exposure area ratio being from 1% to 60% (inclusive); the nickel or nickel alloy layer has an average thickness of from 0.05 &#x3bc;m to 1.0 &#x3bc;m (inclusive) and an average crystal grain diameter of from 0.01 &#x3bc;m to 0.5 &#x3bc;m (inclusive).

Terminal material for connectors and method for producing same

A corrosion-resistant terminal material has a substrate made of copper or a copper alloy and a film layered on the substrate. The film has a planned core wire contact part with which a core wire of an electric wire is in contact when the material is formed to a terminal and a planned contact part. The film formed in the planned core wire contact part has a tin layer made of tin or tin alloy and a metallic zinc layer formed on the tin layer; the film formed in the planned contact part has a tin layer made of tin or tin alloy but does not have a metallic zinc layer. A corrosion-resistant terminal uses the corrosion-resistant terminal material described herein.

Corrosion-resistant terminal material, corrosion-resistant terminal, and wire-end structure

Providing a tin-plated terminal material with high corrosion-prevention effect and low contact resistance, a terminal formed from the terminal material, and an electric wire terminal-end structure. Provided are a base material made of copper or copper alloy, a zinc layer made of zinc or zinc alloy formed on the base material, and a tin layer made of tin or tin alloy formed on the zinc layer: in a whole of the zinc layer and the tin layer, a tin amount per unit area is 0.30 mg/cmto 7.00 mg/cminclusive, a zinc amount per unit area is 0.07 mg/cmto 2.00 mg/cminclusive, a content percentage of zinc in a vicinity of a surface in the tin layer is 0.2% to 10% by mass inclusive, and a length proportion of low-angle grain boundaries occupied in a total length of crystal boundaries in the tin layer is 2% to 30% inclusive.

Growing community of inventors

Naka, Japan

Kiyotaka Nakaya