Sharp Kabushiki Kaisha Corporation

Kiyohisa Ohta

Toshio Hata

Masahiro Konishi

Masaki Kondo

Takanobu Matsuo

Takaaki Horio

Kazuaki Sasaki

Hiroshi Nakatsu

Junichi Nakamura

Nobuyuki Takahashi

Kenichi Ukai

Masashi Takemoto

A light-emitting apparatus of the present invention has (i) a semiconductor device which emits light toward a higher position than a substrate and (ii) a plurality of external connection terminals, and includes: a light-reflecting layer, provided on the substrate, which reflects the light emitted by the semiconductor device; and a covering layer which covers at least the light-reflecting layer and which transmits the light reflected by the light-reflecting layer. Further, the semiconductor device is provided on the covering layer, and is electrically connected to the external connection terminals via connecting portions, and the semiconductor device and the connecting portions are sealed with a sealing resin so as to be covered. Therefore, the light-emitting apparatus has increased efficiency with which light is taken out, and can prevent a reflecting layer from being altered, deteriorating, and decreasing in reflectance.

Light-emitting apparatus

Light-emitting apparatus, surface light source, and method for manufacturing package for light-emitting apparatus

An LED light bulb includes a light source unit. The light source unit includes an LED light emitting element for emitting light and a reflecting plate on which a part of the light emitted from the LED light emitting element is incident. The reflecting plate changes a direction of the part of the light so that the direction of the part of the light is inclined from a direction of an optical axis of the light emitted from the LED light emitting element toward a plane vertical to the direction of the optical axis.

Illumination device

A backlight device () includes: an LED package () including an LED chip (A) and an Ag reflective layer (B); and an optical member (for example, a prism sheet ()) for adjusting light emitted from the LED package (). The optical member () adjusts an amount of a halogen thus contained and the like so that emission of halogen is decreased to a degree in which no silver halide is generated on the Ag reflective layer (B).

Backlight device, liquid crystal display device and illuminating device

A semiconductor light emitting element of a monolithic structure, including: a first-conductivity-type semiconductor substrate; an active layer formed on the first-conductivity-type semiconductor substrate; a second-conductivity-type clad layer formed on the active layer; and a current diffusion layer formed on the second-conductivity-type clad layer, wherein the active layer is of a first conductivity type.

Semiconductor light emitting element

Growing community of inventors

Osaka, Japan

Kiyohisa Ohta