Denso Corporation

Denso Corpora Tion

Kiyoshi Otsuka

Inao Toyoda

Takahiko Yoshida

Makiko Sugiura

Junichi Ishikawa

Hiroshi Uchigashima

Osamu Itoh

Tsuyoshi Fukada

Yasuaki Makino

Jun Tarui

Keiji Horiba

Hiroshige Matsui

Michitake Kuroda

Tomohide Ariki

Hirotaka Kurozaki

Naoki Kakoiyama

Kazuhiro Yoshino

Tetsuya Ogawa

A sensor device includes a sensor element detecting a temperature of an attachment member to which the sensor device is attached. The sensor device includes a flexible substrate that includes a base having a first surface and a second surface and made of an electrically insulating material, and a land disposed adjacent to the first surface and electrically connected to the sensor element. The sensor device further includes: a rigid member adhered to the second surface; a flexible member that has a thermal conductivity and a flexibility higher than those of the base, is stacked on the rigid member to be in contact with the rigid member on a side opposite to the flexible substrate, and is to be in contact with the attachment member in an attached state; and a pressing member that presses the flexible substrate toward the attachment member in the attached state.

Sensor device

An adhering matter determination portion includes an irradiation portion, a light receiving portion and a determination portion. The irradiation portion radiates a light to a plurality of different areas of a transparent plate. The light receiving portion converts reflected waves reflected at the different areas into electrical signals. The determination portion compares at least one of detection signals outputted from the light receiving portion with a determination threshold. When the detection signal is lower than the determination threshold, the determination portion determines that there is an adhering matter on the transparent plate. The determination portion compares the detection signals. When a difference of the detection signals is higher than a condensation determination value, the determination portion determines that the adhering matter is raindrops. When the difference of the detection signals is lower than the condensation determination value, the determination portion determines that the adhering matter is dewdrops.

Adhering matter determination device

An optical sensor includes a light receiving portion, a definition portion, and a selection portion. The definition portion defines an incident angle of an incident light that enters the light receiving portion. The selection portion selects a wavelength of the incident light that enters the light receiving portion. The definition portion has a light shielding film disposed above the light receiving portion, and an opening formed in the light shielding film. The selection portion has a slit formed in the light shielding film disposed within a region surrounded by the opening.

Optical sensor

A pressure sensor includes: a housing having a pressure introduction port; and a connector case integrated with the housing. The connector case includes: a protruding portion that protrudes in the pressure introduction port along with the introduction direction from one end of the connector case, and has a concavity hollowed in a direction perpendicular to the introduction direction; a sensor chip having a pressure gauge on one surface of the chip in the concavity; a terminal having one end inserted and molded in the connector case; and a bonding wire that electrically connects the sensor chip and the one end of the terminal. The connector case seals a connection portion between the bonding wire and the terminal, a connection portion between the boding wire and the sensor chip, and the bonding wire.

Pressure sensor and method for manufacturing the same

In a manufacturing method of a pressure detector, a first member that includes a sensing portion for outputting an electric signal in accordance with a pressure, a second member that includes a pressure-receiving diaphragm, and a pressure transmission member are prepared. The pressure transmission member is disposed between the sensing portion and the pressure-receiving diaphragm and the first member and the second member are welded in a state where the pressure is applied from the pressure-receiving diaphragm to the sensing portion through the pressure transmission member. One of the first member and the second member are strained so that a preliminary load, which is applied from the pressure-receiving diaphragm to the sensing portion through the pressure transmission member in a state where no external pressure is applied to the pressure-receiving diaphragm, meets a predetermined value.

Pressure detector and method of manufacturing the same

A pressure sensor for detecting pressure includes: a metallic diaphragm for receiving the pressure; four strain gauges providing a Wheatstone bridge, wherein each strain gauge outputs an electric signal corresponding to deformation of the diaphragm when the diaphragm is deformed by the pressure; and four semiconductor chips corresponding to four strain gauges, wherein each strain gauge is disposed in the semiconductor chip. Each semiconductor chip is mounted on the diaphragm.

Pressure sensor with reduced size strain gauge mounting structure and manufacturing method of the same

A pressure sensor includes a metal housing and a semiconductor chip. The housing has a diaphragm unitary with the housing and an inlet for introducing fluid to the diaphragm. The inlet has a first end exposed to the diaphragm and a second end exposed to an outside of the housing. The housing has a thin-wall portion at the first end of the inlet and the thin-wall portion serves as the diaphragm. The chip is mounted on the diaphragm. The area and thickness of the chip are set so that separation between the chip and diaphragm can be prevented. Since the separation is prevented based on the area and thickness of the chip, there is no need that the diaphragm is made of a material having a thermal expansion coefficient similar to that of the chip.

Pressure sensor

A pressure sensor includes a connector case having a recess, in which a sensor chip is contained and an oil is filled. The recess filled with the oil is sealed by a metal diaphragm. The sensor chip for outputting signals and the circuit chip having a processing circuit for processing the signals from the sensor chip, are stacked. That is, the circuit chip is provided between a bottom wall surface of the recess and the sensor chip. The processing circuit is covered by at least a part of the sensor chip, and the processing circuit of the circuit chip is arranged at a place where the processing circuit can avoid contact with the oil. Because the processing circuit of the circuit chip is not exposed to the oil, the processing circuit can be effectively restricted from being charged due to a polarization of the oil.

Pressure sensor with processing circuit covered by sensor chip

A pressure sensor includes a sensing element in a sensing chamber defined by two cases, one of which is crimped to the other. An internal pressure of the chamber is affected by a crimping force. In the manufacturing process of the pressure sensor, the internal pressure is monitored during crimping the cases. To monitor the internal pressure, the sensing element of the pressure sensor is used. An output signal of the sensing element is sent to a crimping machine. The crimping machine controls a crimping force based on the output signal.

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Kariya, Japan

Kiyoshi Otsuka