Nippon Kayaku Kabushiki Kaisha

Kiyohisa Tokuda

Kazuhiko Ishii

Go Mizutani

Kenji Yoshida

Daisuke Kobayashi

Minoru Yokoshima

Masahiro Naito

Masahiro Naitou

Kikuo Imazumi

Hideaki Kametani

Disclosed is an ultraviolet-curable resin composition for multilayer optical discs, which contains (A) dioxane glycol di(meth)acrylate and/or tricyclodecane dimethylol di(meth)acrylate, and (B) a photopolymerization initiator.

Ultraviolet-curable resin composition and use thereof

Disclosed is an ultraviolet-curable resin composition containing a polyurethane compound (A), a photopolymerization initiator (B), and an ethylenically unsaturated compound (C) other than the compound (A). The polyurethane compound (A) is obtained by reacting an epoxycarboxylate compound (c), which is obtained by reacting an epoxy compound (a) having two or more epoxy groups in a molecule with a monocarboxylic acid compound (b) having an ethylenically unsaturated group in a molecule, with a diisocyanate compound (d).

Resin composition for optical disk and cured product thereof

The present invention provides an adhesive that can provide an excellent durability (reliability) to a bonded optical disk having a translucent reflection film comprising silicone, silver or a silver alloy. The adhesive of the present invention contains a (meth)acrylate monomer (A) having a solution resistance of 1.0&#xd7;10&#x3a9;&#xb7;cm or more.

Adhesive for optical disk and optical disk

An ultraviolet-curable adhesive composition comprising a photopolymerization initiator whose molar absorption coefficient at a wavelength of 360-450 nm is at least 400 and an ultraviolet-curable compound. The adhesive composition of this invention can bond substrates which show transmittances of 0.01-20% to all of energy beams of a wavelength of 280-380 nm, to one another.

Ultraviolet-curable adhesive composition

An ultraviolet-curable adhesive composition comprising a photopolymerization initiator whose molar absorption coefficient at a wavelength of 360-450 nm is at least 400 and an ultraviolet-curable compound. The adhesive composition of this invention can bond substrates which show transmittances of 0.01-20% to all of energy beams of a wavelength of 280-380 nm, to one another such as base boards for an optical disk.

Ultraviolet-curable adhesive composition for bonding opaque substrates

The present invention aims to develop a photosensitive resin composition which exhibits a rapid ink absorption rate, which has an excellent water resistance, and which is appropriate for providing an ink receiving layer forming a sharp ink dot shape and having an excellent color formability of ink. A photosensitive resin composition forming an excellent ink receiving layer is obtained by incorporating at least one selected from an ethylenically unsaturated group-containing compound having quaternary nitrogen and a grain flour (filler) such as a wheat flour or the like in a photosensitive resin composition containing a quaternary nitrogen-free ethylenically unsaturated group-containing compound, a photopolymerization initiator etc.

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Tokyo, Japan

Kiyohisa Tokuda