Toshiba Lighting & Technology Corporation

Kabushiki Kaisha Toshiba

Kiyoshi Nishimura

Nobuhiko Betsuda

Shuhei Matsuda

Soichi Shibusawa

Kozo Ogawa

Kozo Uemura

Miho Watanabe

Akiko Saito

Kazuo Egawa

Masahiro Izumi

Hiroki Tamai

Hajime Oono

Makoto Sakai

Yusuke Shibahara

Nobuo Shibano

Tomohiro Sanpei

Tsuyoshi Oyaizu

Toshiya Tanaka

Masahiko Kamata

Seiko Kawashima

Kazuto Morikawa

Akimichi Takahashi

Masatoshi Kumagai

Masao Segawa

Erika Takenaka

Ryotaro Matsuda

Ichiro Yamada

Masahiko Yoshida

Masuo Shibuya

Naoyuki Toda

Kiyoshi Ootani

Keiichi Shimizu

Hirokazu Otake

Yuichiro Takahara

Haruki Takei

Akiko Takahashi

Aiko Takahashi

Hajime Ohno

Ariyoshi Ishizaki

Masami Takagi

Yumiko Hayashida

Tadashi Takada

Takashi Yorifuji

Naoki Tsutsui

Kiyoshi Otani

Tomoko Ishiwata

Hideki Okawa

Kouichi Honda

Takuya Honma

Akihiro Sasaki

Masahiro Ogata

Hirotaka Tanaka

Kunio Yuasa

Miho Saito

Kazuo Shimokawa

Katsuhisa Matsumoto

Shinji Mochimaru

According to one embodiment, there is provided a light-emitting device including a light-emitting section, a thermal radiation member, and a heat conduction layer. The light-emitting section includes a mounting substrate section and a light-emitting element section. The mounting substrate section includes a substrate, a first metal layer, and a second metal layer. The substrate includes a first principal plane including a mounting region and a second principal plane. The first metal layer includes mounting patterns provided in the mounting region. The light-emitting element section includes semiconductor light-emitting elements and a wavelength conversion layer. The semiconductor light-emitting elements are connected to the mounting patterns. The luminous existence of the light-emitting element section is equal to or higher than 10 lm/mmand equal to or lower than 100 lm/mm. The thermal radiation member has an area equal to or larger than five times the area of the mounting region.

Light emitting device and luminaire

A self-ballasted lamp includes: a base body; a light-emitting module and a globe which are provided at one end side of the base body; a cap provided at the other end side of the base body; and a lighting circuit housed between the base body and the cap. The light-emitting module has light-emitting portions each using a semiconductor light-emitting element, and a support portion projected at one end side of the base body, and the light-emitting portions are disposed at least on a circumferential surface of the support portion. A light-transmissive member is interposed between the light-emitting module and an inner face of the globe.

Self-ballasted lamp and lighting equipment having a support portion in contact with an inner circumference of a base body

A light-emitting device includes a substrate having a front surface on which a semiconductor light-emitting element is mounted. A front cover is provided which thermally contacts the front surface of the substrate at a periphery of the semiconductor light-emitting element and is disposed on a front side of the substrate. A heat conduction path is formed along which heat generated by the semiconductor light-emitting element is conducted in order of the substrate and the front cover and the heat is radiated from a front surface of the front cover, so that a heat radiation property from a front surface of the light-emitting device is improved.

Light-emitting device and lighting apparatus

According to one embodiment, the light-emitting apparatus is provided with a substrate, a plurality of light-emitting devices, and a phosphor layer. The plurality of light-emitting devices are mounted on the substrate. The phosphor layer is formed of a translucent resin containing a phosphor and includes a phosphor portion that is formed in a convex shape and covers a predetermined number of the light-emitting device. Bases of the adjacent phosphor portions are formed by being linked with one another.

Luminaire and light-emitting apparatus with light-emitting device

A luminaire includes a semiconductor light source having a light emission peak in a range of wavelength smaller than 480 nm and a phosphor excited by light radiated from the semiconductor light source to radiate light having wavelength equal to or larger than 480 nm. A spectrum of radiated light obtained by combining the light radiated from the semiconductor light source and the light radiated from the phosphor has a light emission peak in a range of wavelength equal to or larger than 610 nm and smaller than 650 nm. A ratio of radiation energy in a range of wavelength equal to or larger than 650 nm and equal to or smaller than 780 nm to radiation energy in a range of wavelength equal to or larger than 600 nm and smaller than 650 nm is equal to or lower than 35%. A color gamut area ratio exceeds 100%.

