Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Matsushita Electric Industrial Co., Ltd.

Kiyokazu Itoi

Tetsushi Nishio

Toshiyuki Fukuda

Masanori Minamio

Daisuke Sakurai

Yutaka Harada

Yoshiki Takayama

Tomoko Komatsu

Takeru Tamari

Tetsumasa Maruo

Hu Meng

Hiroto Osaki

Shinya Suzuki

Daisuke Suetsugu

Shozo Ochi

Kouichi Yamauchi

Norimichi Noguchi

Eizou Fujii

Masashi Kuroda

Yutaka Fukai

Kenichi Nishiyama

Nobutoshi Takagi

A semiconductor device includes: a first board that has a first end surface and a second end surface opposite to the first end surface; a second board that is attached to the second end surface of the first board; a plurality of first electrodes that are provided on the first end surface; a second electrode that is provided on the second end surface and electrically coupled to an electrode of the second board; an internal wiring that is provided inside the first board and electrically coupled to the second electrode; a plurality of third electrodes that are provided inside the first board and electrically couple the first electrodes to the internal wiring; and a strain sensor that is provided inside the first board and measures a strain generated in the first board, in which a linear expansion coefficient of each of the third electrodes is larger than a linear expansion coefficient of the first board.

Semiconductor device and methods of manufacturing semiconductor device

A semiconductor element includes a plurality of microlenses provided on a main surface to collect light, a plurality of conductive electrodes provided on a back surface of the main surface, a photoelectric converter to which the light collected by the plurality of microlenses is guided, and a strain sensor provided on the same layer as the photoelectric converter to detect a strain. A solid-state imaging apparatus includes the semiconductor element, a transparent member, an adhesive layer that covers the plurality of microlenses and adheres to the transparent member, and a plurality of external connection electrodes electrically connected to the plurality of conductive electrodes, respectively.

Solid-state imaging apparatus including semiconductor element with photoelectric converter and strain sensors

A gas sensor device includes: a first electrode; a second electrode; a metal oxide layer that is disposed between the first electrode and the second electrode and is in contact with the first electrode and the second electrode; an interlayer insulating film that covers a part of the first electrode, a part of the second electrode, and a part of the metal oxide layer; and a hydrogen permeable film that allows only hydrogen to permeate, a local region that is in contact with the second electrode is provided inside the metal oxide layer, the local region having a higher oxygen deficiency than an oxygen deficiency of the other region in the metal oxide layer, an opening that exposes a gas contact portion which is a part of a main surface of the second electrode is provided in the interlayer insulating film, and the hydrogen permeable film is provided to cover at least the gas contact portion.

Gas sensor device

A solid-state imaging device includes a solid-state imaging element and a substrate fixed to the solid-state imaging element by a sealing resin on a surface on an opposite side of a light receiving surface of the solid-state imaging element, an outer edge of the substrate seen from the light receiving surface side of the solid-state imaging element is positioned within an outer edge of the solid-state imaging element and an outer edge of the sealing resin seen from the light receiving surface side of the solid-state imaging element is positioned within the outer edge of the solid-state imaging element. The sealing resin includes a first sealing resin and a second sealing resin not contacting the first sealing resin to seal the components.

Solid-state imaging device having electronic components mounted between a main substrate and an imaging element

An optical device is equipped with a light receiving regionand a peripheral circuit regionlocated around the light receiving regionon a major surface of an light receiving element; electrodes for external connectionelectrically connected to the peripheral circuit regionformed on a back surface opposite to the major surface of the light receiving element; a transparent membercovering the light receiving regionadhered on the major surface of the light receiving elementwith a light-transmitting adhesive; and a molding resinfor coating side surfaces of the transparent memberand the major surface of the light receiving elementexcluding the region covered with the transparent member

Optical device and method for manufacturing optical device, and camera module and endoscope module equipped with optical device

An optical device includes a semiconductor substrate () on which a light receiving part () (or a light emitting part) and electrodes () are formed, and a translucent plate () bonded on the light receiving part () with a translucent adhesive (), the semiconductor substrate () having a plurality of convex portions () formed so as to separate the light receiving part () and the electrodes () and have proper gaps () therebetween.

Optical device and method of manufacturing the same

A semiconductor image sensing element has a semiconductor element including an image sensing area, a peripheral circuit region, a plurality of electrode portions provided in the peripheral circuit region, and a plurality of micro-lenses provided on the image sensing area and an optical member having a configuration covering at least the image sensing area and bonded over the micro-lenses via a transparent bonding member. The side surface region of the optical member is formed with a light shielding film for preventing the irradiation of the image sensing area with a reflected light beam or a scattered light beam from the side surface region.

Semiconductor image sensing element and fabrication method therefor, and semiconductor image sensing device and fabrication method therefor

An optical device includes a substrate, a plurality of optical elements formed in an element formation region of the substrate, a plurality of lenses formed over the element formation region so as to correspond to the plurality of optical elements, and a protective layer formed so as to cover the plurality of lenses. A holding member is formed on the protective layer in a region outside the element formation region. The holding member holds a bottom surface of a transparent member. A gap between the protective layer and the transparent member is filled with an adhesive.

Optical device and manufacturing method thereof

A semiconductor device including a package () having a plurality of wall portions () and a plurality of conductor portions (), a semiconductor element such as a solid-state image pickup device () mounted in an internal space of the base, thin metal wires () electrically connecting the semiconductor element and the conductor portions () between the wall portions (), a resin sealing material () implanted in the spaces between the wall portions (), and a closing member such as a cover glass (). The region for connecting the thin metal wires () and the wall portion () region overlap each other, so that the device can be reduced in size and in height. The cover glass () can not move easily from the correct position because the wall portions () serve as supporting columns, thereby improving the yield.

Semiconductor device and method of manufacturing the same

A solid-state imaging device includes a housing having a resin-molded base and ribs; metal lead pieces embedded in the housing, the metal lead pieces each having an inner terminal portion facing an inner space of the housing, an outer terminal portion exposed at a bottom surface of the housing, and a lateral electrode portion exposed at an outer lateral surface of the housing; an imaging element fixed on the base in the inner space; connecting members connecting electrodes of the imaging element respectively to the inner terminal portions; and a transparent plate fixed to an upper surface of the ribs. The die pad having a through hole is embedded in a center portion of the base so that the die pad's upper and lower surfaces are exposed, and the imaging element is fixed on the die pad. A ventilation hole to the inner space of the housing that is formed in one piece with a resin can be formed easily with a simple configuration.

Solid-state imaging device and method for manufacturing the same

An optical device comprises a copper plate having an opening; a flexible board placed below the copper plate; a light receiving element substrate placed below the copper plate and mounted on a wiring pattern of the flexible board via bumps; a light emitting element and a light receiving element both provided at the principal surface of the light receiving element substrate; and a supporting frame supporting the flexile board in a downwardly posture. The supporting frame fixes the flexible board and the copper plate. Therefore, a thin optical device can be realized without employing a resin mold structure.

Growing community of inventors

Osaka, Japan

Kiyokazu Itoi