Ebara Corporation

Other

Kabushiki Kaisha Toshiba

Qualcomm Incorporated

Kiyotaka Kawashima

Mutsumi Tanikawa

Norio Kimura

Mitsunori Komatsu

Seiji Ishikawa

Hiroshi Shimomoto

Katsuya Okumura

Hirokuni Hiyama

Yutaka Wada

Manabu Tsujimura

Rempei Nakata

Masayoshi Hirose

Katsuyuki Aoki

You Ishii

Fujihiko Toyomasu

Haruki Nojo

Takayoshi Kawamoto

Keiko Chono

This disclosure provides systems, methods and apparatus for wireless power transfer and particularly wireless power transfer to remote systems such as electric vehicles. In one aspect, a wireless power receiver includes a first inductive element configured to receive wireless charging power from a transmitter. The wireless power receiver further includes a second inductive element, laterally separated from the first, configured to receive wireless charging power from the transmitter. The wireless power receiver further includes a position detector configured to determine a lateral position of the receiver relative to the transmitter based on characteristics of the first and second inductive elements.

Device alignment in inductive power transfer systems

A pure water reusing system recovers water discharged from apparatuses in which pure water is used, and regenerates the water to produce pure water. The pure water reusing system has a recovering and regenerating apparatus for recovering water discharged from the apparatuses and regenerating the water by removing impurities from the water to produce pure water, and a regenerated pure water supply line for supplying the regenerated pure water to at least one of the apparatuses. The same process is conducted in the apparatuses in which pure water is used.

Pure water reusing system

The object of the present invention is to provide a polishing apparatus that can supply a polishing solution having a non-varying distribution of abrading particles sizes at a steady rate. An apparatus ( ) for delivering a polishing solution to a polishing apparatus ( ) is disclosed. The apparatus ( ) comprises: a solution passage for transporting the polishing solution; and an ultrasonic vibrator ( ) being provided in at least one location of the solution passage.

Polishing solution feeder

A polishing liquid supply apparatus supplies a polishing liquid to a polishing unit. The polishing liquid supply apparatus includes a supply tank for storing a polishing liquid having a predetermined concentration, and a polishing liquid pipe for delivering the polishing liquid from the supply tank to a polishing liquid supply nozzle in the polishing unit. The polishing liquid supply apparatus further includes an additive tank for storing an additive having a predetermined concentration, and an additive supply pipe for adding the additive supplied from the additive tank to the polishing liquid stored in the supply tank or to the polishing liquid in a polishing liquid passage including the polishing liquid pipe.

Polishing liquid supply apparatus

An apparatus for supplying a polishing liquid to a polishing section is used for polishing a surface of a semiconductor substrate in the polishing section. The apparatus comprises a supply tank for storing a polishing liquid having given properties, a supply pipe for supplying the polishing liquid to the polishing section, a sensing device for detecting properties of the polishing liquid flowing through the supply pipe, and a stabilization device for maintaining properties of the polishing liquid stored in the supply tank or flowing through the supply pipe within an allowable range on the basis of an output signal from the sensing device.

Apparatus for supplying polishing liquid

A polishing solution supply system can prevent precipitation of solutes on delivery pipes or interior walls of holding tanks so that a polishing solution of a constant solution concentration can be supplied to a polishing tool. The polishing solution supply system includes a stock solution supply source, a dilution solution supply source, and a mixing section for mixing a stock solution and a dilution solution to formulate the polishing solution. The mixing section is sealed hermetically to exclude external atmosphere. Delivery lines deliver the polishing solution to each of plural polishing sections.

Polishing solution supply system

A filter apparatus provided in a fluid pipeline for conveying a treatment fluid. A regenerating pipeline is provided adjacently to the fluid pipeline to convey a regenerating liquid. At least two filter units are switched between the fluid pipeline and the regenerating pipeline by a switching valve device. The filter apparatus enables a filter replacing operation to be carried out smoothly and reliably and is also capable of reliably trapping solid particles contained in the fluid, e.g. an abrasive liquid, continuously without the need of a filter replacing operation, thereby allowing supply of a fluid of high quality and a stable operation free from clogging.

Filter apparatus

The first pipe 34 delivers the first solution 21 containing polishing particles. The second pipe 37, containing a liquid mass flow unit 36, delivers the second solution containing a chemical substance. The outlet port of the first pipe and the outlet port of the second pipe are connected to one end portion of the third pipe 31. The third pipe has the other end portion with an inner diameter almost equal to the inner diameter of its one end portion. The first and second solutions introduced into the third pipe are mixed in the third pipe to generate a polishing liquid. The generated polishing liquid is supplied from the other end portion of the third pipe onto a polishing pad 13 to polish a semiconductor wafer 16.

Semiconductor device polishing apparatus having improved polishing

A waste treatment system in a polishing apparatus treats waste gas and waste liquid discharged from the polishing apparatus. The waste treatment system comprises an exhaust duct provided in a partition wall enclosing the polishing apparatus, a scrubber connected to the exhaust duct through an exhauster for scrubbing waste gas discharged from the polishing apparatus, a waste liquid receiver provided below an abrasive cloth of the polishing apparatus for receiving waste liquid generated by a polishing operation and a waste liquid treatment apparatus connected to the waste liquid receiver for treating the waste liquid discharged from the polishing apparatus.

Waste treatment system in a polishing apparatus

A turntable with an abrasive cloth mounted thereon and a top ring positioned above the turntable are independently rotatably provided. The top ring holds a workpiece to be polished and presses the workpiece against the abrasive cloth. The turntable and the top ring are rotated to polish the surface of the workpiece to a flat mirror finish on the abrasive cloth. A rotatable brush pressed against the abrasive cloth is rotated about an axis substantially perpendicularly to the plane of the abrasive cloth, and oscillated substantially radially between radially inner and outer positions over the abrasive cloth. A cleaning solution is sprayed from a nozzle onto the abrasive cloth. The turntable has a bank along an outer circumferential edge thereof for preventing a protective solution, which is supplied to the abrasive cloth to keep the abrasive cloth wet and prevent it, from flowing off the turntable when the turntable is stationary.

Growing community of inventors

Tokyo, Japan

Kiyotaka Kawashima