Mitsubishi Denki Kabushiki Kaisha

Kiyoji Imanaka

Kiyoshi Ishibashi

Yutaka Morita

Kunio Kobayashi

Hidekazu Iwasaki

Isamu Yamamoto

Masahiro Yamane

Jiro Takamura

Katsuji Kawaguchi

Kunihiro Shigetomo

Toshimi Watanabe

Keiji Itoga

Ryouji Nishihashi

A method of manufacturing semiconductor devices includes accommodating the semiconductor devices in the form of semimanufactures in accomodating tools having uniform outer dimensions regardless of the type of the semiconductor devices; receiving the semiconductor devices in the form of semimanufactures in each of a plurality of processing devices while maintaining the semiconductor devices in the accomodating tools; and processing the semiconductor devices in the form of semimanufactures in each of a plurality of processing devices.

Process of raising a semiconductor device out of a pallet using a

A testing apparatus includes a turntable, a driving device for rotating the turntable by a predetermined angle, and a plurality of pallets symmetrically fixed on the turntable around a center of rotation of the turntable. Each pallet holds a plurality of semiconductor devices and has electrode patterns for connection to leads of the semiconductor devices. A tester for testing the semiconductor devices is electrically connected with the electrode patterns of one of the pallets located at a first position in the rotation of the turntable by a connecting device. An exchanging device exchanges the semiconductor devices for new ones on one of the pallets located at a second position in the rotation of the turntable. A cover covers the turntable except around the second position. A heating device heats the inside of the cover to maintain the semiconductor devices held on the pallets in the cover at a high temperature.

Testing apparatus for semiconductor devices

The present invention provides a plastic encapsulated semiconductor device which comprises a connected metal plate having a plurality of semiconductor element holding parts which are connected in series in one direction with at least two connecting arms, said connecting arms having sectional area smaller than that of said semiconductor element holding part and being disposed inside of the side surface of said semiconductor element holding parts in the connecting direction. The invention provides a method of preparing semiconductor devices having relatively large current capacity of about 5 to 50 amperes used as diodes for automobiles and having high quality in the mass production.

Method of making plastic encapsulated semiconductor devices

Growing community of inventors

Itami, Japan

Kiyoji Imanaka