Sony Corporation

Sony Semiconductor Solutions Corporation

Kiyohisa Tanaka

Yuji Takaoka

Hirokazu Seki

Yuta Momiuchi

Hirokazu Nakayama

Eiichirou Kishida

Miyoshi Togawa

Emi Nishioka

Naoki Yamashita

The present technology relates to a camera module, a production method, and an electronic device that can prevent reduction of optical module positioning accuracy or heat dissipation performance. An image pickup element is joined on one face of a flexible board so that a light receiving surface of the image pickup element is exposed through an opening of the flexible board, and an optical module is joined on an other face of the flexible board. A reinforcing member is joined on the one face of the flexible board at a circumference of the image pickup element and reinforces a joining part of the flexible board where the optical module is joined. The reinforcing member is joined so as to face an area including at least a part of the joining part and is formed so that a part of the circumference of the image pickup element is kept open.

Camera module, production method, and electronic device

The present technology relates to a semiconductor device including: a solid-state image sensor having a pixel array unit in which a plurality of pixels each having a photoelectric conversion element is two-dimensionally arranged in a matrix; and a flexible printed circuit having wiring adapted to connect a pad portion provided on an upper surface side to be located on a light receiving surface side of the solid-state image sensor to an external terminal provided on a lower surface side opposite to the upper surface side, in which the flexible printed circuit is arranged along respective surfaces of the solid-state image sensor such that a position of an end portion located on the upper surface side becomes a position different from a position in a space above the light receiving surface.

Image sensor package with flexible printed circuits

The present technology relates to an imaging element package and a camera module capable of improving reliability. An imaging element package includes a flexible substrate, an imaging element connected to a first surface of the flexible substrate, and a member, bonded to a second surface of the flexible substrate opposite to the first surface with an adhesive, having a linear expansion coefficient different from the flexible substrate, in which in a portion of the adhesive, a slit is formed which intersects with a direction from the imaging element toward an end of the flexible substrate as viewed from a direction perpendicular to the flexible substrate. The present technology is applied to a camera module.

Imaging element package and camera module having a slit formed in an adhesive connecting a flexible substrate and another member to address differences in linear expansion coefficients

The present technology relates to a semiconductor device and a method of manufacturing the same, a semiconductor module, and an electronic device capable of more certainly improving an optical characteristic and chromatic aberration. A semiconductor package provided with a pedestal having a cylindrical shape including a curved surface curved so as to be concave to a light incident side, and a linear image sensor on which a plurality of pixels each including a photoelectric conversion element is arranged in a one-dimensional direction, the linear image sensor fixed on the curved surface on which a light-receiving area formed of a plurality of pixels is curved so as to be concave to the light incident side is provided. The present technology may be applied to the semiconductor package used in an image reading device, for example.

Semiconductor device and method of manufacturing the same, semiconductor module, and electronic device

A substantially semicylindrical lens having a lensing function, a shading-correcting (reducing) function, and a predetermined-wavelength transmitting function is formed on the upper surface of a device chip including a sensor array, a CCD transfer register, a read-out gate, and the like. The substantially semicylindrical lens is semicircular in cross section along a second direction, and has a lens surface curved in a first direction so that its diameter is larger at both ends in the first direction than in the center in order to serve a function of correcting the shading caused by the optical conditions outside the device. The substantially semicylindrical lens is partially or entirely made of a substance that is transmissive with respect to a signal having a predetermined wavelength.

Growing community of inventors

Kanagawa, Japan

Kiyohisa Tanaka