Tdk Corporation

Kiyoshi Hatanaka

Toshio Sakurai

Masaaki Ikeda

Tatsuya Fukunaga

Haruo Nishino

Shigemitsu Tomaki

Masaharu Hirakawa

Takashi Fukui

Yasuharu Miyauchi

Kenji Endou

Tomohiro Arashi

Hideaki Ninomiya

Hideaki Fujioka

Toshiyuki Suzuki

Shingo Suzuki

Takahiro Fujimori

Kyung-Ku Choi

Hisashi Kobuke

Kensaku Asakura

Raitarou Masaoka

Tomoko Nakamura

Yasunori Sakisaka

Toshinobu Miyakoshi

Tomoaki Kawata

The present invention relates to an electrostatic discharge protection device provided with an insulating laminate containing a first and a second insulating substrate stacked there, a first and a second discharge electrode disposed inside the insulating laminate, a first insulating layer having glass disposed on the side surfaces of the first and the second discharge electrodes, a second insulating layer having glass disposed on the main surfaces of the first and the second discharge electrodes, and an discharge inducing section disposed between the side surfaces of the first and the second discharge electrode, wherein, the distance between the side surfaces of the first and the second discharge electrodes was set as &#x394;G and the thickness of the second insulating layer was set as &#x394;Z which two adapt to inequations 3 &#x3bc;m&#x2266;&#x394;Z&#x2266;35 &#x3bc;m and &#x394;G&#x2266;40 &#x3bc;m.

ESD protection device

A transmission line is provided with a line portion with a first relative permittivity which is composed of a first dielectric and a conductor filler dispersed in the first dielectric, and a surrounding dielectric portion composed of a second dielectric with a second relative permittivity, wherein, the surrounding dielectric portion exists around the line portion in a cross section perpendicular to a direction in which electromagnetic waves transmit in the line portion, the first relative permittivity is 600 or more, and the second relative permittivity is smaller than the first relative permittivity. An electronic component has the transmission line. Further, an electronic component is provided with a resonator having a resonant frequency ranging from 1 GHz to 10 GHz, wherein, the resonator is formed by using the transmission line.

Transmission line and electronic component

A transmission line and an electronic component including a resonator using the transmission line are provided. The transmission line is capable of transmitting electromagnetic waves of at least one frequency ranging from 1 GHz to 10 GHz and is composed of a first dielectric with a first relative permittivity and a surrounding dielectric portion composed of a second dielectric with a second relative permittivity, wherein, the first dielectric is represented by a formula of {XBaO.(1&#x2212;X)SrO}TiO(0.25&#x3c;X&#x2266;0.55), and the second relative permittivity is smaller than the first relative permittivity.

A dielectric line includes a line portion and a surrounding dielectric portion. The line portion is formed of a first dielectric having a first relative permittivity. The surrounding dielectric portion is formed of a second dielectric having a second relative permittivity. The line portion propagates one or more electromagnetic waves of one or more frequencies within the range of 1 to 10 GHz. In a cross section orthogonal to the direction of propagation of the one or more electromagnetic waves through the line portion, the surrounding dielectric portion is present around the line portion. The first relative permittivity is 1,000 or higher. The second relative permittivity is lower than the first relative permittivity.

Dielectric line and electronic component

A ceramic electronic component includes a first dielectric layer, a second dielectric layer, and a boundary reaction layer. The first dielectric layer is a layer containing BaO, NdO, and TiO, the second dielectric layer is a layer containing a material different from the material of the first dielectric layer, and the boundary reaction layer is a layer formed between the first dielectric layer and the second dielectric layer and containing at least one of Zn, Ti, Cu, and Mg.

Ceramic electronic component and method of manufacturing ceramic electronic component

A dielectric ceramic composition includes a component represented by composition formula {&#x3b1;(xBaO.yNdO.zTiO)+&#x3b2;(2MgO.SO)} as a main component and zinc oxide, boron oxide, and a glass having a softening point equal to or lower than a certain temperature as minor components with respect to the main component. In the dielectric ceramic composition, x, y, and z that respectively represent molar ratios of BaO, NdO, and TiOare in certain ranges and &#x3b1; and &#x3b2; that represent volume ratios of subcomponents (xBaO.yNdO.zTiOand 2MgO.SiO) in the main component are in certain ranges. When the minor components are respectively represented by aZnO, bBO, and cglass, a, b, and c that represent mass ratios of the respective minor components to the main component are in certain ranges.

Dielectric ceramic composition

The present invention provides an RF module capable of converting electromagnetic waves in the TE mode to balanced electromagnetic waves in the TEM mode without adjustment and outputting the balanced electromagnetic waves while easily realizing miniaturization. The RF module includes: a waveguide in which a half-wavelength TE mode resonator is formed; an E plane coupling window formed in a wall portion orthogonal to an H plane out of wall portions constructing the TE mode resonator in the waveguide; an output line provided at the edge on the side of the wall portion parallel with the H plane on the E plane coupling window, and magnetically coupled to electromagnetic waves in the TE mode resonator; and another output line provided at the edge on the side of the wall portion parallel with the H plane in the E plane coupling window, and magnetically coupled to the electromagnetic waves.

