Nikko Company

Lexmark International, Inc.

Nichiyu Giken Kogyo Co., Ltd.

Kiyoshi Mizushima

Makoto Aoki

Jerry Wayne Smith

Douglas Campbell Hamilton

Larry Earl Stahlman

Hisakazu Hujimoto

Motoharu Miyakoshi

Mikio Takimoto

Mamoru Mohri

Naoki Kidani

Satoshi Ikeda

Hiroshi Sato

Noriyuki Tanagi

Mamoru Mouri

Satoshi Nakamura

Shinzo Tsuji

Eiji Arai

Masashi Watanabe

A method for forming a ceramic laminate ceramic laminate from first and second sheets of ceramic material, the sheets having a first and a second surface, wherein the first ceramic material has a different coefficient of thermal expansion than the second ceramic material and the outer layers comprises ceramic materials having substantially the same thermal properties, comprising (a) heating the first and the second sheets of ceramic material; (b) stacking the first and the second sheets of ceramic material wherein the second surfaces are opposed to one another to provide stacked sheets; and (c) pressing the stacked sheets and forming the ceramic laminate.

Method for forming a ceramic laminate

A low temperature sintering ceramic composition can be sintered at 850 to 1,000&#xb0; C., and the sintered ceramic has a low dielectric constant (9 or less at 16 Ghz or more) and a high Qf (10,000 or more). The composition can be co-sintered with wiring material containing Ag, Au, or Cu. The ceramic composition includes (by mass) CaO, MgO, and SiOin total: over 60% to 98.6%; BiO: from 1% to under 35%; and LiO: from 0.4% to under 6%; wherein (CaO+MgO) and SiOare contained in the molar ratio of from 1:1 to under 1:2.5.

Low temperature sintering ceramic composition for high frequency, method of fabricating the same and electronic component

A low temperature sintering ceramic composition that can be sintered at a temperature equal to or less than 1000&#xb0; C. and has low dielectric constant and dielectric loss in a high frequency region of 17 Ghz or more, an electronic component using the same and a method of fabricating the low temperature sintering ceramic are provided. The composition comprises MgO and SiOin sum total in the range of from 64.0 to 99.2% by mass; BiOin the range of from 0.4 to 33.0% by mass; LiO in the range of from 0.4 to 3.0% by mass; and MgO and SiOare contained in the molar ratio of from 2:1 to 2:3.5, at least part thereof being contained as a complex oxide of Mg and Si.

Low temperature sintering ceramic composition for use in high frequency, method of fabricating the same and electronic component

A large area heater used, for example, in a laser printer belt fuser or as cooking surface, has an alumina substrate in which two bowed parts of alumina ceramic having opposed concave regions are formed together as a laminate. Electrical resistors are deposited on the laminate. The alumina laminate provides excellent resistance to uneven heating or other thermal stress. Alumina ceramic is readily shaped during manufacture and manufacturing costs and yield are good. A wide variety of large area heaters can usefully employ the laminate.

Large area alumina ceramic heater

A ball-grid-array-type semiconductor device comprising a package substrate constituted with a ceramic wiring board having a semiconductor chip mounting portion on the principal plane and electrodes arranged like an array on the back, a semiconductor chip secured to the principal plane of the package substrate, connection means for electrically connecting the electrodes of the semiconductor chip with the wiring of the wiring board, a sealing body provided for the principal plane side of the wiring board and made of an insulating resin to cover the semiconductor chip and the connection means, a pedestal layer made of low-fusion-point solder and formed on the electrodes, and a metallic ball secured onto the pedestal layer; wherein a buffering layer made of high-fusion-point solder which covers the entire surface of the electrodes and whose margin extends up to a predetermined length on the back of the package substrate is formed on the electrodes and the pedestal layer is formed on the buffering layer.

Ball-grid-array-type semiconductor device and its fabrication method and electronic device

A process for fabricating an electronic component having a hollow packaging structure comprises the steps of: (a) printing an organic polymeric material on at least a portion of a main surface of a ceramic substrate where a ceramic lid is to be bonded and curing the printed organic polymeric material to form a cured product; (c) hermetic sealing the ceramic lid on a surface of the cured product with an organic bonding agent; and preferably (b) irradiating ultraviolet rays onto a surface of said cured product to form activated bonding sites between said steps (a) and (c). According to the process, a hollow package mounted with an electronic component can be fabricated efficiently.

Fabrication of electronic components having a hollow package structure

The exothermic instrument for firing an explosive comprises a circuit board 1 having a heat resist layer 6 on a substrate 11 and an exothermic resistance 4, which connects to a pair of through hole conductive electrodes 13 passing through the substrate 11, contacting with the explosive 19 on the heat resist layer 6, a pair of electrode pins 8, each one thereof is inserted into each one of the through hole conductive electrodes, and an insulator for holding the circuit board 1 through which the electrode pins 8 pass.

Exothermic instrument for firing explosive

A conductor paste for plugging a through-hole in a ceramic substrate which includes an electrically conductive powder having a metal powder as its main component, a swelling agent and a vehicle, and may also include adhesion improvers. After sintering the conductor paste, a conductor plug is created which will not fall out of the through-hole, is resistant to chipping during the leveling process and may be gas impermeable.

Growing community of inventors

Matto, Japan

Kiyoshi Mizushima