Tokyo Electron Limited

Kiyomitsu Yamaguchi

Mitsuhiro Sakai

Fumio Satou

Yoichi Honda

Yoshitaka Matsuda

Takeshi Tsukamoto

Kiyohisa Tateyama

Kimio Motoda

Tetsuya Sada

Norio Uchihira

Satoshi Kaneko

Tomohisa Hoshino

Tetsu Kawasaki

Masato Hamada

Hiroshi Hashimoto

Yuichi Sakai

An electrolytic processing jig configured to perform an electrolytic processing on a processing target substrate by using a processing liquid supplied to the processing target substrate includes a base body having a flat plate shape; and a direct electrode provided on a front surface of the base body and configured to be brought into contact with the processing liquid to apply a voltage between the processing target substrate and the direct electrode. An irregularity pattern is formed on a front surface of the electrolytic processing jig at a processing target substrate side.

Electrolytic processing jig and electrolytic processing method

A heat treating apparatus utilizes a straightening plate provided in its central part with a gas exhaust opening and disposed under a heating plate. A temperature-reducing purge ring is disposed between the face plate and the straightening plate, and is provided in its inner circumference with plural gas jetting holes. A thin gap is formed between the temperature-reducing purge ring and the face plate. When a cooling gas is jetted radially inward through the gas jetting holes, a vacuum is created between the lower surface of the face plate and the upper surface of the temperature-reducing purge ring. Air is sucked into the space between the face plate and the straightening plate and flows together with the cooling gas to rapidly cool the face plate.

Heat-treating apparatus, heat-treating method and storage medium

A method for a cleaning treatment including a step of forming, in a coating mechanism, a coating film on a substrate provided within a cup. The method further includes dissolving, in an edge cleaning mechanism, a portion of the coating film on the substrate using a cleaning liquid, and recovering at least a portion of used cleaning liquid from the edge cleaning mechanism. The recovered cleaning liquid is stored and a level of the stored cleaning liquid is detected. The method also includes supplementing a fresh cleaning liquid to the stored cleaning liquid when a detected level of the stored cleaning liquid is lower than a predetermined level, and using a mixture of the supplemented fresh cleaning liquid and the stored cleaning liquid to clean the cup of the coating mechanism.

Method and apparatus for cleaning treatment

An apparatus for a treatment is provided, the apparatus comprising a vessel for recovering a treatment liquid flowing out or flying out when the object is treated, cleaning means for cleaning an inner wall surface of the vessel by supplying a cleaning liquid into the vessel, and a circulation system for recovering a discharged liquid discharged from the vessel when the inner wall surface of the vessel is cleaned by the cleaning means and supplying the recovered liquid to the cleaning means.

A treatment device comprising a holding method for holding a substrate such as an LCD substrate; and a treatment solution supply method for supplying a treatment solution on a surface of the substrate wherein the holding method has a substrate-placing portion on which the substrate is disposed, the substrate-placing is made of a synthetic resinous material. Since the holding method has a substrate-placing portion which is made of a synthetic resinous material, the electric charge amount of the substrate can be reduced to prevent various static electricity caused troubles such as the electrostatic destruction of the device formed on the substrate. Further, a discharge noise trouble due to discharge phenomenon from the substrate to a transporting method can be prevented. Further, it is possible to reduce the electric charge amount of the holding method and destaticize the holding method by supplying a destaticizing fluid such as ionized pure water or ionized gas towards above or below the holding method. Thus, it is possible to prevent various static-electricity caused troubles such as the electrostatic destruction of the device formed in the device from occurring and further, possible to prevent noise troubles from occurring because the generation degree of the discharge which occurs between the substrate and the transport method can be reduced further. The electric charge amount of the substrate can be reduced by making the thickness (distance) of the substrate-placing portion formed of a dielectric thick (long).

Treatment device

Disclosed is a processing apparatus comprising holding means, support means, process solution supply means, life means, and rotating means. A substrate to be processed is rotatably held by the holding means. An overhanging portion of the substrate extending over an edge of the holding means is supported by the support means to maintain a front surface of the substrate horizontally flat. A process solution is supplied from the process solution supply means onto the front surface of the substrate held by the holding means and supported by the support means. The substrate held by the holding means is vertically moved by the lift means relative to the support means. Further, the substrate moved upward relative to the support means is rotated by the rotating means.

Apparatus and method for supplying process solution to surface of

The invention provides an apparatus for treating a substrate with resist, comprising a spin chuck for horizontally holding a substrate, a first motor for variably rotating the spin chuck, a nozzle for applying resist solution onto the upper surface of the substrate held on the spin chuck, a cup having an upper opening through which the substrate is put in or taken out of the cup and a lower opening through which extends the driving shaft of the spin chuck, the cup positioned to surround the substrate held on the spin chuck to receive liquid centrifugally separated from the substrate which is rotated about its axis, a lid to close the upper opening of the cup to define a space around the substrate, a second motor for variably rotating the cup independently of the spin chuck rotation, a liftable cylinder for relatively moving at least one of the spin chuck and cup, which are positioned apart from each other, toward each other to achieve mutual contact, and an O-ring for hermetically sealing the mutual contact portion between the cup and spin chuck when these cup and spin chuck are brought into mutual contact by the liftable cylinder. When the cup and spin chuck are brought into mutual contact by the liftable cylinder, the lower opening of the cup is closed by the spin chuck to form a hermetic space. The spin chuck and cup are rotated in synchronism by first and second motors while the chamber is kept hermetically closed.

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Kumamoto, Japan

Kiyomitsu Yamaguchi