Sharp Kabushiki Kaisha Corporation

Kiyoshi Sawae

Akio Inohara

Takeo Fujimoto

Hisashi Uede

Yoshiharu Kanatani

Hisao Kawaguchi

Masashi Kawaguchi

Kinichi Isaka

Yuji Ohno

A wiring circuit substrate comprises first circuit element means one one side of the substrate connected to electrode lines of X-Y matrix electrodes, respectively, and second circuit element means in the symmetrical position of the first circuit element means on the other side of the substrate connected to the electrode lines of the X-Y matrix electrodes, respectively, wherein each of leads of the first and the second circuit element means is connected to the output and input lines of the X-Y matrix electrodes via through holes, respectively. The first circuit element comprises integrated transisitors for driving the X-Y matrix electrodes. The second circuit element comprises integrated diodes for protecting an overcurrent in the X-Y matrix electrodes.

Symmetrical circuit arrangement for a X-Y matrix electrode

A thin-film electroluminescent display panel is sealed by a pair of glass substrates for protection from the environment. A protective liquid is introduced between a counter glass substrate and a substrate for supporting the electroluminescent display unit. The protective liquid comprises silicone oil or grease which assures the thin-film electroluminescent film of preservation in the electroluminescent display panel. The counter glass substrate is bonded to the support substrate through an adhesive of, for example, photo-curing resin. A capillary tube is provided within the glass substrate for injecting the liquid under vacuum conditions. The liquid has the capability of spreading into pin holes generated on dielectric layers, and is resistant to high voltage, high humidity and high temperature and is inert to layers constituting the thin-film electroluminescent display panel and has a small vapour pressure and a small coefficient of thermal expansion. A moisture absorptive member is introduced into the protective liquid. The member can be an Al film coated by silica gel or silica gel particles themselves. The silica gel particles, if necessary, may be confined within a tube or dispersed within the spacer. Alternatively, they are dispersed within the protective liquid. The Al film is adhered to one of the substrates. The member serves to absorb moisture contained within the protective liquid. The protective liquid can be colored by a dye material to provide a background for the EL device.

Glass sealed thin-film electroluminescent display panel free of moisture

A sealing technique is disclosed by which the firing voltage of atmospheric discharge is increased by a pressurizing procedure such that the internal pressure of a sealing chamber is held at room temperature above half (0.5) of the atmospheric pressure even after the completion of sealing. Preferably, the pressurizing procedure is accomplished by a partial modification in the existing sealing facilities (for example, belt furnaces and low temperature furnaces). In another aspect of the invention, the method for sealing a semiconductor device minimizes water in the chamber after sealing by suppressing water expelled from glass frit during sealing or allowing the glass frit to absorb the water expelled therefrom. In other words, sealing is performed first under nitrogen gas atmosphere and then under oxygen gas atmosphere.

Sealing technique for semiconductor devices

Growing community of inventors

Nara, Japan

Kiyoshi Sawae