Seiko Instruments Inc

Sii Crystal Technology Inc.

Kiyoshi Aratake

Masashi Numata

Keiji Sato

Hitoshi Takeuchi

Takahiko Nakamura

Masayoshi Shiraishi

Yasuo Kawada

Kazuyoshi Sugama

Takeshi Sugiyama

Junya Fukuda

Daisuke Terada

Osamu Onitsuka

Yasuhiro Nohara

Sumihiko Kurita

Provided are a vacuum package and a method for manufacturing the vacuum package having excellent airtightness and capable of improving mounting strength, and a piezoelectric vibrator, an oscillator, an electronic device, and a radio-controlled timepiece. The package includes a base substrate and a lid substrate bonded to each other, a cavity formed between the base substrate and the lid substrate and configured to be capable of sealing a piezoelectric vibrating reed, and penetration electrodes penetrating through the base substrate in the thickness direction so as to make the inner side of the cavity and the outer side conductive. Portions of the base substrate and the lid substrate in the vicinity of the cavity form bonding regions in which the two substrates are bonded. A notch portion through which the bonding surface of the lid substrate is exposed as seen from the thickness direction of the base substrate is formed on the corner portions of the base substrate.

Piezoelectric vibrator having peripheral notches therein

A piezoelectric vibrator, an oscillator, an electronic device and a ratio timepiece are provided which are capable of increasing a capacitance C0 while achieving miniaturization and cost reduction. The piezoelectric vibrator includes a base substrate, a lid substrate, a piezoelectric vibrating reed on which an excitation electrode is formed, and external electrodes. An electrode pattern for capacitance adjustment, which extends along a routing electrode, is provided extending from a routing electrode.

Piezoelectric vibrator, oscillator, electronic device and radio timepiece

A method for manufacturing a piezoelectric vibrator is provided. The piezoelectric vibrator includes: a package in which a first substrate and a second substrate are superimposed so as to form a cavity therebetween; extraction electrodes which are formed on the first substrate so as to be extracted from the inner side of the cavity to an outer edge of the first substrate; a piezoelectric vibrating reed which is sealed in the cavity and electrically connected to the extraction electrodes at an inner side of the cavity; and outer electrodes which are formed on an outer surface of the package so as to be electrically connected to the extraction electrodes at the outer side of the cavity. The method includes: a bonding film forming step of forming a bonding film on at least one of the first substrate and the second substrate using a low-melting-point glass so as to bond the two substrates; a mounting step of electrically connecting the piezoelectric vibrating reed to the extraction electrodes formed on the first substrate; and a bonding step of superimposing the first substrate and the second substrate onto each other with the bonding film disposed therebetween while heating the bonding film to a predetermined bonding temperature to thereby bond the two substrates by the bonding film.

Piezoelectric vibrator manufacturing method, piezoelectric vibrator, oscillator, electronic device, and radio-controlled timepiece

When a base substrate where through electrodes are formed is anodically bonded to a lid substrate that includes a bonding film formed on the entire lower surface thereof, a method of manufacturing a piezoelectric vibrator includes a superimposing process for superimposing the lid substrate on the base substrate so that a piezoelectric vibrating reed is received in a cavity, after bonding the piezoelectric vibrating reed to the upper surface of the base substrate; a setting process for placing a dummy member, which is made of a material in which ions can be transferred at a bonding temperature, on an electrode plate, and placing the superimposed substrates on the dummy member so that the base substrate faces the dummy member; and an applying process for applying a bonding voltage between the electrode plate and the bonding film after heating the dummy member and the substrates up to the bonding temperature.

Method of manufacturing a piezoelectric vibrator

An anodic bonding method of anodically bonding a base waferand a lid waferincludes:(1) superimposing the base waferand the lid waferonto each other in a direction where a bonding filmfaces a cavity C; (2) subsequent to the superimposition step, pressurizing and holding the base waferand the lid waferin a vacuum state in the superimposition direction; and (3) subsequent to the pressurizing step, partitioning and setting a plurality of intended bonding areas A, A, Aand Ain a concentric form on a contacting surface where the base waferand the lid waferare in contact with each other and applying a DC voltage to each of the plurality of intended bonding areas A, A, Aand A.

Anodic bonding method and piezoelectric vibrator manufacturing method

To provide an improved solderability for mounting an electronic component onto a circuit board, a package of an electronic component () is formed by bonding together a base () made of glass and a lid (). Outer electrodes () and () are formed on a bottom surface of the base (), and the outer electrodes () and () are respectively connected to through electrodes () and (). The outer electrodes () and () each have a laminated structure of three CrAu layers, that is, from a Cr layer (first layer) to an Au layer (sixth layer). When the outer electrodes () and () are soldered onto a circuit board, the Au layers as the second, fourth, and sixth layers are dissolved into solder, whereas the Cr layers as the third and fifth layers, which hardly form an intermetallic compound with solder, are separated to remain in solder.

Electronic component and electronic device

The piezoelectric vibrator includes: a package in which a first substrate and a second substrate are superimposed so as to form a cavity therebetween; outer electrodes which are formed on an outer surface of the first substrate; inner electrodes which are formed on the first substrate so as to be accommodated in the cavity; penetration electrodes which are formed so as to penetrate through the first substrate so that the outer electrodes and the inner electrodes are electrically connected; and a piezoelectric vibrating reed which is sealed in the cavity and electrically connected to the inner electrodes at the inner side of the cavity. The first substrate and the second substrate are bonded by a bonding film that is formed of a low-melting-point glass, and the bonding film is heated to a predetermined bonding temperature when the first substrate and the second substrate are bonded together, and is formed by being heated to a temperature higher than the bonding temperature before the bonding is performed.

