Matsushita Electric Industrial Co., Ltd.

Dowa Mining Co., Ltd.

Kiyoshi Araki

Kiyoshi Morimoto

Kiyoyuki Morita

Koichiro Yuki

Masayuki Endo

Ichiro Yamashita

Juro Yasui

Fumihiro Sato

Kazuyasu Adachi

Toshiya Kitamura

Makiko Yanagisawa

Yoshihiko Hirai

Ryo Sakamoto

Satoshi Kawata

Masayo Takemoto

Yasuhiko Niitsu

Shigeo Yamamoto

Noriya Ishida

Takashi Onoue

Haruki Horikawa

Masamitsu Kaga

Kayoko Maruta

Masumi Okada

Kenichi Murata

A My Page management server is a server that provides a personal world wide web (WWW) page named My Page for a user who has been registered as a member. The My Page management server includes a product registration unit that acquires information of a product which the user purchased, a link generation unit that generates, on the My Page, a link indicator which is linked to a product questionnaire about the product which the user purchased, based on the acquired information of the product, and a product questionnaire management unit that presents the linked product questionnaire to the user upon receiving a request for the product questionnaire from the user.

Product information management device

A semiconductor device as a nonvolatile memory comprises dot elements which are formed out of the semiconductor or conductor fine particles and function as a floating gate. The dot elements are asymmetrically formed to a control gate and may be formed in a sidewall insulating film formed over the side face of the control gate or a select gate. When inclined or stepped portions having level differences are formed in a semiconductor substrate, the dot elements are formed on a specified portion of the inclined or stepped portions.

Semiconductor device having dot elements as floating gate

A Rat IgG antibody film, formed on a p-type Si substrate, is selectively irradiated with ultraviolet rays, thereby leaving part of the Rat IgG antibody film, except for a region deactivated with the ultraviolet rays. Next, when the p-type Si substrate is immersed in a solution containing Au fine particles that have been combined with a Rat IgG antigen, the Rat IgG antigen is selectively combined with the Rat IgG antibody film. As a result, Au fine particles, combined with the Rat IgG antigen, are fixed on the Rat IgG antibody film. Thereafter, the p-type Si substrate is placed within oxygen plasma for 20 minutes, thereby removing the Rat IgG antibody film, the deactivated Rat IgG antibody film and the Rat IgG antigen. Consequently, dot elements can be formed at desired positions on the p-type Si substrate. If these dot elements are used for the floating gate of a semiconductor memory device, then the device has a structure suitable for miniaturization.

Method for forming dot element

The invention provides a semiconductor device, having a variety of functions such as a bistable memory and a logic circuit, in which a MOS semiconductor element, a resonance tunnel diode, a hot electron transistor and the like are formed on a common substrate. An n-type Si layer and a p-type Si layer surrounded with an isolation oxide film are formed on an SOI substrate. A mask oxide film and a gate oxide film are formed, and the n-type Si layer is subjected to crystal anisotropic etching by using the mask oxide film as a mask, so as to change the n-type Si layer into the shape of a thin Si plate. After first and second tunnel oxide films are formed on side faces of this n-type Si layer, first and second polysilicon electrodes of a resonance tunnel diode and a polysilicon electrode working as a gate electrode of a MOS semiconductor element are formed out of a common polysilicon film. Thus, a Si/SiO,type quantum device can be manufactured with ease at a low cost.

Semiconductor device and method of manufacturing the same

The invention provides a semiconductor device, having a variety of functions such as a bistable memory and a logic circuit, in which a MOS semiconductor element, a resonance tunnel diode, a hot electron transistor and the like are formed on a common substrate. An n-type Si layer and a p-type Si layer surrounded with an isolation oxide film are formed on an SOI substrate. A mask oxide film and a gate oxide film are formed, and the n-type Si layer is subjected to crystal anisotropic etching by using the mask oxide film as a mask, so as to change the n-type Si layer into the shape of a thin Si plate. After first and second tunnel oxide films are formed on side faces of this n-type Si layer, first and second polysilicon electrodes of a resonance tunnel diode and a polysilicon electrode working as a gate electrode of a MOS semiconductor element are formed out of a common polysilicon film. Thus, a Si/SiO.sub.2 type quantum device can be manufactured with ease at a low cost.

