Murata Manufacturing Co., Ltd.

Kiyomi Sasaki

Yoshihiko Takano

Hiroyuki Ukai

Hidetsugu Hosomi

Mikiya Kobayashi

Akira Imamura

Toshimi Kaneko

Tetsuya Morinaga

Kiyoshi Nakano

Ryuichi Fujinaga

A holder for electroless plating to hold a plurality of ceramic elements for ceramic electronic parts during electroless plating treatment, each surface of said ceramic elements being to be electroless plated, said holder comprising a plurality of cells to house each of said plurality of ceramic elements separately, and each of said cells having such a structure as to permit the flow communication of a plating solution into the cell.

Holder for electroless plating and method of electroless plating

A conductive paste capable of forming an excellent moisture-resistant electrode with a favorable ohmic contact formed between the electrode and the semiconductor element, said conductive paste comprising an aluminum powder and a glass frit containing at least one compound selected from the group consisting of barium borosilicate and calcium borosilicate as the principal component thereof, said glass frit accounting for 5 to 40% by weight with respect to the aluminum powder. Also claimed is a semiconductor ceramic component using the same.

Conductive paste and semiconductor ceramic components using the same

An ohmic electrode material for semiconductor ceramics comprises 48-96 weight % of aluminum and 4-52 weight % of silicon. A semiconductor ceramics element includes a semiconductor ceramics such as that of barium titanate system semiconductor ceramics and on the surface of the semiconductor ceramics is formed an ohmic electrode from the ohmic electrode material.

Ohmic electrode materials for semiconductor ceramics and semiconductor

Chip-type coil

Growing community of inventors

Omihachiman, Japan

Kiyomi Sasaki