Ngk Insulators, Inc.

Nagaoka University of Technology

Kiyoshi Araki

Tsuneaki Ohashi

Yuji Katsuda

Sadanori Shimura

Katsuhiro Inoue

Takahiro Ishikawa

Masahiro Kida

Masao Nishioka

Takuma Makino

Yuki Bessyo

Keiichiro Watanabe

Masaaki Masuda

Toshihiro Tomita

Yasufumi Aihara

Naoyuki Ogawa

Shuichi Yoshida

Kazuyuki Matsuda

Masaharu Namba

Shuji Himeno

Junko Shibata

Teruaki Takeuchi

There is provided a zeolite membrane which is thinner than a conventional membrane and which has improved permeability and a method for manufacturing the zeolite membrane. The method includes a surface layer forming step for forming a surface layer by attaching a low polar polymer on a first surface of a porous substrate to cover the surface, a filling step for filling a masking polymer into pores in the porous substrate from a surface different from the first surface of the porous substrate up to the surface layer by impregnating the porous substrate with the masking polymer and solidifying the masking polymer, and a surface layer removing step for removing the surface layer. After the surface layer removing step, a zeolite membrane is formed on the first surface of the porous substrate.

Method for manufacturing zeolite membrane, and zeolite membrane

12CaO.7AlOpolycrystal having high conductivity is provided. The conductivity of the 12CaO.7AlOpolycrystal becomes 100 S/cm or more by controlling the nitrogen content in the 12CaO.7AlOpolycrystal within a range of 0.3 to 1.1 wt %, and that the conductivity becomes 150 S/cm or more by controlling the nitrogen content within a range of 0.5 to 0.9 wt %.

Conductive ceramic material and production method thereof

A laminated radiation member includes a radiation plate, an insulation substrate bonded to the upper surface of the radiation plate and an electrode provided on the upper surface of the insulation substrate. The laminated radiation member is made by a method including the steps of surface treating a bonding surface of the radiation plate and/or the insulation substrate, interposing ceramic particles surface treated to assure wettability with a hard solder or a metal between the radiation plate and the insulation substrate, disposing a hard solder above and/or below the ceramic particles, heating the hard solder to a temperature higher than the melting point of the solder, penetrating the molten hard solder into spaces between the ceramic particles to react the ceramic particles with the solder to produce a metal base composite material, and bonding the radiation plate and the insulation substrate with the metal base composite material.

Laminated radiation member, power semiconductor apparatus, and method for producing the same

This invention relates to a corrosion-resistant member having a resistance to plasma of a halogen based corrosive gas, which comprises a main body and a corrosion-resistant layer formed on a surface of the main body and containing a fluoride of at least one element selected from the group consisting of rare earth elements and alkaline earth elements.

Corrosion-resistant member, wafer-supporting member, and method of manufacturing the same

A silicon nitride sintered material includes a polycrystal material having silicon nitride crystal grains and a grain boundary phase. The sintered material contains a Yb element in an amount of 2 to 30% by weight in terms of its oxide and an Al element in an amount of 1 to 20% by weight in terms of its oxide and has a thermal conductivity of 40 W/mK or less at room temperature, a resistivity of 1&times;10 to 1&times;10 &OHgr;&middot;cm at room temperature, and a porosity of 0.5% or less.

Silicon nitride sintered material and process for production thereof

A corrosion-resistant member includes a substrate made of an aluminum-containing ceramic material and an aluminum fluorine containing film which coats at least a part of a surface of the substrate. The aluminum fluorine-containing film, which is formed by directly contacting the substrate with a fluorine-containing compound, has a thickness of 0.01-5.0 &mgr;m. The substrate contains silicon in an amount of not more than 0.5% by weight when calculated as silicon dioxide. Thereby, changes in weight due to corrosion can be decreased and generation of particles can be further controlled upon exposure to a corrosive halogen gas.

Corrosion-resistant member and method of producing the same

A base member made of a metal in which aluminum is included, ceramics in which an aluminum element is included, or a composition member constructed by a metal in which aluminum and ceramics are included, is provided in a container in which a solid fluorine compound such as NaHF is filled. Then, the container is heated at a temperature higher than a decomposition temperature of the solid fluorine compound. After that, the base member is subjected to a heat treatment with the decomposed gas of the solid fluorine compound to form a fluoride layer on a surface of the base member. In this manner, it is possible to obtain an anti-corrosion member which shows a high corrosion property with respect to the corrosion gas of halogen series and its plasma, particularly with respect to chlorine gas and its plasma.

Method of producing anti-corrosion member and anti-corrosion member

A method of producing the silicon nitride sintered body includes the steps of forming a compact of molding materials including silicon nitride powder, a Mg component and a sintering aid, and sintering the molding materials at 1,800 to 2,000&deg; C. under a nitrogen atmosphere. The materials at least include an oxide of Mg in a range of 0.3 to 10 wt. %. A constant temperature is kept for at least 0.5 hours in a temperature range of 1,400 to 1,700&deg; C. before the temperature is increased to the sintering temperature. A silicon nitride body having high thermal conductivity and excellent electrical insulation properties at high temperature can thus be provided.

Silicon nitride sintered body and method of producing the same

A heater comprising a substrate having a heating surface to treat a substance to be heated on the substrate, a heating element embedded in the substrate, and a resistance control part, wherein the substrate comprises a first ceramic material and the resistance control part comprises a second ceramic material which has higher volume resistivity than that of the first ceramics.

Electrically heated substrate with multiple ceramic parts each having different volume resitivities

An aluminum nitride-based sintered body is disclosed, which includes aluminum nitride as a main ingredient and magnesium and has a polycrystalline structure composed of aluminum nitride crystals.

Aluminum nitride-based sintered bodies, corrosion-resistant members, metal-buried articles and semiconductor-holding apparatuses

A heater including a substrate having a heating surface to treat a substance to be heated on the substrate, a heating element embedded in the substrate, and a resistance control part. The substrate includes a first ceramic material and the resistance control part includes a second ceramic material which has higher volume resistivity than that of the first ceramic material.

Electrically heated substrate with multiple ceramic parts each having different volume restivities

A porous composite ceramic sintered body includes an aluminum nitride phase and an aluminum oxynitride phase.

Porous composite ceramic sintered bodies and a production process thereof

Corrosion-resistant member, wafer-supporting member, and method of

A composite PTC material made of cristobalite as a matrix and a conductive filler, having a room temperature resistivity of 10.sup.-1 .OMEGA.cm or less. The conductive filler is at least one substance selected from the group consisting of single metals, metal silicides, metal carbides and metal borides; has a room temperature resistivity of 10.sup.-3 .OMEGA.cm or less when per se made into a sintered material; has particle diameters of 2-50 .mu.m; and is contained in a proportion of 20-35% by volume of the composite PTC material. The composite PTC material has a relative density of 90% or more after firing.

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Nagoya, Japan

Kiyoshi Araki