Nichia Corporation

Kiyoshi Kayama

Ryohei Yamashita

Seitaro Akagawa

Ryosuke Wakaki

Toshiyuki Hashimoto

Yuta Horikawa

Kazuki Koda

Shohei Mori

Akinobu Maeda

A light emitting device includes: a resin package including first and second leads, and a resin part defining a recess defined by a lateral wall and an upward-facing surface, which includes an upper surface of a portion of each of the first lead, the second lead, and the resin part; and a light emitting element on the first lead. The resin part includes a holding resin portion between the first and second leads at the upward-facing surface, and a covering resin portion that covers a portion of the upper surface of the holding resin portion and a portion of an upper surface of at least one of the first and second leads. A portion of an upper surface of the holding resin portion is exposed from the covering resin portion, and is located on the same plane as the upper surfaces of the first and second leads.

Light emitting device

A light emitting device includes a resin package having a rectangular shape in a top view and two short-side lateral surfaces and two long-side lateral surfaces. The two short-side lateral surfaces include a first external surface and a second external surface located on an opposite side from the first external surface. The two long-side lateral surfaces include a third external surface and a fourth external lateral surface located on an opposite side from the third external lateral surface. The lead is not exposed on the third external lateral surface nor the fourth external lateral surface. The first lead is exposed at the first external lateral surface and the second external lateral surface, respectively flush with the resin member at the first external lateral surface and the second external lateral surface. The second lead is exposed at the second external lateral surface, flush with the resin part at the second external lateral surface.

Light emitting device and lead frame with resin

A base member includes a lead frame and a resin molded body in which the lead frame is embedded. The resin molded body and the lead frame define a plurality of recesses arranged in a matrix along a first direction and a second direction orthogonally crossing the first direction in a plan view. The resin molded body has a plurality of bottom surface portions each defining a part of a bottom surface of a corresponding one of the recesses, and a wall portion surrounding each of the bottom surface portions in the plan view, with an upper surface of the wall portion defining at least one a groove portion extending in the first direction or the second direction.

Base member, and method of manufacturing light emitting device using same

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Anan, Japan

Kiyoshi Kayama