Mitsubishi Electric Corporation

Internet Initiative Japan, Inc.

Mitsubishi Denki Kabushiki Kaisha

Kiyoshi Ishida

Hidenori Ishibashi

Yukinobu Tarui

Makoto Kimura

Hideharu Yoshioka

Katsumi Miyawaki

Kenichiro Hayashi

Naofumi Yoneda

Takayuki Nakao

Dai Nakajima

Shintaro Shinjo

Yoshihiro Tsukahara

Masaomi Tsuru

Taketoshi Shikano

Akimichi Hirota

Takeshi Yuasa

Tetsu Owada

Yoichi Kitamura

Eigo Kuwata

Hiroyuki Mizutani

Kohei Nishiguchi

Hideki Morishige

Hiroaki Matsuoka

Tsuneo Hamaguchi

Hiroyuki Aoyama

Takumi Nagamine

Tomohiro Tanishita

Satoshi Ebisawa

Keiko Shirafuji

Masaru Oki

Hiroki Suenaga

Masanobu Saitoh

In an array antenna apparatus, a first height of top faces of plurality of antenna elements is greater than or equal to a second height of a first top of a first electronic component relative to a first primary surface. The first electronic component is the tallest among one or more electronic components mounted on fourth primary surfaces of one or more first external circuit boards. A third height of a second primary surface is greater than a fourth height of fourth primary surfaces. Accordingly, the array antenna apparatus has good antenna characteristics.

Array antenna apparatus and method for fabricating same

A microwave device includes: a multilayer resin substrate being a first multilayer resin substrate; an IC being a radio frequency circuit provided on the multilayer resin substrate and electrically connected to the multilayer resin substrate; a heat spreader provided on a side opposite to the multilayer resin substrate across the IC, and in contact with the IC; a mold resin covering the periphery of the IC and the heat spreader; and a conductive film covering the mold resin and the heat spreader, where an inner side of the conductive film is in contact with the heat spreader, and the conductive film is electrically connected to a ground via hole of the multilayer resin substrate.

Microwave device and antenna for improving heat dissipation

A semiconductor device is provided that has high electromagnetic wave shielding properties while exhibiting good heat dissipation. The semiconductor device includes a semiconductor package bonded onto a circuit board, an electromagnetic wave absorbing layer covering surfaces of the semiconductor package other than a surface bonded to the circuit board, and an electromagnetic wave reflecting layer covering the electromagnetic wave absorbing layer on a side remote from the semiconductor package, in which the electromagnetic wave absorbing layer is made of resin containing magnetic particles or carbon, and the electromagnetic wave reflecting layer is made of resin containing conductive particles.

Semiconductor device having electromagnetic wave absorbing layer with heat dissipating vias

A semiconductor device includes a single lead frame, a semiconductor element, and a mold material. The semiconductor element is joined onto one main surface of the lead frame. The lead frame includes a die-attach portion, a signal terminal portion, and a ground terminal portion. The die-attach portion, the signal terminal portion, and the ground terminal portion are disposed directly below the mold material so as to be arranged in a direction along one main surface. A groove portion is provided by partially removing the lead frame so as to allow the groove portion to pass therethrough, the groove portion being provided between the die-attach portion and the ground terminal portion adjacent to each other in the lead frame and between the signal terminal portion and the ground terminal portion adjacent to each other in the lead frame.

Semiconductor device and method of manufacturing the same

A semiconductor package includes a package main body. The package main body includes: a lead frame that includes first terminals and a die pad; two or more integrated circuit chips that are disposed on the die pad; one or more electrically conductive members that are disposed on the die pad; wires that connect the first terminals and the integrated circuit chips electrically; and a molded member that seals the lead frame, the integrated circuit chips, the electrically conductive member, and the wires. An upper surface, a bottom surface, and side surfaces of the package main body are formed by the molded member. The electrically conductive member is exposed through the upper surface of the package main body, and the die pad is exposed through the bottom surface of the package main body.

Semiconductor package and module

A semiconductor device includes a substrate, a semiconductor element, a ground pad, an insulating coating member, a conductive bonding member, and a conductive cap. The inner peripheral end of a bottom of the conductive cap is disposed at a side close to the inner periphery of the insulating coating member relative to the outer peripheral end of the insulating coating member. The bottom has a shape in which the distance between the main surface and itself decreases continuously from its outer peripheral end toward its inner peripheral end.

Semiconductor device, and method of manufacturing the same

A semiconductor device functioning properly by maintaining an electromagnetic shielding structure by a conductor layer is provided. A semiconductor device includes a wiring board having a surface, a semiconductor element, an insulating layer, and a conductor layer. The semiconductor element is arranged on the surface of the wiring board. The insulating layer is located on the surface of the wiring board and arranged to surround the semiconductor element. The conductor layer covers an outer peripheral surface of the insulating layer, and is connected to the wiring board. The outer peripheral surface of the insulating layer includes an upper surface located over the semiconductor element, and a side surface connecting the upper surface and the wiring board. The side surface includes a reverse tapered portion. The conductor layer is in contact with a surface of the reverse tapered portion.

A printed wiring board includes conductor layers, a core layer having an opening, and a build-up layer. A high frequency device placed within the opening is installed such that a mirror surface is thermally connected to a conductor layer for heat dissipation facing the opening from a lower surface side of the core layer, and terminals on the terminal surface are electrically connected to conductor layers formed on an upper surface side of the core layer.

High frequency circuit

A lead frame includes: a second terminal that is disposed to surround terminals on a package plane and can be grounded; and a conductive member that covers molded resin and is electrically connected to the second terminal.

Semiconductor package

A surface mount high-frequency circuit is configured such that a plurality of ground padsand a plurality of external connection ground conductorsare discretely disposed to surround a signal line padand an external connection signal line conductorand a plurality of interlayer connection ground conductorsand that a plurality of columnar ground conductorsare discretely disposed to surround an interlayer connection signal line conductorThus, it is possible to suppress radiation of an unnecessary signal to the outside using a simple production process that is completed by only a wafer process without separately preparing a component such as a shield cover case.

Surface mount high-frequency circuit

To provide a system enabling a function for implementing providing of a service desired by an end user to be automatically generated in a network connecting appliance. When a resource server (RS) receives a request for a specification which is desired to be implemented from a particular service adapter (SA), the requested specification is analyzed by a specification analyzing device, a virtual service adapter is formed by collecting functional modules required to implement the specification, and the formed virtual service adapter is provided for the requesting service adapter. The virtual service adapter is automatically set as a physical service adapter to implement an actually requested function in a service adapter at an end user's place.

Automatic functionality generating mechanism for network connecting appliances

In accordance with the present invention, a plurality of routers in more than one network based on different protocols can be integrally managed. The management system of the present invention is capable of integrally managing a plurality of routers in a network based on IPv6 from another network based on IPv4, wherein a relay server receives the identification data from a router, and transmits it to a LAN server. The LAN server uses the received identification data, and pushes the configuration data prepared in advance for the accessing router into the router. The relay server, which has a converting function between IPv4 and IPv6, manages the network on the routers side by IPv6 while it manages the network on the LAN server's side by IPv4.

Integrated management system and method for network connection means in networks having different telecommunication protocols

A resin-sealed semiconductor device includes a metallic plate and a semiconductor element soldered thereto. The metallic plate has a semiconductor element mounting region formed on one surface thereof and a plurality of squared recesses defined lengthwise and crosswise in the one surface at approximately regular intervals at locations other than the semiconductor element mounting region.

Growing community of inventors

Tokyo, Japan

Kiyoshi Ishida