Ajinomoto Co., Ltd.

Kiyonori Furuta

Shigeo Nakamura

Hiroyuki Sato

Takashi Ito

Tadahiko Yokota

Masahiko Kurauchi

Shuji Mochizuki

Hiroyasu Koto

Toshihiko Hatajima

Yasuaki Seki

Eiko Nakao

The present invention relates to a vacuum-laminating method for adhesive films where adhesive bleeding is reduced.

Method of vacuum-laminating adhesive film

According to the present invention, there are provided a novel partial ester of a nitrogenous carboxylic acid ester with cellulose, the partial ester being useful as an antibacterial agent, a flame retardant, etc., and a simple and convenient process for preparing the same. Fibers made of said partial ester have washing-resistant antibacterial property and flame retardancy. There can be prepared the partial ester of a nitrogenous carboxylic acid ester with cellulose by contacting a nitrogenous carboxylic acid ester with cellulose and heat-treating the mixture.

Partial ester of cellulose with nitrogenous carboxylic acid and process for producing the same

Herein is disclosed an insulating resin composition for a multilayer printed-wiring board, comprising two or more kinds of resins which are different in etching rate by plasma treatment and which are not compatible with each other, so that the surface of the resulting insulating layer can be made uneven by the plasma treatment, whereby the bonding strength of the conductor layer to the said resulting insulating layer can be ensured, and heat resistance and electrically insulating properties required can be satisfied.

Insulating resin composition for multilayer printed-wiring board

Adhesive films may be vacuum laminated on a circuit substrate by sheeting an adhesive film having the same size as or a smaller size than that of a circuit substrate in a state wherein the surface of a resin composition in the adhesive film is allowed to provisionally partially adhere to one surface or both surfaces of the circuit substrate and disposing a protecting film having an area larger than that of the adhesive film on the adhesive film provisionally adhering to the circuit substrate so that the center of the protecting film is disposed at substantially the same position as that of the center of the adhesive film, followed by vacuum laminating under heating and pressing conditions.

The problems are to provide a prepreg for laminate which can secure a heat resistance, electrical insulation properties and an adhesion strength of a conductor layer, a printed wiring-board which satisfies a high density and which is excellent in a heat resistance and electrical insulation properties upon utilizing the conventional production equipment and method of laminate pressing, and a process for producing the same. A prepreg for laminate characterized in that a paper-like or fabric-like substrate is impregnated with an epoxy resin composition capable of forming a roughened surface through roughening treatment, and a laminate obtained by using the same; a printed wiring-board obtained by using the printed wiring-board and a process for producing the same, which comprises (1) a step of forming a roughened surface by subjecting the surface of the laminate to the roughening treatment, and (2) a step of forming a conductor layer on the roughened surface of the laminate; and a multi-layer printed wiring-board and a process for producing the same, which comprises (1) a step of laminating the prepreg for laminate with an inner layer material such that the prepreg is disposed on the surface, and pressing them to form a laminate, (2) a step of subjecting the surface of the laminate to the roughening treatment to form a roughened surface, and (3) a step of forming a conductor layer on the roughened surface of the laminate.

Prepreg for laminate and process for producing printed wiring-board

A photosensitive resin composition or photosensitive heat-curing resin composition comprising a photocurable oligomer containing 2 or more polymerizable double bonds and a carboxyl group and a heat-curing component selected from a compound containing one polymerizable double bond and one epoxy group, a compound containing one or more polymerizable double bonds and one or more blocked isocyanate groups; a photosensitive resin composition comprising a photocurable oligomer containing a carboxyl group, a blocked isocyanate group and 2 or more polymerizable double bonds; and a novel compound containing one or more polymerizable double bonds and one or more blocked isocyanate groups are disclosed. The resin compositions have high photosensitivity, excellent developability and provide a solder resist pattern with excellent properties.

Growing community of inventors

Kawasaki, Japan

Kiyonori Furuta