An electronic device is provided which includes a base, a through-electrode that passes through the base and from which an insulating material on an end face thereof is removed by polishing, a circuit pattern that is formed on an end face of the through-electrode, an electronic component that is disposed via an internal wiring formed on the circuit pattern, an electrode pattern that is formed on the surface of the base opposite to the surface on which the electronic component is disposed and that is connected to the other end face of the through-electrode, an external electrode that is formed on the electrode pattern, and a cap that is bonded to the base so as to protect the electronic component on the base.

Electronic device, electronic apparatus, and electronic device manufacturing method

There are provided a piezoelectric vibrating reed which can be reliably bonded ultrasonically and which can be efficiently manufactured, a piezoelectric vibrator, a method of manufacturing a piezoelectric vibrator, an oscillator, an electronic apparatus, and a radio-controlled timepiece. A piezoelectric vibrating reed includes: a piezoelectric plate having vibrating portions and a base portion adjacent to the vibrating portions; excitation electrodes formed in the vibrating portions; mount electrodes formed in the base portion; lead-out electrodes for making the excitation electrodes and the mount electrodes electrically connected to each other; and a passivation film which is formed of an electrically insulating material and covers the excitation electrodes and the lead-out electrodes. These electrodes disposed on one surface of the base portion are formed only in a region covered by the passivation film.

Piezoelectric vibrating reed, piezoelectric vibrator, method of manufacturing piezoelectric vibrator, oscillator, electronic apparatus, and radio-controlled timepiece

Providing a package and a method for manufacturing the package capable of achieving improvement in the degree of vacuum in the cavity, and to provide a piezoelectric vibrator, an oscillator, an electronic device, and a radio-controlled timepiece. There is provided a package which includes a plurality of kinds of gettering materialshaving different activation temperatures and which are capable of being activated by heating is disposed in the cavity C.

Package, method for manufacturing the same, piezoelectric vibrator, oscillator, electronic device, and radio-controlled timepiece

In a structure where an electronic component is mounted on a glass base material, an external electrode is provided on an opposite side to the component mounted on the base, and a through electrode and the base are welded to each other at a temperature equal to or higher than a glass softening point, electrical conduction is ensured between the electronic component and the external electrode. An electronic device includes a base, a through electrode which pass through the base and has a metal film formed on both end surfaces after an insulating material on the surface is removed by polishing, an electronic component which is provided on one surface of the through electrode through a connection portion, an external electrode which is provided on an opposite side to a side of the base on which the electronic component is provided, and a cap which protects the electronic component on the base.

Electronic device and method of manufacturing the same

An electronic-parts package includes a base member, a conductive member extending through the base member, the conductive member having the insulating substance on the surface removed by polishing, electronic parts disposed on one surface of the conductive member through a connection portion, an exterior electrode disposed through a metal film on the opposite surface of the surface of the base member on which the electronic parts is disposed, and a cap member that protects the electronic parts on the base member.

Method of manufacturing electronic-parts package

A piezoelectric vibrator which can be manufactured efficiently and a manufacturing method thereof are provided. The piezoelectric vibrator includes: a tuning-fork-type piezoelectric vibrating piece which has a pair of vibration arm portions, excitation electrodes formed on base end portions of the vibration arm portions, and weight metal films formed on distal end portions of the vibration arm portions; and a package which houses the piezoelectric vibrating piece therein. A gettering film on which a laser radiation flaw is formed is formed on intermediate portions between the base end portions and the distal end portions of the vibration arm portions. A first metal film included in the excitation electrode, a second metal film included in the weight metal film and the gettering film are formed using the same material.

Piezoelectric vibrator, manufacturing method of piezoelectric vibrator, oscillator, electronic device, and radio-controlled timepiece

There is provided a piezoelectric vibratorthat includes a base substrate, a lid substrate, a piezoelectric vibrating reed, a pair of external electrodesand, a pair of through electrodesand, and routing electrodesand. The lid substrateincludes a recessfor a cavity and is bonded to the base substrate so that the recess faces the base substrate. The piezoelectric vibrating reedis bonded to the upper surface of the base substrate so as to be received in a cavity that is formed between both the substrates. The pair of external electrodesandis formed on the lower surface of the base substrate. The pair of through electrodesandis formed by hardening paste P, which contains a plurality of metal fine particles and a plurality of metal beads P, so as to pass through the base substrate, maintains airtightness in the cavity, and is electrically connected to the pair of external electrodes, respectively. The routing electrodesandare formed on the upper surface of the base substrate and electrically connect the pair of through electrodes to the piezoelectric vibrating reed. The melting point of the metal bead is higher than the firing temperature of the paste.

Method of manufacturing piezoelectric vibrator, piezoelectric vibrator, oscillator, electronic device, and radio clock

There is provided a piezoelectric vibratorthat includes a base substrate, a lid substrate, a piezoelectric vibrating reed, a pair of external electrodesand, a pair of through electrodesand, and routing electrodesand. The lid substrateincludes a recessfor a cavity and is bonded to the base substrate so that the recess faces the base substrate. The piezoelectric vibrating reedis bonded to the upper surface of the base substrate in a cavity that is formed between both the substrates. The pair of external electrodesandis formed on the lower surface of the base substrate. The pair of through electrodesandis formed so as to pass through the base substrate and is electrically connected to the pair of external electrodes, respectively. The routing electrodesandare formed on the upper surface of the base substrate and electrically connect the pair of through electrodes to the piezoelectric vibrating reed. The through electrodes include electrode filmsandthat are formed on the inner surfaces of the through holesand, and glass bodiesandthat are fixed to the inner surfaces of the through holes with the electrode films interposed therebetween so as to close the through holes.

Growing community of inventors

Chiba, Japan

Kiyoshi Aratake