Agilent Technologies, Inc.

Kiyoshi Chikamatsu

Hiroyuki Shimizu

Kayoko Tajima

Minoru Uchida

A testing method for a TFT array substrate using a self-emitting element drive where pixels are arranged in a matrix and each pixel comprises a drive transistor having a gate formed from a first structural material and a source and a drain formed from a second structural material, and a hold capacitor having a first electrode formed from the first structural material and a second electrode formed from the second structural material, where the testing method comprises a first step for applying a first voltage to the hold capacitor; a second step for applying a second voltage to the hold capacitor after the first step; a third step for measuring the charge in the pixel after applying the second voltage; and a fourth step for calculating the capacitance of the hold capacitor from the charge and the potential difference between the first voltage and the second voltage.

Method and apparatus for testing TFT array

A high-insulated stud comprises a first columnar conductive terminal of a first height, a second columnar conductive terminal of a second height lower than the height of the first conductive terminal that is placed in a row with and at a distance from the first conductive terminal, an insulating pedestal, and a first groove open at the top and a second groove intersecting the first groove and shallower than the first groove at the top of the first conductive terminal and a third groove open at the top, which is parallel with the first groove and whose bottom face is almost the same height as the bottom face of the first groove, at the top of the second conductive terminal.

High-insulated stud and printed circuit board therewith

A reed relay with which offset current is prevented competently, even when a coil is excited for relay operation, and high-speed, high-accuracy measurement of very low signals is possible, and energy consumption and production costs during assembly are low. The reed relay comprises a reed switch, an electrostatic shielded pipe through which the reed switch passes, an insulating support members and that support the reed switch inside the electrostatic shielded pipe, a coil bobbin that has a tube for insertion of electrostatic shielded pipe, and a coil wound and installed around the bobbin.

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Kanagawa, Japan

Kiyoshi Chikamatsu