MIS SOI semiconductor device with RTD and/or HET

A silicon island portion is formed in a quantum wire so as to be sandwiched between a pair of tunnel barrier portions of a silicon oxide film. On one side of the silicon island portion, a gate electrode for potential control is disposed with a gate insulating film of a silicon oxide film interposed therebetween. On the other side of the silicon island portion, a control electrode for potential control is disposed with an insulating film of a silicon oxide film interposed therebetween. Each of the tunnel barrier portions has a quantum wire constriction structure, which is formed by oxidizing a quantum wire, i.e., a silicon oxide film formed as a field enhanced oxide film with an atomic force microscope or the like, from its surface to a substantially center portion in its section.

Quantum effect device, method of manufacturing the same

Zinc powder comprising particles having part or all of their surfaces coated either with copper and/or indium or with silver is used as a battery material or an active material for the negative electrode in a battery. The powder can be used as an anode active material in a secondary battery to achieve a higher discharge capacity and better cycle characteristics.

Zinc powders for use in batteries and a secondary alkaline zinc battery

A novel primary or secondary battery whose active material for the negative electrode is composed of metallic gallium, gallium alloys or gallium oxide has first come into the world. Gallium has an electrochemical equivalent of 23.24, which is smaller than those of zinc (32.70) and cadmium (56.21). This indicates that when used as an active material for the negative electrode in batteries, gallium has larger capacity per unit mass than zinc and cadmium by respective factors of ca. 1.4 and 2.4. The potential of the reaction; Ga+6OH.sup.- =GaO.sub.3.sup.3- +3H.sub.2 O+3e.sup.- is obviously less noble than the voltage of hydrogen evolution and this means that a high-potential battery can be made. Due to the high hydrogen overvoltage of gallium, gallium ions in the solution can be precipitated as metallic gallium by electrodeposition. As a further advantage, no dendrite formation occurs during the electrodeposition unlike in the case of zinc. The high hydrogen overvoltage also contributes to the production of a battery that undergoes only limited self-discharge. What is more, gallium which has no toxicity presents few environmental problems.

Gallium based active material for the negative electrode, a negative

Two diffraction gratings having the same grate pitch are respectively attached to a semiconductor wafer and a mask to be used in lithography in production of a semiconductor, such that the diffraction gratings are parallel to each other. When first and second frequency lights respectively having different frequencies, are incident, through a light path adjusting system, upon the mask- and wafer-side diffraction gratings in the directions of the first order diffraction angles symmetric with respect to normal-line directions of the diffraction gratings, the frequency lights first orderly diffracted by the diffraction gratings, interfere with each other, thus forming mask- and wafer-side interference lights. An initial phase difference .DELTA..phi.0 between the interference lights, is detected. Then, the light path adjusting system is adjusted to shift the interference lights by the same angle .theta.1 in the same direction, and a later phase difference .DELTA..phi.1 between the interference lights thus shifted, is detected. Based on the relation of .DELTA..phi.1-.DELTA..phi.0=(2.pi.Gtan .theta.1)/(P/2), a mask-wafer gap G is detected with high precision according to the change in phase difference (.DELTA..phi. 1-.DELTA..phi.0). This improves the precision of setting the gap G in a semiconductor production.

Gap control apparatus and method utilizing heterodyne signal phase

An X-ray transmission film 2 of a SiN film is formed on the surface of a mask base 1. Formed on the surface of the X-ray transmission film 2 are an LSI pattern 3, and an alignment mark 4 composed of a convex portion 4a and a concave portion 4b. On the surface of the convex portion 4a is an alignment light reflection grating pattern 5 of a tungsten film. Formed on the surface of the concave portion 4b is a metal film 7 of a tungsten film. With this arrangement, a laser light beam 13 does not reach a semiconductor substrate 30 through the alignment mark 4. Thus, when detecting a first-order reflection diffracted light beam 14 from the alignment mark 4 by means of a photodetector, there is no inclusion of unwanted reflected light beams from the semiconductor substrate 30.

Growing community of inventors

Tokyo, Japan

Kiyoshi Araki