Kaneka Corporation

Kiyoshi Miyafuji

Katsuyu Wakabayashi

Toshihiko Okamoto

Toyohisa Fujimoto

Ayako Yano

Tatsuro Harumashi

Yu Itano

A multi-part curable composition includes an A part including a polyoxyalkylene polymer (A) having a reactive silicon group, a (meth)acrylic ester polymer (B) having a reactive silicon group, an epoxy resin curing agent (D) having a tertiary amine moiety, an alicyclic structure-containing amine (E1), and a B part including an epoxy resin (C). Each of the reactive silicon groups of the polymer (A) and polymer (B) are represented by —SiRX. Ris a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, X is a hydroxy group or a hydrolyzable group, and c is 0 or 1. A multi-part curable composition includes an A part including the polymer (A), polymer (B), and an epoxy resin curing agent (D) having a tertiary amine moiety, and a B part including an epoxy resin (C), where either or both of the A and B parts include an amino alcohol compound (E2).

Curable composition

A curable composition includes a (meth)acrylic acid ester polymer (A), wherein the (meth)acrylic acid ester polymer (A) includes a monomer and a macromonomer (a). The monomer includes a reactive silicon group represented by the general formula (1): &#x2014;SiRX(1) (in the formula, Rrepresents a substituted or unsubstituted hydrocarbon group with 1 to 20 carbon atoms, X each independently represents a hydroxyl group or a hydrolyzable group, and a represents 0 or 1.) and a polymerizable unsaturated group. The macromonomer (a) is a (meth)acrylic acid ester polymer having a polymerizable unsaturated group.

A curable composition includes organic polymer (A) having more than one reactive silicon group on average per molecule, represented by formula (1): &#x2014;SiRX(1), wherein Ris a substituted or unsubstituted hydrocarbon group having 1-20 carbon atoms, each X is independently a hydroxy group or a hydrolyzable group, and a is 0 or 1, and (meth)acrylate-based polymer (B) having a reactive silicon group represented by formula (2): &#x2014;SiX(2), wherein each X is as defined for the formula (1), polymer (B) has a reactive silicon group equivalent of not less than 0.30 mmol/g, and wherein a monomer (b1) is free of a reactive silicon group, a glass transition temperature of its homopolymer is not more than 80&#xb0; C., and is contained as monomer(s) constituting polymer (B) in a proportion of not less than 40 wt % per 100 wt % of total monomer.

An object of the present invention is to provide a curable composition that can be used as sealing materials, adhesives, and the like, has excellent curing properties, and gives a cured product excellent in elongation properties. The object can be attained by means of a curable composition comprising: a reactive silyl group-containing polyether polymer (A) that contains a reactive silyl group with high activity (e.g., (ClCH)(CHO)Si&#x2014;, (CHOCH)(CHO)Si&#x2014;, or CH(CHO)Si&#x2014;CH&#x2014;NH&#x2014;C(&#x2550;O)&#x2014;); and a reactive silyl group-containing polyether polymer (B) that contains a reactive silyl group (e.g., CH(CHO)Si&#x2014; or (CHO)Si&#x2014;) different from that mentioned above and/or a (meth)acrylic polymer (C) containing a reactive silyl group that is not particularly limited.

The present invention aims to provide a curable composition that is usable in fast curing adhesives and the like and has excellent curability and excellent initial adhesion. The aim is accomplished by use of a curable composition that contains a polyoxyalkylene polymer (a1) having a reactive silyl group (e.g., trimethoxysilyl group) equivalent of 0.15 mmol/g to 1.5 mmol/g and a polyoxyalkylene polymer (a2) having a reactive silyl group equivalent of 0.010 to 0.14 mmol/g. Preferably, the polymers (a1) and (a2) both have a backbone with at least one branch.

An object of the present invention is to provide a curable composition that provides high hardness and can be used in adhesives and coating agents. This object can be achieved by a curable composition containing: 100 parts by weight of a reactive silyl group-containing organic polymer (A) that has a number average molecular weight of 2,000 to 6,000 and contains 1.3 to 5 reactive silyl groups per molecule; and 0 to 40 parts by weight of a plasticizer (C). This curable composition is suitable for flooring adhesives and tile adhesives, which require high hardness.

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Takasago, Japan

Kiyoshi Miyafuji