Fujitsu Corporation

Other

Fujistu Limited

Kiyokazu Moriizumi

Masayuki Itoh

Shunichi Kikuchi

Manabu Watanabe

Norikazu Ozaki

Kazuaki Satoh

Kiyotaka Seyama

Mikio Nishihara

Misao Umematsu

Katsumi Takada

Naomi Fukunaga

Zhiyi Song

Toshiaki Tanaka

Katsumi Harada

Hajime Kubota

Kiyoshi Wada

Yuji Maeda

Kyoichiro Kawano

Junichi Maruyama

Kazuhiro Nitta

Kazutoshi Hayashi

Hiroshi Kurosawa

Tomokazu Nakashima

Mitsuo Suehiro

Satoshi Osawa

Takao Ishikawa

Kouji Ishikawa

Masako Okazaki

Kouki Takahashi

Yasuo Yatsuda

Takami Sasahara

Enclosed herein is a component retrieve device including a memory, and a processor coupled to the memory and configured to receive information for specifying a retrieval target component, refer to a retrieval history of a retrieving person who has retrieved the retrieval target component, specify components similar to the retrieval target component, and output information of the specified components.

Component retrieve device and component retrieve method

An electronic component includes a wiring substrate having a first surface and a second surface, an electronic component body mounted on a first surface side of the wiring substrate, an external electrode formed on a second surface side of the wiring substrate which is opposite to the first surface side, the external electrode being electrically connected to the electronic component body, a heat generating member having a conductive property and having a higher resistivity than the external electrode, and a heat insulating layer disposed between the electronic component body and the heat generating member, the heat insulating layer having an insulating property and being formed of a material different from an other material of the wiring substrate.

Electronic component assembly apparatus

An electronic component inspection apparatus includes a light source arranged in a mounting area where at least one electronic component is mounted to a board and a light-receiving sensor arranged outside the mounting area to detect an intensity of a light received from the light source. A computer executes a program to perform a process of determining a state of joining parts in the mounting area based on a result of comparison of the intensity of the light received by the light-receiving sensor with an intensity of distribution previously acquired.

Electronic component inspection apparatus and method

Electronic component and electronic component assembly apparatus

A front-and-back electrically conductive substrate includes a plurality of posts composed of a material that can be anisotropically etched and having an electrically conductive portion that has at least a first surface and a second surface that communicate with each other, and an insulative substrate that supports the plurality of posts.

Front-and-back electrically conductive substrate

The present invention provides a low-cost electrolytic capacitor wherein the deformation of the casing due to the thermal expansion during reflowing is prevented. An electrolytic capacitor of a surface mounting type having a capacitor element that consists of a dielectric film and an electrode foil, a metal casing that holds the capacitor element, and an electrolyte solution in which the capacitor element held in the casing is immersed, wherein the casing is equipped with a gas absorbing member that absorbs the gas generated in the casing.

Electrolytic capacitor

Method for making a front and back conductive substrate

A mounted circuit substrate has at least one conductive layer. The side faces of a component mounting pad is formed on a surface of the substrate, and includes at least a columnar pattern made of a metal highly resistant to erosion by solder. The side faces of the component mounting pad are completely covered with an organic insulating layer. Therefore, the component mounting pad can withstand molten solder stresses accompanying component replacement even when component replacement is done many times.

Mounted circuit substrate and method for fabricating the same for surface layer pads that can withstand pad erosion by molten solder applied over a plurality of times

A mounted circuit substrate has at least one conductive layer. The side faces of a component mounting pad is formed on a surface of the substrate, and includes at least a columnar pattern made of a metal highly resistant to erosion by solder The side faces of the component mounting pad are completely covered with an organic insulating layer. Therefore, the component mounting pad can withstand molten solder stresses accompanying component replacement even when component replacement is done many times.

A key switch includes a switch provided on a base, a key top for operating the switch, and a link mechanism supported on the base and supporting the key top on its upper side, a shape of the link mechanism being changed when the key top is depressed. A movable plate is provided on the base, in stacked relationship; such that the movable plate is moved when the key top is depressed so as to change the shape of the link mechanism to a flat shape. An auxiliary link mechanism has a first part supported on the moveable plate and, in turn, by the base and a second part supporting the key top.

Key switch and keyboard

The method comprises forming a plurality of wiring pattern layers on the front surface of a substrate. In the process of forming the wiring pattern layers, an insulator protection film keeps covering over the wiring pattern on the back surface of the substrate. When the formation of the wiring pattern layers has been completed on the front surface of the substrate, a penetrating hole is bored in the cured or hardened insulator protection film. The penetrating hole may be utilized as a conductive via or a conductive through hole. A wiring pattern layer is then formed over the hardened insulator protection film on the back surface of the substrate. It is possible to omit an additional process for removing the insulator protection film. The method contributes to further facilitation of production process and further reduction in production cost.

Method of producing double-sided circuit board

To provide electrical conduction between front and back surfaces of a thin film multi-layered circuit board, such as an MCM, at low cost without using a simultaneous firing process for ceramic. The thin film multi-layered circuit board has at least one thin film circuit layer on a first surface of a substrate, wherein a conductor layer is disposed in the lowermost layer of the thin film circuit layer in contact with the first surface of the substrate, and is characterized in that holes for providing the electrical conduction between front and back surfaces of the substrate are formed through the substrate from the first surface to a second surface thereof so that the conductor layer is exposed in the hole, wherein the diameter of the hole is gradually enlarged from the first surface to the second surface.

High density thin film circuit board and method of production thereof

A dummy pad is formed through a polyimide insulating layer so as to be provided opposite to a via connecting pad formed on the surface of a ceramic substrate. A defect occurring in the via connecting pad is filled with a protrusion when the dummy pad is formed. Accordingly, the influence of the defect upon a layer above the dummy pad is prevented. Further, in a method for manufacturing a thin film wiring board obtained by forming a thin film layer on a base substrate having a via that allows interlayer electric conduction, a void defect existing in the via is filled with a conductive material having corrosion resistance against an etchant, and then the thin film layer is formed on the base substrate.

Thin film wiring board and method for manufacturing the same, base substrate and method for manufacturing the same

A plurality of multi-chip modules are incorporated in a semiconductor device. Each of the multi-chip modules has a plurality of functional parts mounted on a circuit board. A flexible wiring board connects the multi-chip modules to each other. An interface part is mounted on the flexible wiring board so as to control input and output signals of the multi-chip modules.

Semiconductor device having a plurality of multi-chip modules interconnected by a wiring board having an interface LSI chip

A multi-layer wiring substrate includes a main substrate and a plurality of insulating films stacked on the main substrate. The plurality of insulating films have wiring patterns formed on wiring regions thereof and dummy wiring patterns formed on peripheral regions of the wiring regions. The wiring patterns include signal wiring patterns, power supply wiring patterns, and vias. The dummy wiring patterns correspond to the wiring patterns, respectively.

Growing community of inventors

Kawasaki, Japan

Kiyokazu Moriizumi