RF module

The present invention provides an RF module capable of converting electromagnetic waves in the TE mode to balanced electromagnetic waves in the TEM mode without adjustment and outputting the balanced electromagnetic waves while easily realizing miniaturization. The RF module includes: a waveguide () in which a half-wavelength TE mode resonator () is formed; an E plane coupling window () formed in a wall portion () orthogonal to an H plane out of wall portions () to () constructing the TE mode resonator () in the waveguide (); an output line () provided at the edge on the side of the wall portion () parallel with the H plane on the E plane coupling window (), and magnetically coupled to electromagnetic waves in the TE mode resonator (); and another output line () provided at the edge on the side of the wall portion () parallel with the H plane in the E plane coupling window (), and magnetically coupled to the electromagnetic waves.

A multilayer ceramic substrate includes a plurality of ceramic layers laminated each other. The plurality of ceramic layers form a bulge and a cavity having such a shape that an opening area of the cavity gradually becomes smaller toward a bottom of the cavity.

Multilayer ceramic substrate

A highly reliable ceramics substrate which can sufficiently secure a bonding strength of a surface conductor in an initial state and after a lapse of time (e.g., after a PCT) is provided. The multilayer ceramics substrate has a surface conductor on at least one surface of a multilayer body constituted by a plurality of laminated ceramics substrate layers. A reaction phase formed by a reaction between a ceramics component in the ceramics substrate layers and a glass component in the surface conductor is deposited at an interface between the surface conductor and ceramics substrate layers. For example, an alumina filler in the ceramics substrate layers and Zn in the surface conductor react with each other, thereby forming ZnAlOas the reaction phase.

Multilayer ceramics substrate

A multilayer ceramic substrate having a cavity is formed by the steps of laminating a plurality of ceramic green sheets including ceramic green sheets having through holes corresponding to the cavity to form a multilayer body, pressing the multilayer body and firing the pressed body. At this time, a shrinkage suppression green sheet is laminated on the surface of the a ceramic green sheet constituting the outermost layer of the multilayer body, and a shrinkage suppression green sheet piece is disposed on the ceramic green sheet exposed to the bottom of the cavity in accordance with the shape of the cavity. A burnable sheet is further disposed on the shrinkage suppression green sheet piece. Before the pressing step, an embedded green sheet separate from the ceramic green sheets (portion separated by inserting a cut) is disposed on the shrinkage suppression green sheet piece or the burnable sheet so that it is filled in the cavity. After the firing step, the embedded green sheet fired is removed.

Production method of a multilayer ceramic substrate

The present invention provides an RF module capable of outputting balanced electromagnetic waves without requiring adjustment and easily realizing miniaturization. The RF module includes: a waveguide () having an area which is surrounded by a pair of ground electrodes () and () provided so as to face each other and through holes () for making electric conduction between the pair of ground electrodes () and () and in which electromagnetic waves in the TE mode can propagate and a one-wavelength resonator () is formed; and a pair of output lines () and () connected to portions corresponding to half-wavelength resonance regions (A) and (B) of the one-wavelength resonator () in the ground electrode ().

An object of the invention is to connect different dielectrics electrically to each other in the direction of main surface of a sheet in a multilayer ceramic substrate and to increase the degree of flexibility in design and make the multilayer ceramic substrate compact in size. A multilayer ceramic substrate in accordance with the invention is formed of a plurality of laminated ceramic substrates including such a composite ceramic substrate of different materials that is made by inserting the second ceramic substrate in a pounched-out portion made in the first ceramic substrate and by planarizing its top and bottom surfaces, wherein a conductive layer is formed in a portion across a boundary between the first ceramic substrate and the second ceramic substrate of the interface of the composite ceramic substrate of different materials.

Production method for a multilayer ceramic substrate

A method for producing a multilayer ceramic substrate having a cavity formed therein includes punching a through opening corresponding to the cavity in green sheets constituting a laminate, and printing a conductor at a predetermined position of the green sheets, laminating the green sheets to constitute a green sheet laminate, and applying a pressure to the green sheet laminate by using a compression member having a projection at a position corresponding to the cavity to thereby compress the green sheet laminate. The projection has a height which is equal to the depth of the cavity multiplied by compression ratio of the green sheet laminate, and the green sheet laminate is compressed by applying the pressure such that compression ratio of the bottom of the cavity is identical with the compression ratio of other parts of the green sheet laminate.

Growing community of inventors

Tokyo, Japan

Kiyoshi Hatanaka