Ishihara Sangyo Kaisha, Ltd.

Kiyonobu Ida

Masanori Tomonari

Mitsuru Watanabe

Takuya Hosokawa

The present invention manufactures titanium oxide particles that have a small degree of aggregation (size of aggregate particle diameter relative to primary particle diameter) and are not readily sintered by heating. The present invention has: a step in which an alkali and a solution including a carboxylic acid and a titanium (oxy)chloride are mixed, and the titanium (oxy)chloride is hydrolyzed by neutralization; and a step in which, after the hydrolysis by neutralization, the solution is heated to a temperature of 80° C. or more and 110° C. or less, and the titanium (oxy)chloride remaining in the solution is hydrolyzed by heating. It is thus possible to obtain titanium oxide particles that have a small degree of aggregation and a range of 1-35 for the ratio (D90/BET diameter) between the 90% cumulative mass particle size distribution diameter (D90) (nm) as measured by a dynamic light-scattering particle diameter distribution measurement device and the BET diameter (nm) as calculated from the specific surface area of the titanium oxide particles.

Titanium oxide particles and manufacturing method therefor

The purpose of the present invention is to provide a metallic copper dispersion: capable of maintaining dispersion stability of metallic copper particles for a long period of time; suitable for inkjet printing, spray coating, or the like; and capable of allowing a metallic copper-containing film having an excellent electrical conductivity and metallic color tone to be manufactured in a simple manner by performing low-temperature heating or plasma irradiation after application. The metallic copper dispersion is a dispersion containing at least an organic solvent, a polymer dispersant, and metallic copper particles having gelatin on the particle surface, wherein the metallic copper particles in the dispersion have a cumulative 50% particle size (D50) of 1-130 nm and a cumulative 90% particle size (D90) of 10-300 nm, and the polymer dispersant has an amine number of 10-150 mgKOH/g. The metallic copper dispersion is manufactured by reducing copper oxide in an aqueous solvent in the presence of gelatin, then performing solid-liquid separation, and then mixing the obtained metallic copper particles having gelatin on the particle surface and the polymer dispersant into the organic solvent.

Metallic copper dispersion, method for manufacturing same, and usage for same

A dispersion comprising at least metallic copper particles with gelatin provided on the surface thereof, a polymeric dispersant, and an organic solvent. The dispersion is produced by reducing copper oxide in an aqueous solvent in the presence of gelatin having an amine number and an acid number wherein the difference (amine number&#x2212;acid number) is 0 or less, then subjecting the reaction solution to solid-liquid separation, and then mixing the resultant metallic copper particles with gelatin provided on the surface thereof and a polymeric dispersant having an amine number and an acid number wherein the difference (amine number&#x2212;acid number) is 0 to 50, into an organic solvent. The dispersion maintains dispersion stability of the metallic copper particles for a long time, is suitable for inkjet printing and spray coating and can be used to make microelectrodes and circuit wiring patterns.

Metallic copper dispersion, process for producing the metallic copper dispersion, electrode, wiring pattern, and coating film formed using the metallic copper dispersion, decorative article and antimicrobial article with the coating film formed thereon, and processes for producing the decorative article and the antimicrobial article

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Yokkaichi, Japan

Kiyonobu Ida