Luminaire

According to one embodiment, a light emitting device which is attached to an illumination apparatus and radiates light having a correlated color temperature of 2900 to 3600K is provided. The light emitting device includes a substrate, blue light emitting LED elements and red light emitting LED elements mounted on the substrate, and a wavelength converting unit. The red light emitting LED elements have a luminous intensity of 0.2 to 2.5 times as large as that of the blue light emitting LED elements at normal use temperature in a state where the light emitting device is attached to the illumination apparatus. The wavelength converting unit is excited by light emitted from the blue light emitting LED elements and converts the light to light having a peak wavelength within a range of 500 to 600 nm.

Light emitting device and illumination apparatus

A light-emitting device includes a substrate, and a plurality of light-emitting elements mounted on the substrate. The light-emitting elements are placed to meet conditions that the number B of light-emitting elements per unit area (cm) of a mounting part is not less than 0.4 and a mean mounting density D is not less than 58 to not greater than 334, when a relationship of formula 'D=A&#xd7;B' is established, assuming D as a mean mounting density of light-emitting elements on a substrate, A as a current (mA) flowing through one light-emitting element, and B as the number of light-emitting elements per unit area (cm) of a substantial mounting part for light-emitting elements.

The light source unit is provided with a substrate and a decorative cover having thermal conductivity. The substrate includes a circuit pattern area, in which a plurality of LED chips are disposed, at the middle part thereof, has thermal conductivity, and transmits heat from the circuit pattern area to an area in the outer circumferential direction thereof. The decorative cover encloses the substrate, is electrically insulated from the circuit pattern area, and is thermally coupled to the surface side of the substrate at the periphery of the circuit pattern area by being face-contacted thereto. Heat of the substrate can be radiated by the decorative cover while securing an electric insulation property with respect to the circuit pattern area.

Light source unit and lighting system

Self-ballasted lamp having a light-transmissive member in contact with light emitting elements and lighting equipment incorporating the same

A light-emitting device includes a substrate, a reflecting layer formed on the substrate, a light-emitting element placed on the reflecting layer, and a sealing resin layer that covers the reflecting layer and the light-emitting element. The oxygen permeability of the sealing resin layer is equal to or lower than 1200 cm/(m&#xb7;day&#xb7;atm), and the ratio of the area of the reflecting layer covered by the sealing resin layer to the entire area on the resin substrate covered by the sealing resin layer is between 30% and 75% inclusive.

Light-emitting device and luminaire

According to one embodiment, a light-emitting device comprises a substrate on which a plurality of light-emitting elements are arranged and mounted in two lines; and sealing members of two lines each sealing the plurality of light-emitting elements of each line. A distance between the lines of the sealing members is equal to 0.5 times or more but 2 times or less a width of the sealing member of each line.

Light-emitting device and illumination device

According to one embodiment, a light-emitting device comprises a substrate on a surface of which a light-emitting element is mounted, a light reflection layer formed on a second area of the surface of the substrate other than a first area on which the light-emitting element is mounted, and a sealing member sealing the light-emitting element. An engagement protrusion part protruding toward the sealing member is provided at an edge part of the light reflection layer at which the light reflection layer is in contact with the area on which the light-emitting element is mounted. The engagement protrusion part juts out into the sealing member to prevent exfoliation of the sealing member.

A spotlight is provided with a substrate having LEDs disposed thereon and a main body casing on which the substrate is provided. The main body casing has a rear side portion having thermal conductivity, which is thermally coupled to the substrate, and is capable of changing the irradiation angle of light emitted from the LEDs. A plurality of heat-radiating fins for forming grooves operating as a plurality of convection paths along the direction of changing the irradiation angle are provided on the rear side portion of the main body casing.

Lighting system

A light source module includes a module substrate, a metal conductor, a plurality of semiconductor light emitting elements, a white diffuse reflection layer, and translucent sealing members. The metal conductor is provided in a predetermined pattern on a front surface of the module substrate. The semiconductor light emitting elements are electrically connected to the metal conductor and mounted on the front surface of the module substrate. The white diffuse reflection layer includes a plurality of holes in which the semiconductor light emitting elements are located, is thinner than the semiconductor light emitting elements, and is laminated to the front surface of the module substrate. The translucent sealing members bury the semiconductor light emitting elements, project below the diffuse reflection layer, and are mixed with a phosphor.

Light source module and lighting apparatus

According to one embodiment, a light emitting device includes a ceramics substrate, a metallic thermally-conductive layer formed on the substrate in which the substrate involves no electric connection, a light emitting element mounted on the metallic thermally-conductive layer, and a metallic bonding layer interposed between the metallic thermally-conductive layer and the light emitting element to bond the light emitting element to the metallic thermally-conductive layer.

Light emitting device and lighting apparatus

Growing community of inventors

Yokosuka, Japan

Kiyoshi Nishimura