Toshiba Lighting & Technology Corporation

Kiyoshi Otani

Masahiro Izumi

Tomohiro Sanpei

Yumiko Hayashida

Yutaka Honda

Shinji Nogi

Akiko Saito

Kiyoshi Nishimura

Miho Watanabe

Junya Murata

A light emitting module () comprises a module substrate (), a light emitting diode string (), and a sealing member (). The light emitting diode string () includes light emitting diode elements () and bonding wires () which connect the light emitting diode elements (). The light emitting diode element () has a pair of element electrodes () and has a rectangular shape extending in a direction along which the element electrodes () are aligned. The sealing member () is laminated on the module substrate () to seal the light emitting diode string (). The light emitting diode elements () are arranged at intervals in a direction crossing the direction along which the element electrodes () are aligned, and the element electrodes () with the same polarity are aligned to be adjacent to each other in an arrangement direction of the light emitting diode elements () between the light emitting diode elements () adjacent to each other. Each bonding wire () is obliquely wired with respect to the arrangement direction of the light emitting diode elements () to connect the element electrodes () with different polarities of the light emitting diode elements () adjacent to each other.

Light emitting module and illumination apparatus

An illumination device includes a base board, an insulator, a conductor, a plurality of semiconductor light-emitting elements and a light-transmissive sealing member. The base board includes a surface and projection portions. The projection portion is formed to become gradually thicker from its end toward the surface of the base board. The insulator is formed on the surface. The conductor is formed on the insulator. The semiconductor light-emitting elements are mounted on the projection portions. The semiconductor light-emitting elements are electrically connected to the conductor via connection members. The sealing member covers the insulator, the projection portions, the semiconductor light-emitting elements and the connection members.

Illumination device with semiconductor light-emitting elements

An object of the present invention to provide a fluorescent lamp in which after formation of a phosphor layer, a glass bulb is bent and in which the phosphor layer is not subject to cracking or peel-off even in bent parts with a small radius of curvature, thus offering a good appearance. A fluorescent lamp includes a glass bulbhaving bent parts, a protective filmhaving a fine grain layercomprising fine grains of average grain size at most 100 nm and attached to an inner surface of the glass bulb, and large-sized grains some of which are buried in the fine grain layerthe other large-sized grains projecting from the fine grain layera phosphor layerformed on the protective filmof the glass bulbdischarge inducing meanssealably installed in opposite ends of the glass bulband a discharge medium sealed in the glass bulb

Fluorescent lamp and illuminating apparatus

Growing community of inventors

Yokosuka, Japan

Kiyoshi Otani