Murata Manufacturing Co., Ltd.

Kiyoshi Aikawa

Takanori Uejima

Hiromichi Kitajima

Masanari Miura

Takashi Yamada

Kenji Tahara

Seikoh Ono

Yukiya Yamaguchi

Motoji Tsuda

Yuji Takematsu

Dai Nakagawa

Ikuo Tamaru

Takafumi Kusuyama

Kunitoshi Hanaoka

Hiroyuki Nagamori

Yoshihiro Daimon

Hiroki Fujiwara

Mayuka Ono

A radio frequency module includes a module substrate having a first main surface facing a second main surface, and a module substrate having a third main surface facing a fourth main surface. The third main surface faces the second main surface. Multiple electronic components, including a power amplifier, are disposed between the second and third main surfaces on the first main surface, and on the fourth main surface. Multiple external connection terminals are disposed on the third main surface. The power amplifier has a fifth main surface facing a sixth main surface and includes a circuit portion formed nearer to the fifth main surface than the sixth main surface and includes an amplifier transistor. in the power amplifier, the fifth main surface faces the third main surface, and the sixth main surface faces the second main surface. A heat dissipation conductor is joined to the main surface.

Radio frequency module and communication device

A radio frequency module includes a module substrate that has main surfaces that face each other, a module substrate that has main surfaces that face each other. A first main surface faces a second main surface. Multiple electronic components are disposed between the main surfaces, on or along one main surface, and on or along another main surface. Multiple external connection terminals are disposed on or along one main surface and are joined to the module substrate and a motherboard. An absolute value of a difference between a thermal expansion coefficient of the module substrate and a thermal expansion coefficient of the motherboard is smaller than an absolute value of a difference between a thermal expansion coefficient of the module substrate and the thermal expansion coefficient of the motherboard.

A high-frequency module that includes: a module substrate including major surfaces opposite to each other; a module substrate including major surfaces opposite to each other, the major surface being disposed facing the major surface; a first electronic component including a filter coupled to a power amplifier; a second electronic component including a filter coupled to a low-noise amplifier; and a third electronic component including a PA controller which controls the power amplifier. The first electronic component is disposed one of between the major surfaces, on the major surface, and on the major surface. The second electronic component is disposed another one of between the major surface surfaces, on the major surface, and on the major surface. The third electronic component is disposed other one of between the major surfaces, on the major surface, and on the major surface.

High-frequency module

A radio-frequency module includes: plural electronic components that include plural bare SAW devices and that are disposed between a major surface of a module substrate and a major surface of a module substrate, on a major surface of the module substrate, and on a major surface of the module substrate; plural external connection terminals disposed on the major surface; and resin members. The resin member covers the plural SAW devices but does not fill between central regions of the plural bare SAW devices in which the IDT electrodes are disposed and the major surface to which plural bump electrodes are joined. The plural bare SAW devices are disposed on the major surface, and no bare SAW devices are disposed between the major surfaces and on the major surface.

Radio-frequency module and communication device

A radio frequency circuit includes a transmit filter for B66-Tx connected to a power amplifier, a transmit filter for B25-Tx connected to a power amplifier, a switch circuit having terminals, a switch circuit having a common terminal and terminals, and a switch circuit having a common terminal and terminals. The terminal is connected to the common terminal, the terminal is connected to the common terminal, the terminal is connected to the transmit filter, and the terminal is connected to the transmit filter. The switch circuit has a smaller stack number than the switch circuit, and the switch circuit has a smaller stack number than the switch circuit.

Radio frequency circuit and communication device

In a radio-frequency module, a conductive layer covers a major surface opposite to the mounting board side of a resin layer and a major surface opposite to the mounting board side of an electronic component. The electronic component includes an electronic component body and a plurality of outer electrodes. The electronic component body includes an electrical insulating portion and a conductive portion provided inside the electrical insulating portion, forming at least a portion of a circuit element of the electronic component. The electronic component body has a third major surface and a fourth major surface opposite to each other, and an outer side surface. The third major surface forms the major surface of the electronic component, and the third major surface is in contact with the conductive layer. The plurality of outer electrodes are provided on the fourth major surface, but are not extended over the third major surface.

A high-frequency circuit includes: a diplexer that is composed of a filter which has a pass band including a first frequency band group and a filter which has a pass band including a second frequency band group; a notch filter that is connected with the filter and whose stop band is a frequency band which is not included in a first communication band; a notch filter that is connected with the filter and whose stop band is a frequency band which is not included in a second communication band; and switches that are connected with the notch filters. A band pass filter whose pass band is the first communication band and a band pass filter whose pass band is the second communication band are not connected between the filter and the switches.

High-frequency circuit and communication device

A circuit module includes a first wiring substrate having a first main surface and a plurality of first components mounted on the first main surface. The plurality of first components includes a multilayer component formed as a single chip by being sealed using resin members. The multilayer component includes a second wiring substrate having a second main surface and a third main surface that face each other, a second component mounted on the second main surface, and a third component mounted on the third main surface.

Circuit module and communication device

A radio frequency module includes a mount board, an acoustic wave filter, a temperature sensor, and a correction circuit. The mount board has a first principal surface and a second principal surface on opposite sides of the mount board. The acoustic wave filter is disposed on the first principal surface side of the mount board. The temperature sensor is disposed on the second principal surface side of the mount board. The correction circuit corrects a pass band of the acoustic wave filter in accordance with a temperature measured by the temperature sensor.

Radio frequency module and communication apparatus

A radio frequency (RF) module including a module substrate; a filter with a passband including communication band for TDD; a switch connected to the filter; a power amplifier that is arranged on a first surface of the module substrate and connected to the filter via the switch; a low-noise amplifier that is arranged on a second surface of the module substrate and connected to the filter via the switch; a filter with a passband including communication band; a low-noise amplifier that is arranged on the second surface and connected to the filter; and a conductive member arranged between the low-noise amplifiers on the second surface.

A high-frequency circuit includes a first signal path transmitting a high-frequency signal in a first frequency band group, a second signal path transmitting a high-frequency signal in a second frequency band group, a switch including a common terminal and selection terminals, a first low noise amplifier including an input terminal connected to the first signal path and an output terminal connected to a first selection terminal, a second low noise amplifier including an input terminal connected to the second signal path and an output terminal connected to a second selection terminal, and an output-side impedance matching circuit that matches impedance at the output side of the first low noise amplifier or impedance at the output side of the second low noise amplifier with a predetermined impedance with a conductive state between the a third selection terminal and the common terminal.

High-frequency circuit, front end module, and communication apparatus

A front-end module includes a switch, a first filter including an input end connected to a first selection terminal, a second filter including input end connected to a second selection terminal, and an impedance matching circuit connected to a selection terminal, a pass band impedance when viewing the first filter side from a common terminal in a state in which the common terminal and only the first selection terminal are connected is different from a pass band impedance when viewing the second filter side from the common terminal in a state that the common terminal and only the second selection terminal are connected. When the common terminal and the first selection terminal are connected, the common terminal and the selection terminal are connected, and when the common terminal and the second selection terminal are connected, the common terminal and the selection terminal are not connected.

Front-end module and communication device

A directional coupler that has a degree of coupling that is close to constant and is to be used in a predetermined frequency band includes a main line between a first outer electrode and a second outer electrode. A sub-line is provided between a third outer electrode and a fourth outer electrode and is electromagnetically coupled with the main line. A low pass filter is provided between the third outer electrode and the sub-line and has a characteristic in which attenuation increases with increasing frequency in a predetermined frequency band.

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Nagaokakyo, Japan

Kiyoshi Aikawa