Sony Corporation

Other

Nikon Corporation

Nec Electronics Corporation

Kiyoshi Tanaka

Yoshihiro Hayashi

Takahiro Onodera

Yamato Samitsu

Naoki Sasaki

Satoru Ide

Kazuo Kobayashi

Akihiko Okubora

Chiaki Kojima

Chiaki Takano

Tatsuya Senga

Syuji Matsuo

Toshihiro Itho

Hideto Ishikawa

The invention provides a communication control device that includes a self-diagnostic test circuit capable of executing an operation test. The communication control circuit includes a PHY circuit on an LSI with little trouble, and at a operating speed that is equivalent to actual operation. The self-diagnostic test circuit includes: test data creation circuit for creating test data; expected value data creation circuit for creating expected values of the test data after processing; an arbitration signal switching circuit that switches arbitration signals such that test data supplied from the output driver can be received by a receiver of the same twisted-pair drive block as the output driver; and a comparison circuit that compares test data supplied from an output driver and received by a receiver of the same twisted-pair drive block as the output driver with the expected value data and creates match flags.

Communication control circuit

In an apparatus for polishing a substrate, including a polishing platen for mounting the substrate thereon, a polishing head, a polishing pad adhered to a bottom face of the polishing head, and a rocking section for rocking. I.e., moving the polishing head in the horizontal direction with respect to the polishing platen, a control circuit controls a load of the polishing pad applied to the substrate in accordance with a contact area of the polishing pad to the substrate.

Polishing apparatus and method with constant polishing pressure

A polishing device includes a wafer chuck mechanism which retains a wafer while its plane to be polished faces upward, a polishing pad component which possesses a polishing plane which polishes the wafer, a polishing head, and a shift mechanism which enables a relative displacement of said polishing pad component in relation to the wafer. A fixation and retention mechanism fixes and retains said polishing pad component to the polishing head in a detachable fashion while its polishing plane faces downward. The displacement distance of the shift mechanism ranges from the polishing position of the wafer to the exchange position of the polishing pad component, so that the polishing pad component is automatically exchanged.

Polishing device and polishing pad component exchange device and method

A method of detecting an end point of polishing of a wafer, comprising the steps of: using a color identifying sensor for recognizing a color component of light by applying light from a light source and by converging reflected light to an optical fiber to cause the color identifying sensor to previously recognize a color component of a substance of a wafer which must be polished; displaying an ON-state when the color component is recognized and an OFF-state when the color component is not recognized; one point (except for the central point) of the surface of the rotating wafer is irradiated with light emitted from the color identifying sensor to cause the color identifying sensor to detect the number of times (m) of off-states; and determining an end of polishing of the wafer when the detected number of times (m) coincides with the number (n) of off-states indicating an optimum end point of polishing of the wafer.

Method of detecting end point of polishing of wafer and apparatus for detecting end point of polishing

In a bar code reading optical apparatus including a semiconductor laser and a prism both mounted on a photodiode IC so that emitted light from a semiconductor laser is reflected by a reflective plane of a prism and signal light from a bar code to be read out enters in and detected by a photodiode, a numerical aperture conversion hologram is provided in a light path of the emitted light reflected by the reflective plane of the prism to adjust the numerical aperture of a converging lens so that the numerical aperture for the emitted light be smaller than the numerical aperture for the signal light. The numerical aperture conversion hologram may be omitted by shaping the reflective plane of the prism into a concave plane to adjust the numerical value for the emitted light smaller than the numerical value for the signal light.

Bar code reading optical apparatus

A laser light detect/emit package 3 and a biaxial drive portion 5 for driving the objective lens 4 are supported on a wiring board 1 having wiring patterns 2a and 2b to electrically connect them to the wiring patterns 2a and 2b. Packaged in the laser light detect/emit package 3 are a laser coupler 11 having an optical prism 15 and a laser chip 16 formed on a photo diode IC 14 including photo diodes 12 and 13 for detecting optical signals. In lieu of the laser light detect/emit package 3, an auxiliary wiring board supporting the laser coupler 11 may be inserted and held in a recess formed in the wiring board 1.

Optical pickup device with biaxial drive for objective lens

An optical-electronic integrated circuit device capable of three-dimensionally transmitting optical signals between plural semiconductor substrates on each of which an integrated circuit is previously formed. At least one of the light emitting elements and the light receiving elements are formed on the semiconductor substrate which transmits the light propagated between these elements. In this manner, signals may be transmitted in a direction perpendicular to the semiconductor substrate even without specifically processing the semiconductor substrate. Additionally, signal distortion, transmission losses, mutual intervention or delay are not incurred. For two-dimensionally connecting plural three-dimensionally integrated optical-electronic integrated circuit devices in a direction parallel to the semiconductor substrates, the circuit devices are arrayed on an optical interconnection base plate, and light signals are transmitted by means of a pair of inclined surfaces which are formed on the optical interconnection base plate and which are arranged facing the light emitting element and the light receiving element, and the light waveguide channels defined between these inclined surfaces. This drastically increases the operating speed of the circuit device and the integration degree.

Growing community of inventors

Kanagawa, Japan

Kiyoshi Tanaka